JP6689823B2 - 樹脂成形体及びその製造方法 - Google Patents
樹脂成形体及びその製造方法 Download PDFInfo
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- JP6689823B2 JP6689823B2 JP2017508243A JP2017508243A JP6689823B2 JP 6689823 B2 JP6689823 B2 JP 6689823B2 JP 2017508243 A JP2017508243 A JP 2017508243A JP 2017508243 A JP2017508243 A JP 2017508243A JP 6689823 B2 JP6689823 B2 JP 6689823B2
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- norbornene
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- atom
- crosslinked polymer
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- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical group [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000005708 carbonyloxy group Chemical group [*:2]OC([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001793 charged compounds Polymers 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- YGHUUVGIRWMJGE-UHFFFAOYSA-N chlorodimethylsilane Chemical compound C[SiH](C)Cl YGHUUVGIRWMJGE-UHFFFAOYSA-N 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003426 co-catalyst Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 1
- HYPABJGVBDSCIT-UPHRSURJSA-N cyclododecene Chemical compound C1CCCCC\C=C/CCCC1 HYPABJGVBDSCIT-UPHRSURJSA-N 0.000 description 1
- ZXIJMRYMVAMXQP-UHFFFAOYSA-N cycloheptene Chemical compound C1CCC=CCC1 ZXIJMRYMVAMXQP-UHFFFAOYSA-N 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 150000008049 diazo compounds Chemical class 0.000 description 1
- NRAYZPGATNMOSB-UHFFFAOYSA-N dichloro(dihexyl)silane Chemical compound CCCCCC[Si](Cl)(Cl)CCCCCC NRAYZPGATNMOSB-UHFFFAOYSA-N 0.000 description 1
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 description 1
- GNEPOXWQWFSSOU-UHFFFAOYSA-N dichloro-methyl-phenylsilane Chemical compound C[Si](Cl)(Cl)C1=CC=CC=C1 GNEPOXWQWFSSOU-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- YNLAOSYQHBDIKW-UHFFFAOYSA-M diethylaluminium chloride Chemical compound CC[Al](Cl)CC YNLAOSYQHBDIKW-UHFFFAOYSA-M 0.000 description 1
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- UAIZDWNSWGTKFZ-UHFFFAOYSA-L ethylaluminum(2+);dichloride Chemical compound CC[Al](Cl)Cl UAIZDWNSWGTKFZ-UHFFFAOYSA-L 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 125000002534 ethynyl group Chemical class [H]C#C* 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002527 isonitriles Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N n-decene Natural products CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000005538 phosphinite group Chemical group 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- AFCAKJKUYFLYFK-UHFFFAOYSA-N tetrabutyltin Chemical compound CCCC[Sn](CCCC)(CCCC)CCCC AFCAKJKUYFLYFK-UHFFFAOYSA-N 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 150000003567 thiocyanates Chemical class 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical group OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- NJMOHBDCGXJLNJ-UHFFFAOYSA-N trimellitic anhydride chloride Chemical group ClC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 NJMOHBDCGXJLNJ-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/38—Polymers of cycloalkenes, e.g. norbornene or cyclopentene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Laminated Bodies (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
ノルボルネン等の環状オレフィンの重合体は一般に耐熱性に優れるが、耐熱性を一層向上させるノルボルネン系架橋重合体の製造技術として、例えば、極性基を有する所定のノルボルネン系モノマーを用いる方法(特許文献1)や、所定のメタセシス触媒を用いる方法(特許文献2)が提案されている。
〔1〕 ジシクロペンタジエン系単量体単位、テトラシクロドデセン系単量体単位及びトリシクロペンタジエン系単量体単位からなる群から選択される少なくとも1種を50質量%以上含有してなるノルボルネン系架橋重合体の表面が、ポリアミドイミド層により被覆されてなる、樹脂成形体、並びに
〔2〕 ジシクロペンタジエン系単量体、テトラシクロドデセン系単量体及びトリシクロペンタジエン系単量体からなる群から選択される少なくとも1種と、メタセシス重合触媒とを含有してなる配合物を加熱して重合硬化させる工程(1)、並びに
工程(1)により得られたノルボルネン系架橋重合体の表面にポリアミドイミド層を形成する工程(2)、
を含む、前記〔1〕記載の樹脂成形体の製造方法
に関する。
更に、これらの単量体は、置換基として、水酸基、エステル基(−C(O)O−)、エーテル基(−O−)、エポキシ基、シアノ基、ハロゲン原子等の極性基を有していてもよい。
本発明の樹脂成形体は、後述するように、ノルボルネン系架橋重合体の全表面が必ずしもポリアミドイミド層により被覆されている必要はない。特に、用いる単量体が、水酸基、エポキシ基及びシアノ基等の極性基を有すると、ノルボルネン系架橋重合体の固体表面への密着性が向上するため、本発明の樹脂成形体を、例えば、パワー半導体等の封止材料として用いる場合、ポリアミドイミド層により被覆されておらず、ノルボルネン系架橋重合体の表面が露出した部分を、封止対象である半導体素子と接触させるようにすると、樹脂成形体との密着性が向上し、絶縁性能が充分に発揮されるため好適である。
以上の単量体は、それぞれ単独であるいは2種以上を組み合わせて用いられる。
ノルボルネン系架橋重合体の中でも、耐熱性と絶縁性とをバランス良く向上させる観点から、トリシクロペンタジエン系単量体単位を、50質量%以上含有してなるものが好ましく、60〜100質量%含有してなるものがより好ましく、70〜100質量%含有してなるものが特に好ましい。
ノルボルネン系架橋重合体は、例えば、後述する製造方法により製造されるが、重合反応の際に気泡が発生し、得られる重合体中に気泡が含まれることがある。重合体中に気泡が存在すると、その絶縁性が低下する。意外にも、トリシクロペンタジエン系単量体を多く含む配合物を用いて重合反応を行った場合、気泡の発生が抑制され、そのようにして得られる重合体の中でも、特にトリシクロペンタジエン系単量体単位を前記範囲で含有する、ノルボルネン系架橋重合体には気泡が実質的に含まれないことから、耐熱性と絶縁性とがバランス良く向上するものと推定される。
本発明に用いられるノルボルネン系架橋重合体のガラス転移温度は、特に限定されないが、通常、120℃以上であり、好ましくは240℃以上、より好ましくは250℃以上、さらに好ましくは270℃以上である。なお、ガラス転移温度は高いほど好ましいが、通常、その上限は330℃程度である。
で表される繰り返し構造単位を有するものが挙げられる。
ジイソシアネートとしては、4,4’−ジフェニルメタンジイソシアネート、キシリレンジイソシアネート、3,3’−ジフェニルメタンジイソシアネート、4,4’−ジフェニルエーテルジイソシアネート、3,3’−ジフェニルエーテルジイソシアネート、パラフェニレンジイソシアネート等が挙げられ、これらのなかでは、4,4’−ジフェニルメタンジイソシアネート、3,3’−ジフェニルメタンジイソシアネート、4,4’−ジフェニルエーテルジイソシアネート、及び3,3’−ジフェニルエーテルジイソシアネートが好ましい。
前記した、ジシクロペンタジエン系単量体、テトラシクロドデセン系単量体及びトリシクロペンタジエン系単量体からなる群から選択される少なくとも1種と、メタセシス重合触媒とを含有してなる配合物を加熱して重合硬化させる工程(1)、並びに
工程(1)により得られたノルボルネン系架橋重合体の表面にポリアミドイミド層を形成する工程(2)、
を含む方法により、効率的に製造することができる。
配合物中のラジカル発生剤の配合量としては、通常、用いる全単量体成分100質量部に対して、0.5〜2.0質量部である。
なお、いずれの方法においても、冷却固化する際の冷却温度としては、用いる単量体成分にもよるが、通常、−60〜0℃が好ましい。
なお、工程(1)での重合硬化を一段階で行う場合、後述する、工程(i)の条件に従って行うのが好ましい。
以下、工程(1)での配合物の重合硬化を、上記工程(i)と工程(ii)により行う態様について説明する。
支持体としては、例えば、ポリエチレンテレフタレート、ポリプロピレン、ポリエチレン、ポリカーボネート、ポリエチレンナフタレート、ポリアリレート、ナイロン等の樹脂からなるフィルムや板;鉄、ステンレス、銅、アルミニウム、ニッケル、クロム、金、銀等の金属材料からなるフィルムや板が挙げられる。なかでも、樹脂フィルム又は金属箔の使用が好ましい。これら樹脂フィルム又は金属箔の厚さは、作業性等の観点から、通常、1〜150μm、好ましくは2〜100μm、より好ましくは3〜75μmである。
本方法においては、用いるメタセシス重合触媒が活性剤(共触媒)を必要とするものであるか否かにより、以下の2つの方法により、配合物の調製を行うのが好ましい。
工程(ii)における硬化物の加熱は、使用したメタセシス重合触媒の失活温度よりも、好ましくは60℃以上高い温度、より好ましくは70℃以上高い温度、さらに好ましくは80℃以上高い温度で行う。工程(ii)における加熱温度の具体的な温度範囲としては、通常、250℃以上、350℃未満、好ましく280〜330℃、より好ましくは300〜310℃である。また、工程(ii)における硬化物の加熱時間としては、通常、10〜120分間、好ましくは20〜90分間、より好ましくは30〜60分間である。
このような特性を生かし、本発明の樹脂成形体によれば、例えば、ポリアミドイミド層を意匠面とする成形用樹脂型の他、ポリアミドイミド層がプライマー層やアンダーコート層として機能しうることから、ポリアミドイミド層の上に耐熱性塗料を塗ることで、非常に耐熱性に優れる、表面が着色された樹脂成形体を提供することができる。
本発明の樹脂成形体の用途は、特に限定されないが、例えば、バンパーやエアデフレクター等の自動車用途、ホイルローダーやパワーショベル等の建設・産業機械用途、ゴルフカートやゲーム機等のレジャー用途、医療機器等の医療用途、大型パネルや椅子等の産業用途、シャワーパンや洗面ボウル等の住宅設備用途に好適に用いられる。また、本発明の樹脂成形体は高耐熱性を有する絶縁材料としても好適であり、電気絶縁封止材や電気絶縁構造物等の電気絶縁用途、例えば、絶縁ゲートバイポーラトランジスタ(IGBT)パワーモジュール(SiC系、Si系、GaN系半導体)、ディスクリート半導体、パワー半導体、チップコンデンサ、モールドトランス等の電気機器の封止用途に好適に用いられる。さらに、自動車等のエンジンカバー用途や、ガス絶縁開閉装置(GIS)の筐体、ブレーカーボックス、受電盤、配電盤、制御盤等の電気機器の筐体等、高い耐熱性かつ絶縁性が要求される用途にも好適に用いることができる。
(触媒液の調製)
メタセシス重合触媒として、下記式(7)で示すルテニウム触媒(VC843、分子量843、Strem Chemicals社製)0.6部、及び2,6−ジ−t−ブチル−p−クレゾール(BHT、老化防止剤)15部をシクロペンタノン82部に溶解させ、次いで、3,4−ジメチルピリジン2.2部、及びフェニルトリクロロシラン0.1部を混合することで、触媒液を得た。
単量体として、40℃に加温したトリシクロペンタジエン(分子量198.3)80部とジシクロペンタジエン(分子量132.2)20部に、重合遅延剤としてトリフェニルホスフィン0.5部、及び前記にて調製した触媒液3.3部を添加して配合液を得た。なお、用いた全単量体1モルに対するメタセシス重合触媒の使用量は0.05ミリモルであった。
ポリアミドイミドとして、ポリアミドイミドのN−メチル−2−ピロリドン溶液(東洋紡株式会社製「VYLOMAX(登録商標) HR−16NN」)を使用した以外は、実施例1と同様にして板状の樹脂成形体を製造した。用いたポリアミドイミドのガラス転移温度は200℃以上であった。
実施例1において得られた板状のノルボルネン系架橋重合体を比較例1の樹脂成形体とした。
ポリアミドイミドの代わりに、シリコン樹脂系屋外用耐熱塗料として販売されている株式会社トウペ製の「ニュ−ハイテン21 400カラー」を使用した以外は、実施例1と同様にして板状の樹脂成形体を製造した。
Claims (8)
- トリシクロペンタジエン系単量体単位を50質量%以上含有し、該トリシクロペンタジエン系単量体単位が水酸基、エポキシ基、シアノ基及びハロゲン原子からなる群より選択される少なくとも1つを有するノルボルネン系架橋重合体の表面が、ポリアミドイミド層により被覆されてなる、樹脂成形体。
- ノルボルネン系架橋重合体のガラス転移温度が240℃以上である請求項1記載の樹脂成形体。
- 全単量体中、50質量%以上のトリシクロペンタジエン系単量体と、メタセシス重合触媒とを含有し、該トリシクロペンタジエン系単量体単位が水酸基、エポキシ基、シアノ基及びハロゲン原子からなる群より選択される少なくとも1つを有する配合物を加熱して重合硬化させる工程(1)、並びに
工程(1)により得られたノルボルネン系架橋重合体の表面にポリアミドイミド層を形成する工程(2)、
を含む、請求項1又は2記載の樹脂成形体の製造方法。 - 工程(1)における前記配合物の重合硬化を、前記配合物を前記メタセシス重合触媒の失活温度未満の温度で加熱して一次硬化させる工程(i)、及び工程(i)により得られた硬化物を前記メタセシス重合触媒の失活温度以上の温度で加熱して二次硬化させる工程(ii)により行う、請求項3記載の樹脂成形体の製造方法。
- 前記工程(i)において、前記配合物を、25℃以上、220℃未満の温度で加熱して一次硬化させる、請求項4記載の製造方法。
- 前記工程(ii)において、前記硬化物を、250℃以上、350℃未満の温度で加熱して二次硬化させる、請求項4又は5記載の製造方法。
- 請求項1又は2に記載の樹脂成形体により半導体素子を封止してなる、パワー半導体。
- 請求項1又は2に記載の樹脂成形体により半導体素子を封止する工程を有する、パワー半導体の製造方法。
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