JP6698524B2 - 硬化体、電子部品、表示素子、及び、光湿気硬化型樹脂組成物 - Google Patents

硬化体、電子部品、表示素子、及び、光湿気硬化型樹脂組成物 Download PDF

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JP6698524B2
JP6698524B2 JP2016526962A JP2016526962A JP6698524B2 JP 6698524 B2 JP6698524 B2 JP 6698524B2 JP 2016526962 A JP2016526962 A JP 2016526962A JP 2016526962 A JP2016526962 A JP 2016526962A JP 6698524 B2 JP6698524 B2 JP 6698524B2
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moisture
meth
curable resin
resin composition
light
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JPWO2016167305A1 (ja
Inventor
高橋　徹
徹 高橋
彰 結城
彰 結城
拓身 木田
拓身 木田
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/302—Water
    • C08G18/307—Atmospheric humidity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
  • Polymerisation Methods In General (AREA)
JP2016526962A 2015-04-17 2016-04-14 硬化体、電子部品、表示素子、及び、光湿気硬化型樹脂組成物 Active JP6698524B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015085158 2015-04-17
JP2015085158 2015-04-17
PCT/JP2016/061958 WO2016167305A1 (fr) 2015-04-17 2016-04-14 Corps durci, composant électronique, élément d'affichage, et composition de résine durcissable à la lumière/l'humidité

Related Child Applications (1)

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JP2020079262A Division JP2020111764A (ja) 2015-04-17 2020-04-28 硬化体、電子部品、表示素子、及び、光湿気硬化型樹脂組成物

Publications (2)

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JPWO2016167305A1 JPWO2016167305A1 (ja) 2018-02-15
JP6698524B2 true JP6698524B2 (ja) 2020-05-27

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JP2016526962A Active JP6698524B2 (ja) 2015-04-17 2016-04-14 硬化体、電子部品、表示素子、及び、光湿気硬化型樹脂組成物
JP2020079262A Pending JP2020111764A (ja) 2015-04-17 2020-04-28 硬化体、電子部品、表示素子、及び、光湿気硬化型樹脂組成物

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JP2020079262A Pending JP2020111764A (ja) 2015-04-17 2020-04-28 硬化体、電子部品、表示素子、及び、光湿気硬化型樹脂組成物

Country Status (5)

Country Link
JP (2) JP6698524B2 (fr)
KR (1) KR102260532B1 (fr)
CN (1) CN107108772A (fr)
TW (1) TWI701310B (fr)
WO (1) WO2016167305A1 (fr)

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Publication number Priority date Publication date Assignee Title
JP6804310B2 (ja) * 2016-03-07 2020-12-23 日東電工株式会社 光学用粘着シート、粘着剤層付偏光フィルム、および液晶表示装置
JP6905377B2 (ja) * 2017-03-31 2021-07-21 シチズンファインデバイス株式会社 画像表示装置及びその製造方法
WO2019203277A1 (fr) * 2018-04-19 2019-10-24 積水化学工業株式会社 Composition de résine durcissable, article durci, pièce électronique et pièce d'assemblage
KR20220016023A (ko) * 2019-05-30 2022-02-08 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 경화체, 및 전자 부품
JPWO2022004416A1 (fr) * 2020-06-29 2022-01-06
CN116568760A (zh) * 2020-11-30 2023-08-08 积水化学工业株式会社 湿气固化性树脂组合物及电子设备用粘接剂
KR102574109B1 (ko) * 2022-10-18 2023-09-06 (주)중앙종합안전기술연구원 구조물 안전 점검 및 진단용 균열 폭 측정기

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DE19800676A1 (de) * 1998-01-10 1999-07-15 Henkel Kgaa Verwendung ausgewählter Klebstoffgemische für die Überlappungsverklebung von Rundumetiketten bei ihrem Auftrag auf Kunststoff-Flaschen
JP2000178342A (ja) 1998-12-17 2000-06-27 Sumitomo Bakelite Co Ltd 絶縁ペースト
US6828355B1 (en) 1999-07-19 2004-12-07 Henkel Corporation Resin-reinforced UV, moisture and UV/moisture dual curable silicone compositions
JP2001064543A (ja) * 1999-08-27 2001-03-13 Nippon Shokubai Co Ltd 硬化型被覆材用樹脂組成物
JP2001220569A (ja) * 2000-02-09 2001-08-14 Sekisui Chem Co Ltd 反応性接着剤組成物
JP2001240811A (ja) * 2000-03-01 2001-09-04 Sekisui Chem Co Ltd 反応性接着剤組成物及び部材の接合方法
JP2004047415A (ja) * 2002-05-24 2004-02-12 Sekisui Chem Co Ltd フレキシブルフラットケーブル、接着剤及びその接合体
JP2004018621A (ja) * 2002-06-14 2004-01-22 Nippon Shokubai Co Ltd ラジカル硬化性ウレタン樹脂組成物
US7189781B2 (en) * 2003-03-13 2007-03-13 H.B. Fuller Licensing & Finance Inc. Moisture curable, radiation curable sealant composition
JP5013585B2 (ja) 2006-09-06 2012-08-29 日立化成ポリマー株式会社 反応性ホットメルト接着剤組成物及びそれを用いた接着方法
JP5228370B2 (ja) 2007-04-27 2013-07-03 東亞合成株式会社 一液湿気硬化型ウレタン系ホットメルト接着剤組成物及びその使用方法
JP4329046B1 (ja) * 2008-02-27 2009-09-09 Ｄｉｃ株式会社 透湿フィルム、その製造方法及びそれを用いた積層体
JP5488386B2 (ja) * 2010-10-14 2014-05-14 Ｄｉｃ株式会社 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン
US20140242322A1 (en) * 2011-07-22 2014-08-28 H.B. Fuller Company One component, dual-cure adhesive for use in electronics
KR102320903B1 (ko) * 2014-05-13 2021-11-02 세키스이가가쿠 고교가부시키가이샤 광습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
CN104031598A (zh) * 2014-06-30 2014-09-10 江苏华程光电科技有限公司 高导热性led密封胶
JP6510790B2 (ja) * 2014-10-03 2019-05-08 積水化学工業株式会社 光湿気硬化型樹脂組成物

Also Published As

Publication number Publication date
TWI701310B (zh) 2020-08-11
TW201704394A (zh) 2017-02-01
WO2016167305A1 (fr) 2016-10-20
CN107108772A (zh) 2017-08-29
JPWO2016167305A1 (ja) 2018-02-15
KR102260532B1 (ko) 2021-06-03
JP2020111764A (ja) 2020-07-27
KR20170137691A (ko) 2017-12-13

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