JP6672954B2 - 樹脂シート - Google Patents

樹脂シート Download PDF

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Publication number
JP6672954B2
JP6672954B2 JP2016066543A JP2016066543A JP6672954B2 JP 6672954 B2 JP6672954 B2 JP 6672954B2 JP 2016066543 A JP2016066543 A JP 2016066543A JP 2016066543 A JP2016066543 A JP 2016066543A JP 6672954 B2 JP6672954 B2 JP 6672954B2
Authority
JP
Japan
Prior art keywords
resin
resin composition
layer
manufactured
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016066543A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017177469A (ja
Inventor
中村　茂雄
茂雄 中村
祥平 藤島
祥平 藤島
ちひろ 藤原
ちひろ 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=59983103&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP6672954(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2016066543A priority Critical patent/JP6672954B2/ja
Priority to TW106108365A priority patent/TWI721130B/zh
Priority to CN201710181773.8A priority patent/CN107236252A/zh
Priority to KR1020170038543A priority patent/KR102422859B1/ko
Publication of JP2017177469A publication Critical patent/JP2017177469A/ja
Application granted granted Critical
Publication of JP6672954B2 publication Critical patent/JP6672954B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
JP2016066543A 2016-03-29 2016-03-29 樹脂シート Active JP6672954B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016066543A JP6672954B2 (ja) 2016-03-29 2016-03-29 樹脂シート
TW106108365A TWI721130B (zh) 2016-03-29 2017-03-14 樹脂薄片
CN201710181773.8A CN107236252A (zh) 2016-03-29 2017-03-24 树脂片
KR1020170038543A KR102422859B1 (ko) 2016-03-29 2017-03-27 수지 시트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016066543A JP6672954B2 (ja) 2016-03-29 2016-03-29 樹脂シート

Publications (2)

Publication Number Publication Date
JP2017177469A JP2017177469A (ja) 2017-10-05
JP6672954B2 true JP6672954B2 (ja) 2020-03-25

Family

ID=59983103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016066543A Active JP6672954B2 (ja) 2016-03-29 2016-03-29 樹脂シート

Country Status (4)

Country Link
JP (1) JP6672954B2 (ko)
KR (1) KR102422859B1 (ko)
CN (1) CN107236252A (ko)
TW (1) TWI721130B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018139368A1 (ja) * 2017-01-26 2018-08-02 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP6859916B2 (ja) * 2017-10-13 2021-04-14 味の素株式会社 樹脂組成物層
JP6919508B2 (ja) * 2017-11-07 2021-08-18 味の素株式会社 樹脂組成物
JP7087780B2 (ja) * 2018-07-26 2022-06-21 味の素株式会社 樹脂組成物
JP7342358B2 (ja) * 2018-12-26 2023-09-12 住友ベークライト株式会社 樹脂組成物、それを用いたキャリア付樹脂膜、プリプレグ、積層板、プリント配線基板および半導体装置
JP7255411B2 (ja) * 2019-07-30 2023-04-11 味の素株式会社 樹脂組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58163645A (ja) * 1982-03-17 1983-09-28 ユ−オ−ピ−・インコ−ポレイテツド 銅張り積層板の製造方法
JP2000001622A (ja) * 1998-04-16 2000-01-07 Tdk Corp 複合誘電体材料組成物と、これを用いたフィルム、基板、電子部品および成形品
JP2000230102A (ja) * 1999-02-12 2000-08-22 Cosmo Research Inst 低誘電性樹脂組成物
TWI478810B (zh) * 2008-03-25 2015-04-01 Ajinomoto Kk An insulating resin sheet, and a multilayer printed circuit board using the same
DE602009000326D1 (de) * 2008-04-01 2010-12-23 Mitsubishi Gas Chemical Co Harzzusammensetzung, Prepreg und mit einer Metallfolie kaschiertes Laminat
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
JPWO2012063918A1 (ja) * 2010-11-12 2014-05-12 国立大学法人東北大学 多層配線基板
EP2762507B1 (en) * 2011-09-30 2016-11-02 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, and metal foil-clad laminate
US9258891B2 (en) * 2012-03-19 2016-02-09 Asahi Kasei E-Materials Corporation Prepreg comprising polyphenylene ether particles
JP5955156B2 (ja) * 2012-08-10 2016-07-20 ナミックス株式会社 樹脂組成物、ならびに、それによる接着フィルムおよびカバーレイフィルム
JP6136330B2 (ja) 2013-02-13 2017-05-31 味の素株式会社 薄型フィルム用樹脂組成物、薄型フィルム、積層シート及び多層プリント配線板
TWI668269B (zh) * 2014-06-30 2019-08-11 日商味之素股份有限公司 Resin composition

Also Published As

Publication number Publication date
KR102422859B1 (ko) 2022-07-21
KR20170113284A (ko) 2017-10-12
TWI721130B (zh) 2021-03-11
TW201738311A (zh) 2017-11-01
JP2017177469A (ja) 2017-10-05
CN107236252A (zh) 2017-10-10

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