JP6689328B2 - 発光半導体チップおよびオプトエレクトロニクスデバイス - Google Patents
発光半導体チップおよびオプトエレクトロニクスデバイス Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 147
- 230000005693 optoelectronics Effects 0.000 title claims description 20
- 239000004020 conductor Substances 0.000 claims description 89
- 238000006243 chemical reaction Methods 0.000 claims description 66
- 239000000758 substrate Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 15
- 230000005670 electromagnetic radiation Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
Claims (14)
- 発光半導体チップであって、
ビーム透過性基板(101)と、
前記基板(101)の主要面(104)上の、エピタキシャル成長した半導体層列(102)と、
前記半導体層列(102)の、前記基板(101)とは反対側にあるコンタクト面(114)上の、前記半導体チップ(100)の電気的な接触接続および機械的な接触接続のための第1のコンタクト(105)および第2のコンタクト(106)と、
前記コンタクト面(114)に配置されており、前記第1のコンタクト(105)と電気的に接続されている透明導電層(107)とを有し、
前記半導体チップはボリューム発光体として形成されており、前記半導体チップ(100)の動作時に発生させられた電磁放射線(109)は、前記半導体チップ(100)の前面(110)、後面(111)および側面(112)を介して取り出し可能であり、
前記第1のコンタクト(105)および前記第2のコンタクト(106)はそれぞれ、前記コンタクト面(114)の中央領域(113)に配置され、前記電磁放射線(109)は前記中央領域(113)から出射しない、
発光半導体チップ。 - 前記コンタクト面(114)上の前記第1のコンタクト(105)および前記第2のコンタクト(106)は、前記透明導電層(107)の間に配置されている、請求項1記載の半導体チップ。
- 前記コンタクト面(114)の面積の30%〜90%は、前記透明導電層(107)によって覆われている、請求項1または2記載の半導体チップ。
- 第2のコンタクト(106)は、半導体層列(102)の反対側にある面と、ビアにより電気的に接続される、請求項1から3までのいずれか1項記載の半導体チップ。
- オプトエレクトロニクスデバイスであって、
請求項1から4までのいずれか1項記載の半導体チップ(100)と、
第1の電気的な導体路(202)と第2の電気的な導体路(203)とを備えた支持体(201)とを有しており、
前記第1のコンタクト(105)は電気的かつ機械的に、前記第1の導体路(202)と接続されており、前記第2のコンタクト(106)は電気的かつ機械的に、前記第2の導体路(203)と接続されており、
前記透明導電層(107)は、前記半導体層列(102)の積層方向(204)に沿って、前記支持体(201)に対して間隔(205)を有している、
オプトエレクトロニクスデバイス。 - 前記透明導電層(107)と前記支持体(201)との間に、波長変換のための変換部材(206)が配置されている、請求項5記載のデバイス。
- 前記基板(101)の、前記コンタクト面(114)とは反対側に位置する面(208)に配置されている、波長変換のためのさらなる変換部材(207)を有している、請求項6記載のデバイス。
- 前記変換部材(206)と、前記さらなる変換部材(207)とは、互いに異なる変換部材材料濃度を有している、請求項7記載のデバイス。
- 前記変換部材(206)と、前記さらなる変換部材(207)とは、互いに異なる材料を有している、請求項7または8記載のデバイス。
- 前記第1の電気的な導体路(202)および前記第2の電気的な導体路(203)はそれぞれ、変換されたビーム(210,211)に対して反射性に構成されている、請求項6から8までのいずれか1項記載のデバイス。
- 前記第1の電気的な導体路(202)および前記第2の電気的な導体路(203)はそれぞれ、引き下げられた領域(213)を有しており、当該引き下げられた領域内に前記変換部材(206)が配置されている、請求項6から10までのいずれか1項記載のデバイス。
- 前記第1のコンタクト(105)および前記第2のコンタクト(106)はそれぞれ、各前記導体路(202,203)と接続されている、張り出している領域(214)を有しており、これによって前記支持体(201)に対する前記間隔(205)が形成される、請求項5から11までのいずれか1項記載のデバイス。
- 前記第1の導体路(202)および前記第2の導体路(203)はそれぞれ、各前記コンタクト(105,106)と接続されている、張り出している領域(215)を有しており、これによって前記支持体(201)に対する前記間隔(205)が形成される、請求項5から12までのいずれか1項記載のデバイス。
- 前記積層方向(204)に沿って、前記半導体層列(102)、前記第1のコンタクト(105)および前記第2のコンタクト(106)が、前記基板(101)と2つの前記電気的な導体路(202,203)との間に配置されている、請求項5から13までのいずれか1項記載のデバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017117504.0 | 2017-08-02 | ||
DE102017117504.0A DE102017117504A1 (de) | 2017-08-02 | 2017-08-02 | Lichtemittierender Halbleiterchip und optoelektronisches Bauteil |
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JP2019050359A JP2019050359A (ja) | 2019-03-28 |
JP6689328B2 true JP6689328B2 (ja) | 2020-04-28 |
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JP2018145194A Active JP6689328B2 (ja) | 2017-08-02 | 2018-08-01 | 発光半導体チップおよびオプトエレクトロニクスデバイス |
Country Status (4)
Country | Link |
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US (1) | US10522718B2 (ja) |
JP (1) | JP6689328B2 (ja) |
CN (1) | CN109390458B (ja) |
DE (1) | DE102017117504A1 (ja) |
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DE102017101729A1 (de) * | 2017-01-30 | 2018-08-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
DE102018124473A1 (de) * | 2018-10-04 | 2020-04-09 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauteil, verfahren zur ansteuerung eines optoelektronischen bauteils und beleuchtungsvorrichtung |
KR20220154315A (ko) * | 2021-05-12 | 2022-11-22 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
JPWO2023054199A1 (ja) | 2021-09-28 | 2023-04-06 |
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EP0952617B1 (en) * | 1993-04-28 | 2004-07-28 | Nichia Corporation | Gallium nitride-based III-V group compound semiconductor device |
JP4366810B2 (ja) | 2000-02-08 | 2009-11-18 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
JP4920497B2 (ja) | 2007-05-29 | 2012-04-18 | 株式会社東芝 | 光半導体装置 |
KR101047791B1 (ko) * | 2008-11-18 | 2011-07-07 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 및 그 제조방법 |
KR101091504B1 (ko) * | 2010-02-12 | 2011-12-08 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지 및 발광소자 제조방법 |
JP2011249476A (ja) * | 2010-05-25 | 2011-12-08 | Kyocera Corp | 半導体発光装置 |
CN101908593A (zh) * | 2010-07-15 | 2010-12-08 | 山东华光光电子有限公司 | GaN基LED图形化透明导电薄膜的制作方法 |
KR101452857B1 (ko) * | 2013-03-04 | 2014-10-22 | 주식회사 루멘스 | 발광소자 패키지 및 그 제조방법 |
TWI540766B (zh) * | 2013-07-10 | 2016-07-01 | 隆達電子股份有限公司 | 發光二極體封裝結構 |
JP6195760B2 (ja) * | 2013-08-16 | 2017-09-13 | シチズン電子株式会社 | Led発光装置 |
JP6458463B2 (ja) * | 2013-12-09 | 2019-01-30 | 日亜化学工業株式会社 | 発光素子 |
JP2015216139A (ja) * | 2014-05-07 | 2015-12-03 | 株式会社小糸製作所 | 発光モジュール |
DE102014108300B4 (de) * | 2014-06-12 | 2022-02-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische Halbleiterbauelemente |
DE102014117591A1 (de) * | 2014-12-01 | 2016-06-02 | Osram Opto Semiconductors Gmbh | Halbleiterchip, Verfahren zur Herstellung einer Vielzahl an Halbleiterchips und Verfahren zur Herstellung eines elektronischen oder optoelektronischen Bauelements und elektronisches oder optoelektronisches Bauelement |
CN105070799B (zh) * | 2015-09-01 | 2017-05-24 | 湘能华磊光电股份有限公司 | 一种led芯片的制作方法 |
TWI591849B (zh) * | 2015-11-27 | 2017-07-11 | 隆達電子股份有限公司 | 半導體發光結構及其半導體封裝結構 |
CN205752231U (zh) * | 2016-05-09 | 2016-11-30 | 上海博恩世通光电股份有限公司 | 一种倒装发光二极管 |
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- 2017-08-02 DE DE102017117504.0A patent/DE102017117504A1/de active Pending
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- 2018-08-01 JP JP2018145194A patent/JP6689328B2/ja active Active
- 2018-08-01 US US16/052,554 patent/US10522718B2/en active Active
- 2018-08-02 CN CN201810869489.4A patent/CN109390458B/zh active Active
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CN109390458A (zh) | 2019-02-26 |
JP2019050359A (ja) | 2019-03-28 |
DE102017117504A1 (de) | 2019-02-07 |
US20190044032A1 (en) | 2019-02-07 |
CN109390458B (zh) | 2021-09-07 |
US10522718B2 (en) | 2019-12-31 |
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