JP6700402B2 - 指紋認証用センサモジュールおよび指紋認証装置 - Google Patents
指紋認証用センサモジュールおよび指紋認証装置 Download PDFInfo
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- JP6700402B2 JP6700402B2 JP2018534890A JP2018534890A JP6700402B2 JP 6700402 B2 JP6700402 B2 JP 6700402B2 JP 2018534890 A JP2018534890 A JP 2018534890A JP 2018534890 A JP2018534890 A JP 2018534890A JP 6700402 B2 JP6700402 B2 JP 6700402B2
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- 239000011521 glass Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000003491 array Methods 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 claims description 5
- 239000006059 cover glass Substances 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 9
- 230000000903 blocking effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- 238000005286 illumination Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/117—Identification of persons
- A61B5/1171—Identification of persons based on the shapes or appearances of their bodies or parts thereof
- A61B5/1172—Identification of persons based on the shapes or appearances of their bodies or parts thereof using fingerprinting
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T1/00—General purpose image data processing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/141—Control of illumination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
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- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Biophysics (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
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Description
LED25の光軸を制御して、指紋に対して投光方向を制御することができる。例えば、指紋を挟む両側のLEDのみ(図2において、上下方向に配列された一対のLED25、または、左右方向に配列された一対のLED25)を点灯させ、斜め方向から指紋に光を当てることにより、立体感のある画像を作ることができる。その結果、指紋の隆線や汗腺を撮影できるため、指紋認証精度を高めることができる。
さらに、指紋の立体感のある画像を得るために、複数のLEDの内の所望の位置にあるもののみを選択的に発光させてもよい。
なお、ここでは、マイクロレンズへ入射する光を制限するために、その周囲に遮光フィルムと遮光ダムを個別に設ける例について説明したが、これに限らず、遮光ダムの開口寸法(図3に示した遮光ダム17の内壁面17a)の上端と、マイクロレンズの外周寸法の下端とを有する漏斗状の遮光ダムを形成してもよい。
このように、マイクロレンズ等を印刷で形成することによって、コストダウンや製造精度の向上をはかることができる。
Claims (6)
- 指紋からの光を結像する結像部と、
結像部の下に設けられた第1のガラス部および第1のガラス部の下に設けられたイメージセンサとを含む検出モジュールと、
前記結像部は、複数のマイクロレンズアレイと、
前記複数のマイクロレンズアレイの周囲に設けられ、前記複数のマイクロレンズアレイに入射する光を制限するための遮光部と、を含み、
前記遮光部は、前記マイクロレンズの周囲に設けられた段部を有する遮光ダムを含み、前記段部は、前記マイクロレンズの上方から、前記マイクロレンズの周囲を囲むように設けられる、指紋認証用センサモジュール。 - 前記遮光部は、前記マイクロレンズの周囲に設けられた遮光フィルムを含む、請求項1に記載の指紋認証用センサモジュール。
- 指紋を照明する照明装置を含み、
前記照明装置は、複数の光源を有し、
前記複数の光源の各々は個別に点灯、消灯、および調光が可能である、請求項1または2に記載の指紋認証用センサモジュール。 - 前記検出モジュールを位置決めするホルダー基板をさらに含み、
前記ホルダー基板は、前記照明装置を保持する、請求項3に記載の指紋認証用センサモジュール。 - 前記検出モジュールを保持する周壁を含み、
前記周壁は、前記照明装置を保持する、請求項3に記載の指紋認証用センサモジュール。 - 請求項1〜5のいずれかに記載の指紋認証用センサモジュールを含む指紋認証装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/031898 WO2019049193A1 (ja) | 2017-09-05 | 2017-09-05 | 指紋認証用センサモジュールおよび指紋認証装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019049193A1 JPWO2019049193A1 (ja) | 2019-11-07 |
JP6700402B2 true JP6700402B2 (ja) | 2020-05-27 |
Family
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JP2018534890A Expired - Fee Related JP6700402B2 (ja) | 2017-09-05 | 2017-09-05 | 指紋認証用センサモジュールおよび指紋認証装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11068684B2 (ja) |
JP (1) | JP6700402B2 (ja) |
KR (1) | KR20200050970A (ja) |
CN (1) | CN212160750U (ja) |
WO (1) | WO2019049193A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102448682B1 (ko) * | 2017-09-25 | 2022-09-29 | 삼성전자주식회사 | 지문인식 패키지 및 그 제조방법 |
CN108171858A (zh) * | 2018-02-13 | 2018-06-15 | 南京东屋电气有限公司 | 一种带有分离式红外图像采集装置的汽车门锁 |
US20220230011A1 (en) * | 2021-01-15 | 2022-07-21 | Omnivision Technologies, Inc. | Thin, multi-lens, optical fingerprint sensor adapted to image through cell phone displays |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10149446A (ja) | 1996-11-20 | 1998-06-02 | Mitsubishi Electric Corp | 指紋照合装置、指紋照合システム及び指紋照合方法 |
JP2003006627A (ja) * | 2001-06-18 | 2003-01-10 | Nec Corp | 指紋入力装置 |
US20060155178A1 (en) * | 2004-03-26 | 2006-07-13 | Vadim Backman | Multi-dimensional elastic light scattering |
KR101433882B1 (ko) * | 2005-09-01 | 2014-09-22 | 루미다임 인크. | 생체계측 센서 |
WO2008004314A1 (fr) * | 2006-07-06 | 2008-01-10 | Hitachi, Ltd. | Système d'authentification personnelle |
JP4935637B2 (ja) * | 2006-12-04 | 2012-05-23 | ソニー株式会社 | 生体撮像装置および生体撮像方法 |
JP5312774B2 (ja) | 2006-12-15 | 2013-10-09 | 日立オートモティブシステムズ株式会社 | 薄型認証センサ |
JP4640415B2 (ja) * | 2008-01-18 | 2011-03-02 | ソニー株式会社 | 生体認証装置 |
JP5024153B2 (ja) | 2008-03-27 | 2012-09-12 | ソニー株式会社 | 生体撮像装置 |
JP2010035560A (ja) | 2008-07-31 | 2010-02-18 | Hitachi Ltd | 生体認証装置 |
JP3147824U (ja) | 2008-11-04 | 2009-01-22 | 重記 宮尾 | 湿布体の貼付器 |
JP5935498B2 (ja) | 2012-05-15 | 2016-06-15 | ソニー株式会社 | 情報処理装置、情報処理方法、プログラム及び情報処理システム |
CN203838722U (zh) | 2014-04-04 | 2014-09-17 | 深圳印象认知技术有限公司 | 液晶终端设备及指纹采集器 |
CN107437047A (zh) * | 2016-05-25 | 2017-12-05 | 深圳印象认知技术有限公司 | 感光像元、图像采集器、指纹采集设备及显示设备 |
US20180012069A1 (en) * | 2016-07-06 | 2018-01-11 | Samsung Electronics Co., Ltd. | Fingerprint sensor, fingerprint sensor package, and fingerprint sensing system using light sources of display panel |
KR20180034750A (ko) * | 2016-09-26 | 2018-04-05 | 삼성디스플레이 주식회사 | 표시장치 및 그의 구동방법 |
KR102350605B1 (ko) * | 2017-04-17 | 2022-01-14 | 삼성전자주식회사 | 이미지 센서 |
US20180349669A1 (en) * | 2017-06-02 | 2018-12-06 | Samsung Electronics Co., Ltd. | Operating method of optical fingerprint sensor, operating method of electronic device including the optical fingerprint sensor, and display device including the optical fingerprint sensor |
US10331939B2 (en) * | 2017-07-06 | 2019-06-25 | Shenzhen GOODIX Technology Co., Ltd. | Multi-layer optical designs of under-screen optical sensor module having spaced optical collimator array and optical sensor array for on-screen fingerprint sensing |
US10643051B2 (en) * | 2017-07-13 | 2020-05-05 | Samsung Electronics Co., Ltd. | Optics-based fingerprint sensor, electric device including optics-based fingerprint sensor, and operation method of electric device |
US10474867B2 (en) * | 2017-09-28 | 2019-11-12 | Apple Inc. | Electronic device including mask collimation and related methods |
US10509940B2 (en) * | 2017-09-28 | 2019-12-17 | Apple Inc. | Electronic device including sequential operation of light source subsets while acquiring biometric image data and related methods |
US11210491B2 (en) * | 2019-05-30 | 2021-12-28 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint sensor under a display module with tilted receiving optics |
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2017
- 2017-09-05 CN CN201790001732.XU patent/CN212160750U/zh active Active
- 2017-09-05 KR KR1020207006493A patent/KR20200050970A/ko active IP Right Grant
- 2017-09-05 WO PCT/JP2017/031898 patent/WO2019049193A1/ja active Application Filing
- 2017-09-05 US US16/644,112 patent/US11068684B2/en active Active
- 2017-09-05 JP JP2018534890A patent/JP6700402B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US11068684B2 (en) | 2021-07-20 |
WO2019049193A1 (ja) | 2019-03-14 |
KR20200050970A (ko) | 2020-05-12 |
US20210064843A1 (en) | 2021-03-04 |
JPWO2019049193A1 (ja) | 2019-11-07 |
CN212160750U (zh) | 2020-12-15 |
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