JP6662610B2 - Optical sensor device - Google Patents

Description

  The present invention relates to an optical sensor device.

  As this kind of conventional technology, for example, there is one disclosed in Patent Document 1. In this document, as shown in FIG. 15, a technique is disclosed in which a filter section including an optical filter is attached to a light receiving section including a light receiving element to form an infrared light receiving device in a photocoupler. In addition, the above-described infrared light receiving device is generally bonded to the surface of a wiring board via solder or the like, and an output is taken out.

JP 2012-199311 A

By the way, the solder paste contains a flux. This flux chemically removes the oxide film on the surface of the metal to be soldered, and makes the solderable state. In the reflow soldering, the temperature of the solder paste increases in a heating step when the light receiving device is mounted on a substrate. Then, the flux in the solder paste spreads on the surface of the metal to be joined and chemically removes the oxide film, and the solder powder in the solder paste melts and joins with the metal surface.
Here, when the light receiving device is formed by attaching the filter portion to the light receiving portion as described above, in the step of mounting the light receiving device on the substrate, the flux contained in the solder paste is diffused, and the light receiving portion and the filter portion are separated from each other. There is a possibility that the flux may enter the light receiving device from the gap between the joints. If the flux that has entered the inside of the light receiving device adheres to the surface of the light receiving element or the optical filter, the incidence of light on the light receiving element may be hindered, and the light may not be detected accurately.

  Therefore, the present invention has been made in view of such circumstances, and an object of the present invention is to provide an optical sensor device capable of preventing flux from entering.

As a result of intensive studies to solve the above problems, the present inventors have found that the above problems can be solved by the following optical sensor device, and have completed the present invention.
That is, an optical sensor device according to one embodiment of the present invention includes a light detection unit including a light receiving element that outputs an electric signal corresponding to received light, and a filter unit including an optical filter, and the light receiving element includes the light receiving element. A mounting substrate having a sensor device in which the light detection unit and the filter unit are joined so as to be optically connected to the outside via an optical filter, a support substrate, and a land electrode provided on the support substrate Wherein the sensor device has an opposing surface facing the surface having the land electrodes on the mounting substrate, and the opposing surface includes an end of a bonding surface between the light detection unit and the filter unit. the said light detecting unit and the land electrode is connected through a solder, and an end portion of the front Kise' mating surface is spaced above 50μm from the mounting substrate, and an end portion of said joining surface The distance to the solder is 25 and wherein the at μm or more.

Further, an optical sensor device according to another aspect of the present invention includes a light detection unit including a light receiving element that outputs an electric signal corresponding to received light, and a filter unit including an optical filter, wherein the light receiving element A sensor device in which the light detection unit and the filter unit are joined so as to be optically connected to the outside via the optical filter; a first support substrate; and a sensor device provided on the first support substrate. A mounting substrate having a first land electrode, a second support substrate, and a sub-substrate having a second land electrode provided on the second support substrate. is the back-side of the plane including the light receiving element and the second land electrode is connected through a first solder side to the first land electrode of the sub-substrate of, said light detector release the end of the junction surface between the filter unit before you instrumentation substrate As arranged, are connected via a second solder, the sensor device has a facing surface facing the surface having the first land electrode on the mounting board, the facing surface, the junction And an end of the bonding surface is at least 50 μm away from the mounting substrate, and a distance between the end of the bonding surface and the second solder is at least 250 μm. And

  According to one embodiment of the present invention, an optical sensor device capable of preventing flux from entering can be realized.

FIG. 2 is a cross-sectional view illustrating a configuration example of the optical sensor device 100 according to the first embodiment. FIG. 3 is a plan view illustrating a configuration example of a filter unit 70. FIG. 2 is a plan view showing a configuration example of the optical sensor device 100. It is a sectional view showing the example of composition of optical sensor device 200 concerning a 2nd embodiment. FIG. 2 is a plan view illustrating a configuration example of an optical sensor device 200. It is a sectional view showing the example of composition of optical sensor device 300 concerning a 3rd embodiment. FIG. 3 is a plan view illustrating a configuration example of an optical sensor device 300. It is a sectional view showing the example of composition of optical sensor device 400 concerning a 4th embodiment. It is a sectional view showing the 1st example of composition of optical sensor device 500 concerning a 5th embodiment. FIG. 9 is a cross-sectional view illustrating a second configuration example of the optical sensor device 500. It is a sectional view showing the example of composition of optical sensor device 600 concerning a 6th embodiment. FIG. 3 is a plan view illustrating a configuration example of an optical sensor device 600.

  Hereinafter, embodiments (first and second aspects, first to fifth embodiments) for carrying out the present invention will be described in detail. Note that the embodiments for carrying out the present invention exemplify configurations for embodying the technical idea of the present invention, and the materials, shapes, structures, arrangements, dimensions, etc. of the respective parts are as follows. Not specified. The technical concept of the present invention can be variously modified within the technical scope defined by the claims described in the claims.

<First aspect>
(1) Optical sensor device The optical sensor device according to the first aspect has a light detecting unit including a light receiving element that outputs an electric signal corresponding to received light, and a filter unit including an optical filter, and includes a light receiving element. A sensor device in which the light detection unit and the filter unit are joined so that they are optically connected to the outside via an optical filter, a mounting substrate having a support substrate and a land electrode provided on the support substrate, , Is provided. The light detection unit and the land electrode are connected, and the end of the joint surface between the light detection unit and the filter unit is at least 50 μm away from the mounting board. That is, the light detection unit and the land electrode are connected via solder or the like so that the end of the joint surface between the light detection unit and the filter unit is arranged away from the mounting board. The end of the joint surface and the mounting substrate are separated by 50 μm or more. Accordingly, it is possible to realize an optical sensor device in which the intrusion of flux is prevented and the accuracy of light detection is improved.

In the first embodiment, the reason why the distance between the end of the bonding surface and the mounting board (that is, the separation distance) is 50 μm or more is that when the manufacturing error and the material variation are considered, the distance is smaller than 50 μm. This is because the flux reaches the bonding surface due to the capillary phenomenon due to the short separation distance and penetrates into the inside of the sensor device.
In an experiment conducted by the present inventors, in the four lots of optical sensor devices having the separation distance of 0 μm and the one lot of optical sensor devices having the separation distance of 20 μm, all of the optical sensor devices have a distance to the bonding surface. It was confirmed that there was flux intrusion. On the other hand, in the optical sensor devices of three lots in which the separation distance was 50 μm, it was confirmed that no flux penetrated into the bonding surface in all the optical sensor devices.

At this time, the distance between the solder paste application end of the land electrode and the end of the joint surface between the photodetector and the filter was 250 μm. That is, it is considered that the flux diffuses 250 μm or more on the support substrate. However, when the above-mentioned separation distance is 50 μm or more, the diffusion is suppressed on the lower surface side of the sensor device which is arranged separately from the mounting substrate. It is considered that as a result, the flux did not reach the end of the joint surface, and as a result, the flux did not enter the inside of the sensor device from the end of the joint surface.
The above-mentioned separation distance means a distance between the end of the joint surface and the mounting substrate when the flux is diffused in a solder heating step such as solder reflow, and is applied in advance before the heating step. Needless to say, this does not include the state in which the sensor device is mounted on the solder paste. Further, it is needless to say that the above-mentioned separation distance is the shortest distance when there is unevenness due to manufacturing variations of the package and the substrate.

  In the optical sensor device according to the first aspect, the land electrode may not be present between the end of the bonding surface and the support substrate. That is, the land electrode may be provided only at a position deviated from between the end of the bonding surface and the support substrate. Thereby, the above-mentioned separation distance can be further increased, and the intrusion of the flux into the inside of the sensor device at the time of reflow can be further prevented. Further, in the optical sensor device according to the first aspect, the support substrate may have a recess immediately below an end of the bonding surface. That is, the concave portion may be formed at a position facing the end of the bonding surface of the support substrate. Thus, the distance between the end of the bonding surface and the mounting substrate can be further increased, and the intrusion of flux into the sensor device during reflow can be further prevented.

(2) Sensor device The sensor device provided in the optical sensor device has a light detection unit including a light receiving element that outputs an electric signal according to received light, and a filter unit including an optical filter, and the light receiving element is an optical filter. The light detection unit and the filter unit are joined so as to be optically connected to the outside via the light detection unit.
The light detection unit and the filter unit may be joined in a state of direct contact, or may be joined via an adhesive or the like. When joining the light detection unit and the filter unit, use a method of applying an adhesive to at least a part of the light detection unit or the part where the light detection unit is joined, a method of fitting the light detection unit to the filter unit, or the like. Can be. At least a portion of the end of the joining surface may have a gap leading to the inside of the sensor device.
On the side of the sensor device facing the support substrate, a concave portion having an end of the joint surface as a bottom may be formed. Here, the shape of the concave portion may be a triangular pyramid shape or a rectangular parallelepiped shape. The concave portion can be formed by applying a convex shape to the mold used in the molding step. Further, it can be formed by a step of chamfering the corner of the joint surface or a step of cutting the joint surface. Thus, the distance between the end of the joint surface and the mounting substrate can be further increased, and the intrusion of flux into the sensor device during reflow can be further prevented.

(2.1) Light Detector The light detector included in the sensor device includes a light receiving element that outputs an electric signal according to the received light. The light receiving element used in the present invention includes a photoelectric conversion unit. The photoelectric conversion unit may be a “quantum sensor” that outputs a signal by photoelectric conversion, such as a photodiode and a photoconductor. When the light is infrared light, the photoelectric conversion unit may be a “thermal sensor” that converts a temperature change due to infrared absorption into an electric signal, such as a thermopile or a pyroelectric sensor. From the viewpoint of minimizing power consumption by minimizing external power supply, it is preferable to use a quantum sensor for the photoelectric conversion unit. More specifically, the quantum sensor includes, but is not limited to, a quantum sensor having a PN or PIN junction structure using InSb. The periphery of the light receiving element included in the light detection unit may be molded with resin or the like.

(2.2) Filter unit The filter unit included in the sensor device includes an optical filter. For example, the filter unit includes a base, an opening that penetrates the base, and an optical filter that is disposed at least partially in the opening. In addition, since it is sufficient that an optical opening penetrating the base is formed, the optical filter may protrude from the surface of the base. The filter unit is joined to the light detection unit such that the light receiving element of the light detection unit is optically connected to the outside via the optical filter.
The optical filter used in the present invention may have a function of transmitting light in a desired wavelength range selectively (that is, high transmittance). For example, the optical filter may have a function of transmitting only light in a specific wavelength band. Alternatively, the optical filter may have a function of merely transmitting light, such as a transmission cover or a lens. Various materials, such as resin, can be used for the base of the filter portion depending on the characteristics of the optical sensor device.

(2.3) Opening The shape of the opening of the filter unit is such that an optical filter can be arranged and the light receiving element is optically connected to the outside via the optical filter arranged in the opening. There is no particular limitation as long as it has a shape. As a specific example, it is conceivable to form a cylindrical or rectangular parallelepiped hole in the filter portion and form an optical filter in a part of the cylindrical hole, but the present invention is not particularly limited to this.

(3) Mounting Substrate The mounting substrate provided in the optical sensor device has a support substrate and land electrodes provided on the support substrate. Here, the land electrode may be a plurality of land electrodes. Further, the mounting substrate may further include an insulating film covering a part of the surface of the supporting substrate.

(3.1) Support Substrate The support substrate included in the mounting substrate is not particularly limited as long as a land electrode or an insulating film is formed on the support substrate and a sensor device can be installed thereon. The material of the support substrate is not particularly limited. For example, FR4, ceramics substrate, Si substrate, GaAs substrate, sapphire and the like can be mentioned, but not limited thereto.

(3.2) Land electrode The land electrode of the mounting substrate is provided on the support substrate. As the land electrode used in the present invention, an electrode made of an appropriate metal or alloy such as Al, Cu, Ag, or Au can be used. It is not particularly limited as long as it can be taken. Actually, the connecting metal wiring from the land to another component extends on the support substrate. Note that these connection metal wirings are not shown in each drawing.

(3.3) Insulating Film The insulating film included in the mounting substrate covers a part of the surface of the supporting substrate. As a material for forming the insulating film, a solder resist, polyimide, a silicon-based resin, or the like can be used, but is not particularly limited thereto.

(3.4) Solder The sensor device is connected to a land electrode on the mounting board via solder. The solder is applied in a paste state called a solder paste, and reflow is performed to remove the flux in the solder paste and perform soldering. This solder paste consists of solder powder and flux. When the temperature of the solder paste rises in the heating step, the flux in the solder paste spreads on the metal surface to be joined and chemically removes the oxide film. By melting and joining to the metal surface, the solder is fixed to the metal surface. As a material for the solder, a mixed powder of metals such as tin, silver, copper, lead, and indium can be used, but is not particularly limited thereto. As a material of the solder paste, a mixed material such as solder and flux can be used, but the material is not particularly limited to these.
In addition, although a flux is described as a diffusion material, the material is not particularly limited as long as it is a substance that diffuses during mounting. For example, there is a temporary fixing agent or a potting liquid for fixing the mounting board and the electronic component at the time of mounting.

<Second aspect>
(1) Optical Sensor Device An optical sensor device according to a second aspect includes a light detecting unit including a light receiving element that outputs an electric signal according to received light, and a filter unit including an optical filter, and includes a light receiving element. A sensor device in which the light detection unit and the filter unit are joined so that the optical device is optically connected to the outside via an optical filter, a first support substrate, and a first device provided on the first support substrate. And a sub-substrate having a second support substrate and a second land electrode provided on the second support substrate. The back side of the surface including the light receiving element in the light detection unit and the second land electrode are connected via solder. Sub substrate and the first land electrode, side surfaces of the sub-substrate to the surface of the implementation substrate and connected via solder or the like.
Further, the mounting substrate may further include an insulating film covering a part of the surface of the first support substrate. The insulating film may be interposed between the end of the bonding surface and the first support substrate.

(2) Sub-substrate The sub-substrate included in the optical sensor device has a second support substrate and a second land electrode provided on the second support substrate. The sub-substrate may further include an insulating film covering a part of the surface of the second support substrate. The sub-board is a relay board that relays the sensor device and the mounting board.
The sub-substrate, as the side surface of the sub-board is disposed on the implementation substrate, as long as it is connected to the first land electrode of the mounting substrate via solder or the like is not particularly limited. The material of the second support substrate is not particularly limited. That is, examples of the second support substrate include, but are not limited to, FR4, a ceramic substrate, a Si substrate, a GaAs substrate, and sapphire.

<Embodiment>
Hereinafter, first to sixth embodiments will be described as specific examples of the first and second aspects described above with reference to the drawings. Note that the present invention is not limited to the following first to sixth embodiments. In the drawings, parts having the same configuration are denoted by the same reference numerals, and repeated description will be omitted.

(1) First Embodiment First, a first embodiment of the present invention will be described.
FIG. 1 is a cross-sectional view illustrating a configuration example of an optical sensor device 100 according to the first embodiment of the present invention. FIG. 2 is a plan view showing a configuration example of the filter unit 70. FIG. 3 is a plan view showing a configuration example of the optical sensor device 100. Note that a cross-sectional view taken along line AA ′ of the plan view shown in FIG. 3 corresponds to FIG.
As shown in FIGS. 1 to 3, the optical sensor device 100 includes a mounting substrate 10 and a sensor device 50 mounted on the mounting substrate 10. The mounting substrate 10 includes a support substrate 11, land electrodes 13 provided on the support substrate 11, and an insulating film 15 covering a part of the surface 11a of the support substrate 11.

The sensor device 50 includes a light detection unit 60 and a filter unit 70. The light detection unit 60 includes a light receiving element 61 that outputs an electric signal corresponding to the received light, and a mold member 63 that covers a surface of the light receiving element 61 other than the light receiving surface 61a. The filter section 70 includes a base 71, an opening 73 provided in the base 71, and an optical filter 75 arranged in the opening 73. The opening 73 is, for example, a cylindrical hole penetrating the base 71. An optical filter 75 is fitted into the opening 73 at a position on the light detection unit side.
In the optical sensor device 100, the light detection unit 60 and the filter unit 70 are joined so that the light receiving element 61 is optically connected to the outside via the optical filter 75. In addition, the light detection unit 60 and the land electrode 13 of the mounting substrate 10 are interposed via the solder 17 so that the end 81 of the bonding surface 80 between the light detection unit 60 and the filter unit 70 is separated from the mounting substrate 10. Connected. The end 81 of the bonding surface 80 and the mounting substrate 10 are separated by 50 μm or more. That is, the distance L between the end portion 81 of the bonding surface 80 and the mounting board 10 is 50 μm or more. Accordingly, it is possible to realize an optical sensor device in which flux is prevented from entering the inside of the sensor device 50 and the accuracy of light detection is improved.

  In the present invention, the light detection unit 60 and the filter unit 70 may be joined in a state of being in direct contact with each other, or may be joined via an adhesive or the like. When the light detection unit 60 and the filter unit 70 are in direct contact with each other, the bonding surface means a contact interface between the light detection unit 60 and the filter unit 70. In addition, as shown in FIG. 1 and the like, when the light detection unit 60 and the filter unit 70 are joined via the adhesive 90, the joint surface is the (adhesive 90 Means a plane passing through an intermediate position in the thickness direction of the joint. Each drawing of the present embodiment illustrates a case where the light detection unit 60 and the filter unit 70 are joined via an adhesive 90, and the joint has a thickness equivalent to the adhesive 90.

  The insulating film 15 may cover a part of the land electrode 13 or may surround the land electrode 13 without covering the land electrode 13 (in each drawing of the present embodiment, the insulating film 15 is , And the surrounding area is illustrated.) Further, it is desirable that the insulating film 15 is not disposed between the supporting substrate 11 and the end 81 of the bonding surface 80 on the supporting substrate 11 side. That is, it is desirable that the insulating film 15 be disposed in a region other than the range in which the flux spreads on the surface 11a of the support substrate 11. The reason is that the flux spreads between the end portion 81 of the bonding surface 80 and the support substrate 11, and when the insulating film 15 is disposed within this range, the insulating film 15 is generally uniformly disposed on the support substrate. For this reason, it is not possible to secure a separation distance between the end portion 81 of the bonding surface 80 and the mounting substrate 10. However, if the insulating film 15 can be partially thinned and the distance between the end portion 81 of the bonding surface 80 and the support substrate 11 can be set to 50 μm or more, they may be provided.

Further, the insulating film 15 may be used as a spacer for holding the position of the end portion 81 of the joint surface 80 between the light detection unit 60 and the filter unit 70 with respect to the mounting substrate 10. For example, the insulating film 15 may be arranged in a region on the support substrate 11 outside the range where the flux spreads, and the insulating film 15 may be used as the spacer.
When wiring is performed from the land electrode 13 to another component or the like, the wiring may be arranged so that the distance between the end portion 81 of the bonding surface 80 and the mounting substrate 10 is 50 μm or more. Here, it is desirable that the wiring is arranged so as not to pass between the end portion 81 of the bonding surface 80 and the support substrate 11 (that is, immediately below the end portion 81 of the bonding surface 80). The drawing wiring is not shown.

  Further, in addition to the output electrodes of the sensor device 50, a required number of land electrodes 13 such as fixing electrodes may be arranged on the surface 11a of the support substrate 11. Further, it is desirable that the solders 17 are arranged so as to form a set by joining at two places with the joining surface 80 interposed therebetween. For example, the solders 17 are arranged in pairs with the joint surface 80 interposed therebetween, and the distance from one solder 17 to the joint surface 80 and the distance from the other solder 17 to the joint surface 80 are made equal. Thus, the attractive force from the solder joint at the time of reflow can be balanced, so that the sensor device 50 can be prevented from being displaced with respect to the mounting board 10.

(2) Second Embodiment Next, a second embodiment of the present invention will be described.
FIG. 4 is a cross-sectional view illustrating a configuration example of the optical sensor device 200 according to the second embodiment of the present invention. FIG. 5 is a plan view showing a configuration example of the optical sensor device 200. Note that a cross-sectional view taken along the line BB 'of the plan view shown in FIG. 5 corresponds to FIG.
As shown in FIGS. 4 and 5, in the optical sensor device 200 according to the second embodiment, the difference from the optical sensor device 100 according to the first embodiment is that the end portion 81 of the bonding surface 80 and the support substrate 11 are different from each other. Is that the land electrode 13 does not exist between them. That is, in the optical sensor device 200, the land electrode 13 is provided only at a position separated from between the end portion 81 of the bonding surface 80 and the support substrate 11. Except for this, the second embodiment is the same as the first embodiment.
Thus, in the optical sensor device 200, the distance between the end portion 81 of the bonding surface 80 and the mounting substrate 10 can be further increased, and the intrusion of flux into the sensor device 50 during reflow can be further prevented. . Further, if the solder spreads on the land electrode 13 during reflow, the number of solder portions joining the land electrode and the electrode of the sensor device is reduced, resulting in insufficient bonding or no bonding, which is effective as a measure against soldering.

(3) Third Embodiment Next, a third embodiment of the present invention will be described.
FIG. 6 is a cross-sectional view illustrating a configuration example of an optical sensor device 300 according to the third embodiment of the present invention. FIG. 7 is a plan view showing a configuration example of the optical sensor device 300. A cross-sectional view of the plan view shown in FIG. 7 taken along line CC ′ corresponds to FIG.
As shown in FIGS. 6 and 7, in the optical sensor device 300 according to the third embodiment, the difference from the optical sensor device 200 according to the second embodiment is that, in plan view, the surrounding electrodes 21 are arranged around the sensor device. Is provided. The peripheral electrode 21 is formed, for example, simultaneously with the land electrode 13 in the same step. The peripheral electrode 21 is made of the same material as the land electrode 13 and has the same height from the surface 11 a of the support substrate 11. Except for this, the third embodiment is the same as the second embodiment.
Further, the peripheral electrode 21 and the insulating film 15 may be used as a positioning material for holding the position of the end 81 of the joint surface 80 between the light detection unit 60 and the filter unit 70 with respect to the mounting substrate 10. For example, the surrounding electrode 21 and the insulating film 15 may be arranged in a region on the support substrate 11 other than the area where the flux spreads, and the surrounding electrode 21 and the insulating film 15 may be used as the positioning material.

(4) Fourth Embodiment Next, a fourth embodiment of the present invention will be described.
FIG. 8 is a cross-sectional view illustrating a configuration example of an optical sensor device 400 according to the fourth embodiment of the present invention. As shown in FIG. 8, in the optical sensor device 400 according to the fourth embodiment, the difference from the optical sensor device 200 according to the second embodiment is that the end portion 81 of the bonding surface 80 of the support substrate 11 faces. The point is that the concave portion 23 is formed at the position (that is, immediately below the end portion 81). Except for this, the fourth embodiment is the same as the second embodiment. Thereby, the separation distance L between the end portion 81 of the bonding surface 80 and the mounting substrate 10 can be further increased, and the penetration of the flux into the inside of the sensor device at the time of reflow can be further prevented.

(5) Fifth Embodiment Next, a fifth embodiment of the present invention will be described.
FIG. 9 is a cross-sectional view illustrating a first configuration example of the optical sensor device 500 according to the fifth embodiment of the present invention. FIG. 10 is a sectional view showing a second configuration example of the optical sensor device 500.
As shown in FIGS. 9 and 10, in the optical sensor device 500 according to the fifth embodiment, the difference from the optical sensor device 100 according to the first embodiment is that a surface of the sensor device 50 facing the support substrate 11 (for example, , Lower surface) is formed with a concave portion 51 having the end portion 81 of the joint surface 80 as a bottom portion. Except for this point, the fifth embodiment is the same as the first embodiment. As shown in FIG. 9, the concave portion 51 may be formed in a rectangular parallelepiped shape (rectangular in cross section). Further, as shown in FIG. 10, the concave portion 51 may be formed in a triangular pyramid shape (a triangular shape in a sectional view). Accordingly, the distance L between the end portion 81 of the joint surface 80 and the mounting substrate 10 can be further increased, and the intrusion of flux into the sensor device 50 during reflow can be further prevented.

(6) Sixth Embodiment Next, a sixth embodiment of the present invention will be described.
FIG. 11 is a cross-sectional view illustrating a configuration example of an optical sensor device 600 according to the sixth embodiment of the present invention. FIG. 12 is a plan view showing a configuration example of the optical sensor device 600. A cross-sectional view of the plan view shown in FIG. 12 taken along line DD ′ corresponds to FIG. As shown in FIGS. 11 and 12, the optical sensor device 600 includes the mounting substrate 10, the sub substrate 40, and the sensor device 50.
Each configuration example of the mounting board 10 and the sensor device 50 is, for example, as described in the first to fifth embodiments. The sub-substrate 40 includes a support substrate 41 and a land electrode 43 provided on the support substrate 41. As shown in FIG. 11, the land electrodes 43 are formed on the front surface 41a and the back surface 41b of the support substrate 41. Here, the front surface 41a is a first main surface of the support substrate 41, and the back surface 41b is a second main surface of the support substrate 41.

In the optical sensor device 600, the back side of the surface of the light detection unit 60 including the light receiving element 61 and the land electrode 43 of the sub-substrate 40 are connected via the solder 47. The sub-board 40 and the land electrodes 13 of the mounting board 10 are connected via the solder 17 so as to be arranged on the side surface of the sub-board 40 and on the surface of the mounting board. Further, the insulating film 15 covering a part of the surface 11 a of the support substrate 11 may be interposed between the end portion 81 of the bonding surface 80 and the support substrate 11.
Thereby, the end portion 81 of the joint surface 80 can be kept away from the range where the flux spreads. Accordingly, it is possible to prevent flux from entering the inside of the sensor device 50 during reflow without performing special processing on the sensor device 50 and the mounting board 10.

<Effects of Embodiment>
According to the first to sixth embodiments of the present invention, it is possible to realize an optical sensor device capable of preventing flux from entering. Further, by preventing flux from entering the inside of the sensor device 50, an optical sensor device with improved light detection accuracy can be realized.

<Modification>
(1) In the above embodiment, the case where the outer periphery of the land electrode 13 is separated from the insulating film 15 is illustrated. However, the present embodiment is not limited to this. The outer periphery of the land electrode 13 may be in contact with the insulating film 15. Further, at least a part of the outer periphery of the land electrode 13 may be covered with the insulating film 15. Even in such a case, the effects of the embodiment can be obtained.
(2) In the above-described embodiment, the surface of the light detecting unit 60 facing the filter unit 70 and the surface of the filter unit 70 facing the light detecting unit 60 are flat, and both flat surfaces are the adhesive 90. Are shown in the figure. However, the present embodiment is not limited to this.
For example, the opposing surfaces are provided with irregularities, and the light detecting unit 60 and the filter unit 70 may be joined to each other by fitting a convex portion of one surface into a concave portion of the other surface. . Further, even when the unevenness is provided, an adhesive may be interposed between the opposed surfaces. Even in such a case, the effects of the embodiment can be obtained.

<Appendix>
The technical concept of the present invention is not limited to the above-described embodiments (first and second aspects, first to sixth embodiments, and modifications) for implementing the present invention. Based on the knowledge of those skilled in the art, the first and second aspects, the first to sixth embodiments, and modifications may be modified in design, and the first and second aspects, first to sixth aspects, and modifications may be added. The sixth embodiment and the modified examples may be arbitrarily combined, and a form in which such a change is added is also included in the technical concept of the present invention.

10 mounting board 11 support board (first support board)
11a Surface 13 Land electrode (first land electrode)
15 Insulating film 17 Solder 21 Peripheral electrode 23 Depression 40 Sub-substrate 41 Support substrate (second support substrate)
41a Surface 43 Land electrode (second land electrode)
47 Solder 50 Sensor device 51 Recess 60 Light detecting unit 61 Light receiving element 61a Light receiving surface 63 Mold member 70 Filter unit 71 Base 73 Opening 75 Optical filter 80 Joining surface 81 End 90 Adhesive 100, 200, 300, 400, 500, 600 Optical sensor device

Claims (6)

A light detecting unit including a light receiving element that outputs an electric signal corresponding to the received light; and a filter unit including an optical filter, wherein the light receiving element is optically connected to the outside via the optical filter. A sensor device in which the light detection unit and the filter unit are joined,
A mounting substrate having a supporting substrate and a land electrode provided on the supporting substrate,
With
The sensor device has a facing surface facing the surface having the land electrodes on the mounting board,
The facing surface includes an end of a joining surface between the light detection unit and the filter unit,
The light detection unit and the land electrode are connected via solder , and
End of the front Kise' mating surface is spaced above 50μm from the mounting substrate, and,
An optical sensor device , wherein a distance between an end of the bonding surface and the solder is 250 μm or more .   The optical sensor device according to claim 1, wherein the land electrode is provided only at a position deviated from between an end of the bonding surface and the support substrate. The optical sensor device according to claim 1 , wherein a concave portion is formed at a position facing an end of the bonding surface of the support substrate and away from the solder .   4. The optical sensor device according to claim 1, wherein a concave portion having an end of the bonding surface as a bottom is formed on a surface of the sensor device facing the support substrate. 5. A light detecting unit including a light receiving element that outputs an electric signal corresponding to the received light; and a filter unit including an optical filter, wherein the light receiving element is optically connected to the outside via the optical filter. A sensor device in which the light detection unit and the filter unit are joined,
A mounting substrate having a first support substrate, and a first land electrode provided on the first support substrate;
A second support substrate, and a sub-substrate having a second land electrode provided on the second support substrate,
A back side of a surface including the light receiving element in the light detection unit and the second land electrode are connected via a first solder,
Side and the first land electrode of the sub-substrate, so as to spaced apart end portion of the junction surface between the filter portion and the light detecting unit before it instrumentation substrate via a second solder are connected,
The sensor device has an opposing surface facing the surface having the first land electrode on the mounting substrate,
The facing surface includes an end of the bonding surface,
An end of the bonding surface is separated from the mounting board by 50 μm or more, and
The optical sensor device , wherein a distance between an end of the joint surface and the second solder is 250 μm or more . The mounting substrate further includes an insulating film covering a part of a surface of the first support substrate,
6. The insulating film is interposed between an end of the joint surface and the first support substrate.
3. The optical sensor device according to claim 1.

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