JP6669029B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP6669029B2 JP6669029B2 JP2016189179A JP2016189179A JP6669029B2 JP 6669029 B2 JP6669029 B2 JP 6669029B2 JP 2016189179 A JP2016189179 A JP 2016189179A JP 2016189179 A JP2016189179 A JP 2016189179A JP 6669029 B2 JP6669029 B2 JP 6669029B2
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016189179A JP6669029B2 (ja) | 2016-09-28 | 2016-09-28 | 半導体装置の製造方法 |
| US15/697,261 US10083918B2 (en) | 2016-09-28 | 2017-09-06 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016189179A JP6669029B2 (ja) | 2016-09-28 | 2016-09-28 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018056257A JP2018056257A (ja) | 2018-04-05 |
| JP2018056257A5 JP2018056257A5 (https=) | 2018-12-27 |
| JP6669029B2 true JP6669029B2 (ja) | 2020-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016189179A Active JP6669029B2 (ja) | 2016-09-28 | 2016-09-28 | 半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10083918B2 (https=) |
| JP (1) | JP6669029B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962995A (zh) * | 2018-07-17 | 2018-12-07 | 深圳大学 | 复合GaN基膜和MOSFET器件 |
| CN112750890A (zh) * | 2019-10-29 | 2021-05-04 | 季优科技(上海)有限公司 | 一种具有浮岛结构的沟槽型垂直氮化镓功率器件 |
| JP7294098B2 (ja) * | 2019-12-05 | 2023-06-20 | 豊田合成株式会社 | p型III族窒化物半導体の製造方法 |
| CN112186034A (zh) * | 2020-10-22 | 2021-01-05 | 西安电子科技大学 | 一种带有斜场板结构的氮化镓肖特基二极管及其制作方法 |
| JP7578525B2 (ja) * | 2021-03-29 | 2024-11-06 | 株式会社デンソー | 窒化物半導体装置の製造方法 |
| JP7572309B2 (ja) * | 2021-06-17 | 2024-10-23 | 株式会社デンソー | 窒化物半導体装置の製造方法 |
| JP7586776B2 (ja) * | 2021-06-17 | 2024-11-19 | 株式会社デンソー | 半導体装置とその製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3244980B2 (ja) | 1995-01-06 | 2002-01-07 | 株式会社東芝 | 半導体素子の製造方法 |
| US5656832A (en) | 1994-03-09 | 1997-08-12 | Kabushiki Kaisha Toshiba | Semiconductor heterojunction device with ALN buffer layer of 3nm-10nm average film thickness |
| JP3948452B2 (ja) * | 2003-11-04 | 2007-07-25 | 松下電器産業株式会社 | 荷重センサ及びその製造方法 |
| JP2006032552A (ja) | 2004-07-14 | 2006-02-02 | Toshiba Corp | 窒化物含有半導体装置 |
| JP2007317794A (ja) * | 2006-05-24 | 2007-12-06 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| US8823057B2 (en) * | 2006-11-06 | 2014-09-02 | Cree, Inc. | Semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices |
| JP6260145B2 (ja) * | 2013-08-27 | 2018-01-17 | 富士電機株式会社 | 半導体装置の製造方法 |
| FR3026557B1 (fr) * | 2014-09-26 | 2018-03-16 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de dopage d'un semi-conducteur a base de gan |
| FR3026558B1 (fr) * | 2014-09-26 | 2018-03-09 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede d'activation de dopants dans une couche semi-conductrice a base de gan |
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2016
- 2016-09-28 JP JP2016189179A patent/JP6669029B2/ja active Active
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2017
- 2017-09-06 US US15/697,261 patent/US10083918B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018056257A (ja) | 2018-04-05 |
| US20180090452A1 (en) | 2018-03-29 |
| US10083918B2 (en) | 2018-09-25 |
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