JP6690941B2 - 封止樹脂組成物の運搬方法 - Google Patents

封止樹脂組成物の運搬方法 Download PDF

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Publication number
JP6690941B2
JP6690941B2 JP2015526253A JP2015526253A JP6690941B2 JP 6690941 B2 JP6690941 B2 JP 6690941B2 JP 2015526253 A JP2015526253 A JP 2015526253A JP 2015526253 A JP2015526253 A JP 2015526253A JP 6690941 B2 JP6690941 B2 JP 6690941B2
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resin composition
packaging material
encapsulating resin
encapsulating
sample
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JPWO2015005138A1 (ja
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伊藤　祐輔
祐輔 伊藤
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Packging For Living Organisms, Food Or Medicinal Products That Are Sensitive To Environmental Conditiond (AREA)
JP2015526253A 2013-07-10 2014-06-27 封止樹脂組成物の運搬方法 Active JP6690941B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013144382 2013-07-10
JP2013144382 2013-07-10
PCT/JP2014/067124 WO2015005138A1 (ja) 2013-07-10 2014-06-27 封止樹脂組成物の運搬方法及び梱包物

Related Child Applications (1)

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JP2019080745A Division JP2019151408A (ja) 2013-07-10 2019-04-22 封止樹脂組成物の運搬方法及び梱包物

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JPWO2015005138A1 JPWO2015005138A1 (ja) 2017-03-02
JP6690941B2 true JP6690941B2 (ja) 2020-04-28

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JP2019080745A Pending JP2019151408A (ja) 2013-07-10 2019-04-22 封止樹脂組成物の運搬方法及び梱包物

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JP (2) JP6690941B2 (ko)
KR (1) KR102247124B1 (ko)
CN (1) CN105358452B (ko)
TW (1) TWI629215B (ko)
WO (1) WO2015005138A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019176597A1 (ja) 2018-03-12 2019-09-19 日立化成株式会社 半導体封止成形用仮保護フィルム、仮保護フィルム付きリードフレーム、仮保護フィルム付き封止成形体及び半導体装置を製造する方法
CN117715835A (zh) * 2021-11-08 2024-03-15 株式会社力森诺科 密封材料的捆包体及密封材料的捆包方法
WO2023223974A1 (ja) * 2022-05-20 2023-11-23 株式会社日本触媒 包装体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3940945B2 (ja) * 1999-11-30 2007-07-04 大日本インキ化学工業株式会社 電子部品封止用エポキシ樹脂組成物
JP2001234196A (ja) * 1999-12-14 2001-08-28 Lion Corp 粒状洗剤組成物および透明容器入り粒状洗剤組成物
JP2004090971A (ja) * 2002-08-30 2004-03-25 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂成形材料の梱包方法
JP4433368B2 (ja) * 2003-04-08 2010-03-17 ジャパンエポキシレジン株式会社 エポキシ樹脂粒状化物及びその製造方法
CN201038152Y (zh) * 2007-04-29 2008-03-19 江苏长电科技股份有限公司 可以改善半导体塑料封装体内元器件分层的封装方法
KR20110104507A (ko) * 2008-12-10 2011-09-22 스미토모 베이클리트 컴퍼니 리미티드 과립상의 반도체 봉지용 에폭시 수지 조성물 및 그것을 이용한 반도체 장치 및 반도체 장치의 제조 방법
JP2012017422A (ja) * 2010-07-08 2012-01-26 Nitto Denko Corp 熱硬化性樹脂組成物硬化体の製法およびそれにより得られた硬化物
JP5621663B2 (ja) * 2011-03-02 2014-11-12 住友ベークライト株式会社 半導体封止用樹脂組成物、半導体装置およびその製造方法
CN104024126B (zh) * 2012-02-29 2016-08-24 住友电木株式会社 颗粒状的密封树脂组合物的包装方法、包装物和搬运方法

Also Published As

Publication number Publication date
KR102247124B1 (ko) 2021-04-30
WO2015005138A1 (ja) 2015-01-15
TWI629215B (zh) 2018-07-11
TW201527173A (zh) 2015-07-16
CN105358452B (zh) 2017-05-17
JPWO2015005138A1 (ja) 2017-03-02
JP2019151408A (ja) 2019-09-12
CN105358452A (zh) 2016-02-24
KR20160029070A (ko) 2016-03-14

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