JP6674679B2 - 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法 - Google Patents

基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法 Download PDF

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JP6674679B2
JP6674679B2 JP2016030154A JP2016030154A JP6674679B2 JP 6674679 B2 JP6674679 B2 JP 6674679B2 JP 2016030154 A JP2016030154 A JP 2016030154A JP 2016030154 A JP2016030154 A JP 2016030154A JP 6674679 B2 JP6674679 B2 JP 6674679B2
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magnet
substrate
turntable
movable pin
movable
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JP2016030154A
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English (en)
Japanese (ja)
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JP2017069531A (ja
Inventor
裕充 蒲
裕充 蒲
昭彦 瀧
昭彦 瀧
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to US15/270,530 priority Critical patent/US10192771B2/en
Priority to TW105131017A priority patent/TWI626090B/zh
Priority to KR1020160124794A priority patent/KR101911145B1/ko
Priority to CN201610865262.3A priority patent/CN107017180B/zh
Publication of JP2017069531A publication Critical patent/JP2017069531A/ja
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Publication of JP6674679B2 publication Critical patent/JP6674679B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
JP2016030154A 2015-09-29 2016-02-19 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法 Active JP6674679B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US15/270,530 US10192771B2 (en) 2015-09-29 2016-09-20 Substrate holding/rotating device, substrate processing apparatus including the same, and substrate processing method
TW105131017A TWI626090B (zh) 2015-09-29 2016-09-26 基板保持旋轉裝置及具備其之基板處理裝置、暨基板處理方法
KR1020160124794A KR101911145B1 (ko) 2015-09-29 2016-09-28 기판 유지 회전 장치 및 그것을 구비한 기판 처리 장치, 그리고 기판 처리 방법
CN201610865262.3A CN107017180B (zh) 2015-09-29 2016-09-29 基板保持旋转装置、基板处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015192155 2015-09-29
JP2015192155 2015-09-29

Publications (2)

Publication Number Publication Date
JP2017069531A JP2017069531A (ja) 2017-04-06
JP6674679B2 true JP6674679B2 (ja) 2020-04-01

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Country Status (4)

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JP (1) JP6674679B2 (zh)
KR (1) KR101911145B1 (zh)
CN (1) CN107017180B (zh)
TW (1) TWI626090B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6899703B2 (ja) * 2017-05-29 2021-07-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7055720B2 (ja) * 2018-08-10 2022-04-18 株式会社荏原製作所 基板回転装置、基板洗浄装置および基板処理装置ならびに基板回転装置の制御方法
JP7282494B2 (ja) * 2018-09-18 2023-05-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN111063652B (zh) * 2018-10-16 2022-08-30 沈阳芯源微电子设备股份有限公司 一种基板夹持承载台
US11312611B2 (en) 2019-05-13 2022-04-26 Lg Electronics Inc. Hydrogen water generator
JP7386700B2 (ja) * 2019-12-27 2023-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
CN111776280B (zh) * 2020-06-04 2021-12-03 三峡大学 一种适用于十字捆绑的旋转台及使用方法
CN112864013B (zh) * 2021-01-18 2023-10-03 长鑫存储技术有限公司 半导体器件处理方法
CN114653660B (zh) * 2022-05-20 2022-09-16 智程半导体设备科技(昆山)有限公司 一种磁性夹块及半导体基材清洗装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4724297B2 (ja) * 2000-12-26 2011-07-13 キヤノン株式会社 露光装置、デバイス製造方法
KR100865941B1 (ko) * 2006-11-28 2008-10-30 세메스 주식회사 스핀헤드 및 상기 스핀헤드의 기판 척킹/언척킹방법,그리고 상기 스핀헤드를 구비하는 기판 처리 장치
KR100873153B1 (ko) * 2007-10-05 2008-12-10 세메스 주식회사 스핀 헤드
US8714169B2 (en) * 2008-11-26 2014-05-06 Semes Co. Ltd. Spin head, apparatus for treating substrate, and method for treating substrate
KR101017654B1 (ko) * 2008-11-26 2011-02-25 세메스 주식회사 기판 척킹 부재, 이를 갖는 기판 처리 장치 및 이를 이용한기판 처리 방법
US9248450B2 (en) * 2010-03-30 2016-02-02 Advanced Liquid Logic, Inc. Droplet operations platform
JP5616205B2 (ja) * 2010-11-29 2014-10-29 東京エレクトロン株式会社 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体
US9385020B2 (en) * 2011-12-19 2016-07-05 SCREEN Holdings Co., Ltd. Substrate holding and rotating device, substrate treatment apparatus including the device, and substrate treatment method
JP5975563B2 (ja) * 2012-03-30 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6270268B2 (ja) * 2014-02-27 2018-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
TW201720542A (zh) 2017-06-16
JP2017069531A (ja) 2017-04-06
CN107017180B (zh) 2021-02-23
TWI626090B (zh) 2018-06-11
CN107017180A (zh) 2017-08-04
KR20170038171A (ko) 2017-04-06
KR101911145B1 (ko) 2018-10-23

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