JP6694311B2 - プリント配線基板 - Google Patents

プリント配線基板 Download PDF

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Publication number
JP6694311B2
JP6694311B2 JP2016071036A JP2016071036A JP6694311B2 JP 6694311 B2 JP6694311 B2 JP 6694311B2 JP 2016071036 A JP2016071036 A JP 2016071036A JP 2016071036 A JP2016071036 A JP 2016071036A JP 6694311 B2 JP6694311 B2 JP 6694311B2
Authority
JP
Japan
Prior art keywords
electronic component
conductor
terminal
pad
mounting area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016071036A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017183597A (ja
Inventor
昌義 木村
昌義 木村
智広 兼平
智広 兼平
規至 山中
規至 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FDK Corp
Original Assignee
FDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FDK Corp filed Critical FDK Corp
Priority to JP2016071036A priority Critical patent/JP6694311B2/ja
Priority to KR1020187027709A priority patent/KR102138992B1/ko
Priority to CN201780020575.1A priority patent/CN108886875B/zh
Priority to PCT/JP2017/001212 priority patent/WO2017168952A1/ja
Priority to TW106102440A priority patent/TWI645757B/zh
Publication of JP2017183597A publication Critical patent/JP2017183597A/ja
Application granted granted Critical
Publication of JP6694311B2 publication Critical patent/JP6694311B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2016071036A 2016-03-31 2016-03-31 プリント配線基板 Active JP6694311B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016071036A JP6694311B2 (ja) 2016-03-31 2016-03-31 プリント配線基板
KR1020187027709A KR102138992B1 (ko) 2016-03-31 2017-01-16 프린트 배선 기판
CN201780020575.1A CN108886875B (zh) 2016-03-31 2017-01-16 印刷配线基板
PCT/JP2017/001212 WO2017168952A1 (ja) 2016-03-31 2017-01-16 プリント配線基板
TW106102440A TWI645757B (zh) 2016-03-31 2017-01-23 印刷配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016071036A JP6694311B2 (ja) 2016-03-31 2016-03-31 プリント配線基板

Publications (2)

Publication Number Publication Date
JP2017183597A JP2017183597A (ja) 2017-10-05
JP6694311B2 true JP6694311B2 (ja) 2020-05-13

Family

ID=59964128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016071036A Active JP6694311B2 (ja) 2016-03-31 2016-03-31 プリント配線基板

Country Status (5)

Country Link
JP (1) JP6694311B2 (zh)
KR (1) KR102138992B1 (zh)
CN (1) CN108886875B (zh)
TW (1) TWI645757B (zh)
WO (1) WO2017168952A1 (zh)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102648A (ja) * 1991-10-04 1993-04-23 Hitachi Ltd プリント基板
JPH09199841A (ja) 1996-01-19 1997-07-31 Fuji Xerox Co Ltd プリント配線板
JPH09331146A (ja) * 1996-06-12 1997-12-22 Saitama Nippon Denki Kk 汎用表面実装部品ランド
JPH10294553A (ja) * 1997-04-18 1998-11-04 Tec Corp 回路基板
JP2004022734A (ja) * 2002-06-14 2004-01-22 Matsushita Electric Ind Co Ltd 部品実装基板
JP4533248B2 (ja) * 2005-06-03 2010-09-01 新光電気工業株式会社 電子装置
JP2007080969A (ja) * 2005-09-12 2007-03-29 Sony Corp プリント配線板及びプリント配線板の製造方法
TWI301740B (en) * 2006-06-01 2008-10-01 Phoenix Prec Technology Corp Method for fabricating circuit board with electrically connected structure
JP5326823B2 (ja) * 2009-05-28 2013-10-30 株式会社デンソー 配線基板およびそれを用いた電子部品の実装構造
TW201132895A (en) * 2010-03-25 2011-10-01 Radiant Opto Electronics Corp LED light bar and backlight module including the same
JP5895374B2 (ja) * 2011-06-24 2016-03-30 株式会社村田製作所 電子部品
CN204598464U (zh) * 2015-04-24 2015-08-26 广州视源电子科技股份有限公司 一种电路板

Also Published As

Publication number Publication date
KR20180116392A (ko) 2018-10-24
KR102138992B1 (ko) 2020-07-28
TWI645757B (zh) 2018-12-21
JP2017183597A (ja) 2017-10-05
CN108886875A (zh) 2018-11-23
WO2017168952A1 (ja) 2017-10-05
CN108886875B (zh) 2021-02-26
TW201737772A (zh) 2017-10-16

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