JP6675948B2 - 蓋体及びこれを用いた基板処理装置 - Google Patents
蓋体及びこれを用いた基板処理装置 Download PDFInfo
- Publication number
- JP6675948B2 JP6675948B2 JP2016152914A JP2016152914A JP6675948B2 JP 6675948 B2 JP6675948 B2 JP 6675948B2 JP 2016152914 A JP2016152914 A JP 2016152914A JP 2016152914 A JP2016152914 A JP 2016152914A JP 6675948 B2 JP6675948 B2 JP 6675948B2
- Authority
- JP
- Japan
- Prior art keywords
- purge gas
- metal plate
- screw
- gas supply
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 20
- 238000010926 purge Methods 0.000 claims description 74
- 229910052751 metal Inorganic materials 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 57
- 239000010453 quartz Substances 0.000 claims description 57
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 57
- 238000010438 heat treatment Methods 0.000 claims description 32
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 75
- 235000012431 wafers Nutrition 0.000 description 31
- 230000007246 mechanism Effects 0.000 description 22
- 239000006227 byproduct Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 11
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 6
- 230000001629 suppression Effects 0.000 description 6
- 229920001973 fluoroelastomer Polymers 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 235000019270 ammonium chloride Nutrition 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016152914A JP6675948B2 (ja) | 2016-08-03 | 2016-08-03 | 蓋体及びこれを用いた基板処理装置 |
| KR1020170096746A KR102171647B1 (ko) | 2016-08-03 | 2017-07-31 | 덮개체 및 이것을 사용한 기판 처리 장치 |
| CN201710651619.2A CN107689336B (zh) | 2016-08-03 | 2017-08-02 | 盖体和使用了该盖体的基板处理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016152914A JP6675948B2 (ja) | 2016-08-03 | 2016-08-03 | 蓋体及びこれを用いた基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018022773A JP2018022773A (ja) | 2018-02-08 |
| JP6675948B2 true JP6675948B2 (ja) | 2020-04-08 |
Family
ID=61152475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016152914A Active JP6675948B2 (ja) | 2016-08-03 | 2016-08-03 | 蓋体及びこれを用いた基板処理装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6675948B2 (zh) |
| KR (1) | KR102171647B1 (zh) |
| CN (1) | CN107689336B (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7344942B2 (ja) * | 2021-09-24 | 2023-09-14 | 株式会社Kokusai Electric | 基板処理装置、クリーニング方法、半導体装置の製造方法及びプログラム |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56144415U (zh) * | 1980-03-31 | 1981-10-31 | ||
| JPH09289173A (ja) * | 1996-04-19 | 1997-11-04 | Tokyo Electron Ltd | 縦型熱処理装置 |
| JP4361668B2 (ja) * | 2000-06-22 | 2009-11-11 | 東京エレクトロン株式会社 | 熱処理装置及びその方法 |
| JP3881567B2 (ja) * | 2002-03-05 | 2007-02-14 | 東京エレクトロン株式会社 | 熱処理用ボート及び縦型熱処理装置 |
| JP2005093489A (ja) | 2003-09-12 | 2005-04-07 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2012204645A (ja) * | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | 蓋体開閉装置 |
| JP5724713B2 (ja) * | 2011-07-22 | 2015-05-27 | 東京エレクトロン株式会社 | 熱処理装置 |
-
2016
- 2016-08-03 JP JP2016152914A patent/JP6675948B2/ja active Active
-
2017
- 2017-07-31 KR KR1020170096746A patent/KR102171647B1/ko active IP Right Grant
- 2017-08-02 CN CN201710651619.2A patent/CN107689336B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107689336A (zh) | 2018-02-13 |
| CN107689336B (zh) | 2022-05-27 |
| JP2018022773A (ja) | 2018-02-08 |
| KR20180015583A (ko) | 2018-02-13 |
| KR102171647B1 (ko) | 2020-10-29 |
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