JP6694311B2 - プリント配線基板 - Google Patents
プリント配線基板 Download PDFInfo
- Publication number
- JP6694311B2 JP6694311B2 JP2016071036A JP2016071036A JP6694311B2 JP 6694311 B2 JP6694311 B2 JP 6694311B2 JP 2016071036 A JP2016071036 A JP 2016071036A JP 2016071036 A JP2016071036 A JP 2016071036A JP 6694311 B2 JP6694311 B2 JP 6694311B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- conductor
- terminal
- pad
- mounting area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004020 conductor Substances 0.000 claims description 127
- 239000000758 substrate Substances 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 description 22
- 239000010410 layer Substances 0.000 description 15
- 238000005476 soldering Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016071036A JP6694311B2 (ja) | 2016-03-31 | 2016-03-31 | プリント配線基板 |
KR1020187027709A KR102138992B1 (ko) | 2016-03-31 | 2017-01-16 | 프린트 배선 기판 |
CN201780020575.1A CN108886875B (zh) | 2016-03-31 | 2017-01-16 | 印刷配线基板 |
PCT/JP2017/001212 WO2017168952A1 (ja) | 2016-03-31 | 2017-01-16 | プリント配線基板 |
TW106102440A TWI645757B (zh) | 2016-03-31 | 2017-01-23 | 印刷配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016071036A JP6694311B2 (ja) | 2016-03-31 | 2016-03-31 | プリント配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017183597A JP2017183597A (ja) | 2017-10-05 |
JP6694311B2 true JP6694311B2 (ja) | 2020-05-13 |
Family
ID=59964128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016071036A Active JP6694311B2 (ja) | 2016-03-31 | 2016-03-31 | プリント配線基板 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6694311B2 (zh) |
KR (1) | KR102138992B1 (zh) |
CN (1) | CN108886875B (zh) |
TW (1) | TWI645757B (zh) |
WO (1) | WO2017168952A1 (zh) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05102648A (ja) * | 1991-10-04 | 1993-04-23 | Hitachi Ltd | プリント基板 |
JPH09199841A (ja) | 1996-01-19 | 1997-07-31 | Fuji Xerox Co Ltd | プリント配線板 |
JPH09331146A (ja) * | 1996-06-12 | 1997-12-22 | Saitama Nippon Denki Kk | 汎用表面実装部品ランド |
JPH10294553A (ja) * | 1997-04-18 | 1998-11-04 | Tec Corp | 回路基板 |
JP2004022734A (ja) * | 2002-06-14 | 2004-01-22 | Matsushita Electric Ind Co Ltd | 部品実装基板 |
JP4533248B2 (ja) * | 2005-06-03 | 2010-09-01 | 新光電気工業株式会社 | 電子装置 |
JP2007080969A (ja) * | 2005-09-12 | 2007-03-29 | Sony Corp | プリント配線板及びプリント配線板の製造方法 |
TWI301740B (en) * | 2006-06-01 | 2008-10-01 | Phoenix Prec Technology Corp | Method for fabricating circuit board with electrically connected structure |
JP5326823B2 (ja) * | 2009-05-28 | 2013-10-30 | 株式会社デンソー | 配線基板およびそれを用いた電子部品の実装構造 |
TW201132895A (en) * | 2010-03-25 | 2011-10-01 | Radiant Opto Electronics Corp | LED light bar and backlight module including the same |
JP5895374B2 (ja) * | 2011-06-24 | 2016-03-30 | 株式会社村田製作所 | 電子部品 |
CN204598464U (zh) * | 2015-04-24 | 2015-08-26 | 广州视源电子科技股份有限公司 | 一种电路板 |
-
2016
- 2016-03-31 JP JP2016071036A patent/JP6694311B2/ja active Active
-
2017
- 2017-01-16 CN CN201780020575.1A patent/CN108886875B/zh not_active Expired - Fee Related
- 2017-01-16 KR KR1020187027709A patent/KR102138992B1/ko active IP Right Grant
- 2017-01-16 WO PCT/JP2017/001212 patent/WO2017168952A1/ja active Application Filing
- 2017-01-23 TW TW106102440A patent/TWI645757B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20180116392A (ko) | 2018-10-24 |
KR102138992B1 (ko) | 2020-07-28 |
TWI645757B (zh) | 2018-12-21 |
JP2017183597A (ja) | 2017-10-05 |
CN108886875A (zh) | 2018-11-23 |
WO2017168952A1 (ja) | 2017-10-05 |
CN108886875B (zh) | 2021-02-26 |
TW201737772A (zh) | 2017-10-16 |
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