JP4793099B2 - Optical module - Google Patents

Description

The present invention relates to an optical module used for optical interconnection.

  In recent years, optical interconnection, which is a technique for transmitting signals within a system apparatus and between apparatuses at high speed, has been spreading. In other words, the optical interconnection is a technology in which an optical component is handled as if it were an electrical component and surface-mounted on a mother board or circuit board such as a personal computer, a vehicle, or an optical transceiver.

  As a conventional optical module used for optical interconnection, there is an optical module 281 as shown in FIG.

  This optical module 281 forms a circuit pattern in a ceramic package 282 having a cavity with an open top, and a plurality of photoelectric conversion elements (semiconductor laser (LD) and photodiode (PD) 283) are mounted on the circuit pattern. The upper part of the ceramic package 282 is covered and hermetically sealed with a metal lid 285 in which a glass window 284 serving as an optical path is bonded with low-melting glass, and in the optical module 281, an optical signal from the photoelectric conversion element 283. Is output through the glass window 284, collected by the lens 286, and transmitted to the outside.

  The photoelectric conversion element 283 is electrically connected to the circuit pattern by wire w by wire bonding. The lid 285 is joined to the ceramic package 282 by resistance welding or soldering.

  The prior art document information related to the invention of this application includes the following.

JP 2005-292739 A

  However, the conventional optical module 281 needs to use two parts of the glass window 284 and the lid 285 in order to house the photoelectric conversion element 283 in the ceramic package 282 and hermetically seal it, and there is a problem that the number of parts is large. There is. As a result, the structure of the ceramic package 282 and the optical module 281 itself becomes complicated.

  In the conventional optical module 281, a resistance welding metal frame 287 must be attached to the upper edge surface of the ceramic package 282. In consideration of the accuracy of the thickness of the metal frame 287, the accuracy of the thickness of the brazing material b for fixing the metal frame 287 and the ceramic package 282, and the variation in the melting amount of the protrusions on the upper surface of the metal frame 287, And the photoelectric conversion element 283 must be separated from each other with a margin.

More specifically, the height L2 (about 0.5 mm) of the wire w, the thickness t (about 0.3 mm) of the glass window 284, and the height direction when the lid 285 is welded to the ceramic package 282 by resistance welding. If the variation ΔL (about 0.1 mm), the distance L between the photoelectric conversion element 283 and the lens 286 is
L> L2 + t + ΔL
In view of the dimensional accuracy of other members, 1.0 mm or more is required.

  In general, since the photoelectric conversion element 283 is configured by arranging LDs and PDs in an array with a narrow pitch (for example, 250 μm), the longer the distance L, the more light leaks into the adjacent channel, and the optical module 281. There is a problem that does not work properly.

An object of the present invention, fewer parts, has a simple structure, is to provide an optical module is no light leakage to an adjacent channel.

The present invention was devised to achieve the above object. The gist of the present invention is that a circuit pattern is formed in a package having an upper opening, a light transmitting member is provided on the upper part of the package, and a plurality of elements are provided in the package. In an optical module that contains individual photoelectric conversion elements and is hermetically sealed, a circuit pattern is formed on the back surface of the transparent inorganic material substrate serving as the light transmission member, and a plurality of photoelectric conversion elements are mounted on the circuit pattern. And forming a package side electrode on the upper edge surface of the package, forming a substrate side electrode on the back surface of the inorganic material substrate corresponding to the package side electrode, and surrounding the package side electrode of the package. A side joining frame is formed, around the substrate-side electrode and the substrate-side electrode of the inorganic material substrate, or on the package side of the package The electrode and the package side bonding frame, mounted side by side a plurality of solder balls, the package side electrode and the substrate-side electrode with soldered, bonded to the inorganic material substrate to the package, the upper edge surface of the package This is an optical module in which a side wall is formed, solder is applied to the side wall and the upper edge surface of the inorganic material substrate, and a ring-shaped metal plate is provided so as to cover the applied solder .

  According to the present invention, the number of parts can be reduced and the structure can be simplified by integrating the conventional light transmitting member and the hermetic sealing cap with a single inorganic material substrate.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a perspective view of an optical module showing a preferred first embodiment of the present invention, FIG. 2 is a sectional view taken along line 2A-2A, FIG. 3 is an exploded perspective view thereof, and FIG. It is the disassembled perspective view and the perspective view of an inorganic material board | substrate.

  As shown in FIGS. 1 to 4, the optical module (hermetic sealed parallel optical module) 1 according to the first embodiment is surface-mounted on a motherboard or circuit board of a device such as a personal computer, a vehicle, or an optical transceiver. The area is about 1 cm × 1 cm.

  This optical module 1 has a cavity (cavity, dent, room) with an open top, a concave longitudinal cross section of the ceramic package 2, and an optical communication wavelength band that serves as a light transmission member that covers the top of the ceramic package 2. It is mainly composed of an inorganic material substrate 3 that is transparent to light.

The ceramic package 2 was used as the package when the inside of the package was hermetically sealed as described later, and the hermetic sealing level was 10 ⁻⁹ Pa · m ³ / s [He] or less in the He leak test. Because it is necessary to keep.

  A package side circuit pattern 4 is formed in the ceramic package 2. A part of the circuit pattern 4 is formed by connecting the upper edge surface and the bottom surface of the ceramic package 2. On the bottom surface of the ceramic package 2, a plurality of package-side solder balls 5 for mounting the optical module 1 on the motherboard or circuit board of the device are arranged in a grid. That is, the ceramic package 2 constitutes BGA (Ball Grid Array) solder.

  A plurality of package-side electrodes 6 that are electrically connected to the circuit pattern 4 are formed side by side on the upper edge surface of the ceramic package 2. Around the package side electrode 6 of the ceramic package 2, a package side joining frame 7 is formed of a metal such as Au / Ni. The package-side electrode 6 and the package-side joining frame 7 are collectively formed by, for example, photoetching Au / Ni foil.

As the inorganic material substrate 3, a substrate made of quartz glass or alumina single crystal Al ₂ O ₃ (so-called sapphire glass) is used. In this embodiment, a sapphire glass substrate is used as the inorganic material substrate 3.

  Since quartz glass has a low thermal conductivity of 1 to 2 W / (m · K), when a photoelectric conversion element or a semiconductor chip is mounted on the inorganic material substrate 3, the photoelectric conversion element or the semiconductor chip rises by 100 ° C. or more. In other words, malfunction may occur after commercialization. Although there is a method of reducing the thermal resistance by increasing the thickness of the inorganic material substrate 3, the distance between the photoelectric conversion element and the external optical system (such as a lens) is increased, and thus the strength of the thickness of the inorganic material substrate 3 is allowed. I want to make it as thin as possible. On the other hand, since sapphire glass has an extremely high thermal conductivity of 33.5 W / (m · K), the temperature rise of the photoelectric conversion element and the semiconductor chip can be suppressed to 10 ° C. or less. Further, sapphire glass is excellent in transparency with respect to light in a wide wavelength band.

  Further, as the sapphire glass to be used, light transmittance and thermal conductivity are important, and crystallinity (single crystal having a uniform crystal orientation) which is important when used as a substrate for a semiconductor thin film is not important. Therefore, by using a sapphire substrate with low crystallinity as the inorganic material substrate 3, the optical module 1 can be manufactured at low cost.

  A substrate-side circuit pattern 8 is formed on the back surface of the inorganic material substrate 3. The substrate-side circuit pattern 8 of the inorganic material substrate 3 includes a surface emitting laser array (VCSEL array) in which four LDs are arranged in an array with a narrow pitch (for example, 250 μm) as a photoelectric conversion element for transmission (for light emission). 9, a PD array 10 in which four photodiodes (PD) are arranged in an array at a narrow pitch (for example, 250 μm), and a VCSEL array 9 and a PD array 10 are controlled as receiving (receiving) photoelectric conversion elements. A control IC 11 and an electrical component 16 such as a resistor or a capacitor are mounted as a control semiconductor chip.

  The VCSEL array 9 is flip-chip mounted on the back surface of the inorganic material substrate 2. That is, the VCSEL array 9 is mounted such that the light emitting region of each LD faces the inorganic material substrate 3. Similarly, the PD array 10 is also flip-chip mounted on the back surface of the inorganic material substrate 2. That is, the PD array 10 is mounted such that the light receiving region of each PD faces the inorganic material substrate 3.

  The control IC 11 is a driver (LD drive circuit IC) as a drive circuit for driving each LD of the VCSEL array 9 and a preamplifier (PD drive circuit IC) as an amplifier circuit for amplifying an electric signal from each PD of the PD array 10. Etc.

  A plurality of substrate-side electrodes 12 are formed around the VCSEL array 9, the PD array 10, and the control IC 11 of the inorganic material substrate 3. These substrate-side electrodes 12 are electrically connected to the VCSEL array 9, the PD array 10, and the control IC 11.

  Around the substrate-side electrode 12 of the inorganic material substrate 3, a substrate-side bonding frame 13 having the same shape corresponding to the package-side bonding frame 7 is formed of a metal such as Au / Ni. The substrate-side joining frame 13 and the substrate-side electrode 12 are collectively formed by, for example, photoetching Au / Ni foil.

  A gap between the inorganic material substrate 3 and the VCSEL array 9 is filled with an underfill r that is transparent to light in the optical communication wavelength band and has a refractive index of 1.5 that is substantially the same as that of the inorganic material substrate 3. An epoxy resin is used as the underfill r. The underfill r is filled and then cured by heat treatment. Similarly, a transparent underfill is filled in the gap between the inorganic material substrate 3 and the PD array 10.

  A metal film 14 is formed of a metal such as Ni, Au, Pt, or Cr on the surface other than the optical path R of the inorganic material substrate 3. The metal film 14 is formed by plating, for example. Of the surface of the inorganic material substrate 3, the portion where the metal film 14 is not formed (the oval portion in FIGS. 1 and 4) becomes the optical path R.

  A through hole 15 is formed in the inorganic material substrate 3, and the metal film 14 is a solid GND layer (entire GND layer) constituting a part of the circuit pattern in the ceramic package 2 through the through hole 15, Alternatively, it is electrically connected to the GND of the mother board or circuit board.

  The assembly of the optical module 1 is as follows. First, after each optical component and each electrical component are flip-chip mounted on the inorganic material substrate 3, solder is applied to either the package side electrode 6 or the substrate side electrode 12 in advance, Solder is melted and applied to either the package-side joining frame 7 or the substrate-side joining frame 13.

  Then, in an atmosphere of an inert gas such as He or nitrogen, the package-side electrode 6 and the substrate-side electrode 12 are solder-bonded, and at the same time, the substrate-side bonding frame 12 is solder-bonded to the package-side bonding frame 7 so that both electrodes In the state where 6 and 12 are joined, the inorganic material substrate 3 is joined to the ceramic package 2 and hermetically sealed.

The reason why the solder is used for joining the package side joining frame 7 and the substrate side joining frame 13 is to keep the hermetic sealing level at 10 ⁻⁹ Pa · m ³ / s [He] or less in the He leak test. . For example, Au-Sn solder or Sn-Ag solder is used as the solder.

  Here, adhesives and synthetic resins cannot be used because they are non-hermetic seals. In particular, since the synthetic resin swells, the VCSEL array 9 and the PD array 10 are exposed to the outside air and moisture, which is not suitable. Further, the low melting point glass is not suitable because it has a high melting point and may damage the VCSEL array 9, the PD array 10, and the control IC 11 mounted on the inorganic material substrate 3.

  Finally, when a plurality of package-side solder balls 5 are arranged in a grid pattern on the back surface of the ceramic package 2 to form a BGA, the optical module 1 is assembled.

  In the assembly process described above, as shown in FIG. 5, it is preferable to work on a plurality of optical modules in a lump and finally diced and cut.

  The operation of the first embodiment will be described.

  In the optical module 1, four electrical signals from the mother board and the circuit board are transmitted in the order of the circuit pattern 4 of the ceramic package 2, the control IC 11, and the VCSEL array 9, and are converted into optical signals by the VCSEL array 9, respectively. Four optical signals are output upward from the array 9 through the inorganic material substrate 3 and the optical path R.

  On the other hand, in the optical module 1, the four optical signals input from above the inorganic material substrate 3 through the optical path R and the inorganic material substrate 3 are converted into electric signals by the PD array 10, respectively. The signals are transmitted in the order of the control IC 11, the circuit pattern 4 of the ceramic package 2, the mother board and the circuit board.

  Since the optical module 1 joins the inorganic material substrate 3 to the ceramic package 2 and hermetically seals with the package side electrode 6 and the substrate side electrode 12 joined, the ceramic package 2 and the inorganic material substrate 3 are electrically connected. Simultaneously with the connection, the inside of the ceramic package 2 can be hermetically sealed.

  Further, the optical module 1 forms a package side joining frame 7 on the ceramic package 2, and forms a substrate side joining frame 13 corresponding to the package joining frame 7 on the inorganic material substrate 3, and these package joining frame 7 and the substrate side joining By soldering the frame 13, the inorganic material substrate 3 is bonded to the ceramic package 2 and hermetically sealed.

  That is, the inorganic material substrate 3 has a glass window 284 as a light transmitting member in the conventional optical module 281 described with reference to FIG. 28, a lid 285 as a hermetic sealing cap, and a circuit board in which three components are integrated. It is a functional inorganic material substrate.

  Thereby, the number of parts of the optical module 1 can be reduced. Further, the structure of the ceramic package 2 and the optical module 1 itself can be simplified (simple).

  Furthermore, the optical module 1 can shorten the distance between the VCSEL array 9 and the PD array 10 and the lens that collects the emitted light of the VCSEL array 9 or the incident light of the PD array 10 as much as possible. Even if arranged in an array, light does not leak into the adjacent channel and always operates normally.

  In this embodiment, the focal distance of the lens is 0.4 mm, the thickness of the inorganic material substrate 3 is 0.3 mm, and the distance between the lens and the VCSEL array 9 or the PD array 10 can be 0.5 mm.

  In the optical module 1, a metal film 14 is formed on the surface other than the optical path R of the inorganic material substrate 3, and the metal film 14 is electrically connected to the GND of the mother board and the circuit board and the GND layer of the ceramic package 2. ing. For this reason, electromagnetic waves can be prevented from entering and exiting, and strong against EMI (electromagnetic interference).

  Further, in the optical module 1, a transparent underfill r is filled in the gap between the inorganic material substrate 3 and the VCSEL array 9, and a transparent underfill is also filled in the gap between the inorganic material substrate 3 and the PD array 10. Therefore, reflection of light on the back surface of the inorganic material substrate 3 can be suppressed, and at the same time, the joint portion between the inorganic material substrate 3 and the VCSEL array 9 and the joint portion between the inorganic material substrate 3 and the PD array 10 can be reinforced.

  Here, a case where a quartz glass substrate is used as the inorganic material substrate 3 will be described.

  Sapphire glass is nearly 10 times more expensive than quartz glass, and is hard next to diamond, so it is difficult to cut by dicing compared to quartz glass. In view of this, a mode for improving heat conduction in the case of using ordinary quartz glass will be described.

  In the optical module 61B of FIG. 6B, the metal film 63 formed on the surface of the inorganic material substrate 3 is thicker than the metal film 14 of FIG. However, materials that can form the metal film 63 are limited (Cu, Ni, Au, etc.), and have the following disadvantages.

  1) Since the inorganic material substrate 3 is warped like a bimetal due to the difference in thermal expansion coefficient between the metal film 63 and the inorganic material substrate 3, the warp is corrected and the inorganic material substrate 3 must be bonded to the ceramic package 2. should not. Even if the warp is corrected, it remains as residual stress.

  2) Also, any film forming material has a larger linear expansion coefficient than glass or ceramics, and if the film is thickened, the joint interface between the inorganic material substrate 3 and the ceramic package 2 may be sheared and peeled due to a difference in thermal expansion.

  3) Further, the film formation time by plating or the like increases and the cost increases.

  In order to solve this disadvantage, the optical module 61A of FIG. 6A has a ceramic plate 63 having a thermal expansion coefficient equal to that of the inorganic material substrate 3, that is, quartz glass, on the surface other than the optical path R of the inorganic material substrate 3. Alternatively, a metal plate 63 such as Cu or W is attached.

  The optical module 61A can solve all the disadvantages 1) to 3) described above. Further, when the metal plate 63 is used, the cost can be further reduced if it is molded by a press. The metal plate 63 can be thickened to further improve heat conduction (even if the thickness is increased, only the material cost does not increase the cost. ).

  A second embodiment will be described.

  As shown in FIG. 7 and FIG. 8, the optical module 71 is formed by forming a package side joining frame 72 having a frame shape by connecting a small number of small circles without gaps around the package side electrode 6 of the ceramic package 2. A plurality of substrate-side solder balls 73 are mounted side by side corresponding to the package-side electrode 6 and the package-side joining frame 72 around the substrate-side electrode 12 of the material substrate 3 and the periphery of the substrate-side electrode 12.

  In order to attach the solder balls 73 around the substrate-side electrode 12 corresponding to the package-side joining frame 72, pads for attaching the solder balls 73 are formed in advance at corresponding positions. Although not shown in detail in this pad, in order to prevent a gap from occurring in the solder joint after the solder is melted, the pad is continuously formed without a gap (for example, as in the case of the package-side joining frame 72, a small circle is formed as a gap). It is desirable to form a frame)

  The optical module 71 is assembled by first mounting each optical component and each electrical component on the inorganic material substrate 3 and then bonding a plurality of substrate-side solder balls 73 to the package-side electrode 6, and By bonding a plurality of substrate-side solder balls 73, the inorganic material substrate 3 is bonded to the ceramic package 2 and hermetically sealed to assemble the optical module 61.

  In the optical module 61, since the substrate-side solder balls 63 are used for bonding the ceramic package 2 and the inorganic material substrate 3, the substrate-side solder balls 63 can be crushed and absorb warpage of the inorganic material substrate 3 when bonded.

For example, as shown in FIG. 9C, when the solder paste p is applied to the package side electrode 6 (length 0.2 mm), the thickness is about 0.05 mm. On the other hand, when solder balls 73 are joined to the package side electrode 6 as shown in FIG. 9A, the ball diameter φ is about 0.2 mm, and as shown in FIG. Even the thickness is 0.1 mm or more. Therefore, the warp ε of the inorganic material substrate 3 is set to ε <0.1 mm / X
X: Length of the inorganic material substrate (see FIG. 1)
Up to acceptable.

  Thereby, in the optical module 61, airtight sealing with higher accuracy can be performed, and the low-cost inorganic material substrate 3 with low flatness can be used. Other configurations and operational effects of the optical module 61 are the same as those of the optical module 1 of FIG.

  As a modification of the optical module 61 of FIGS. 7 and 8, conversely, the package side electrode 6 of the ceramic package 2 and the package side bonding frame 72 are surrounded by the substrate side electrode 12 and the periphery of the substrate side electrode 12 (preliminarily package side bonding). Similarly to the frame 72, a plurality of solder balls 73 may be mounted side by side in correspondence with the frame 72).

  Next, an embodiment in which the substrate-side joining frame 13 and the through hole 15 in FIG. 2 are not formed will be described with reference to FIGS.

  As shown in FIG. 10, in the optical module 101 according to the third embodiment, a side wall 102 surrounding the upper surface of the ceramic package 2 is formed on the upper edge surface of the ceramic package 2, and the side wall 102 and the inorganic material substrate 3 are connected. These are joined by Cerasolzer s1 (manufactured by Kuroda Techno Co., Ltd.) as special metal solder for joining substances other than metals.

  In the optical module 101, a part of the circuit pattern 4 is formed by connecting the bottom surface of the ceramic package 2 from the top surface of the side wall 102. The cerasolzer s1 is provided so as to fill a gap between the side wall 102 of the ceramic package 2 and the inorganic material substrate 3 and to be in contact with the circuit pattern 4 and the metal film 14 in the side wall 102.

  Cerasolzer s1 is a special metal solder that joins ceramics and glass, and is a material having a large adhesive force and excellent airtightness and conductivity. When ultrasonic waves and heat (about 150 ° C.) are applied to the Cerasolzer s1, the Cerasolzer s1 joins substances other than metals.

  In this optical module 101, the inside of the ceramic package 2 can be hermetically sealed without forming the substrate-side joining frame 13 in FIG. 2, and electromagnetic waves can be prevented from entering and exiting without forming the through-holes 15 with respect to EMI. And strong.

  Further, as shown in FIG. 11, in the optical module 111 according to the fourth embodiment, instead of the Cerasolzer s1 of FIG. 10, the side wall 102 and the upper edge surface of the inorganic material substrate 3 are preliminarily coated with a thicker solder s2. In addition, a ring-shaped metal plate (metal foil) 113 is provided so as to cover the applied solder s2, and soldered.

  A pad 112 is formed on the side wall 102, and a solder s 2 is thickly applied on the pad 112 and the metal film 14. If solder is simply applied to the pad 112 and the metal film 14, the gap between the side wall 102 and the inorganic material substrate 3 may cause separation when the solder is melted, and airtightness may not be ensured.

  Therefore, in the optical module 111, the solder s2 is applied thicker than usual, and the ring-shaped metal plate 113 is provided thereon. With this metal plate 113, when the solder s2 is melted, the solder s2 is wetted and spreads, and the airtightness in the ceramic package 2 can be reliably increased.

  Next, an embodiment in which the through hole 15 of FIG. 2 is not formed will be described with reference to FIGS.

  As shown in FIG. 12, in the optical module 121 according to the fifth embodiment, the metal film 14 is electrically connected to the circuit pattern 4 of the ceramic package 2 through a wire w as a conductive member by wire bonding. It is. A pad 122 for wire bonding is formed on the upper edge surface of the ceramic package 2.

  As shown in FIG. 13, in the optical module 131 according to the sixth embodiment, the metal film 14 is electrically connected to the circuit pattern 4 of the ceramic package 2 via a conductive member 132 which is a separate component. It is. A pad 122 is formed on the upper edge surface of the ceramic package 2, and a conductive member 132 is soldered to the pad 122 and the metal film 14.

  These optical modules 121 and 131 can prevent electromagnetic waves from entering and exiting without forming the through hole 15 and are strong against EMI.

  A seventh embodiment will be described.

  As shown in FIGS. 14 to 16, the optical module 141 includes the light emitted from each LD of the VCSEL array 9 or the PD array 10 on the surface of the inorganic material substrate 3 on the optical path R in the optical module 1 of FIG. 1. The integrated lens block 142 that collects incident light of each PD is adhered and mounted with an adhesive a. As the adhesive a, a UV (ultraviolet) curable adhesive is used.

  The lens block 142 is collectively formed of a transparent synthetic resin. The lens block 142 has a chuck portion (the upper surface and side surfaces of the lens block 142 and the side surface of the lens block 142). Are formed in a substantially rectangular parallelepiped shape. As the chuck portion, a corner portion (upper edge surface) formed by the upper surface and the side surface of the lens block 142 may be chamfered according to the inclined surface of the collet chuck.

  In the central part of the lens block 142, four lenses (aspherical lens array) 143 that outputs the light emitted from the LDs of the VCSEL array 9 by going straight upward and the incident light of the PDs of the PD array, on the other hand, Four lenses 144 (aspherical lens array) are formed which are linearly moved downward and input. The lens block 142 is a straight-ahead lens block.

  On the upper surface of the lens block 142, two guide pins 145 that fit into guide holes provided in the MT optical connector are provided. The guide pin 145 may be integrally formed with the lens block 142 or may be a separate part. In addition, a guide hole for fitting with a guide pin provided on the MT optical connector may be formed on the upper surface of the lens block.

  Next, the mounting method of the optical module 141 will be described in the following (1) to (3).

(1) Image processing alignment (image processing alignment) 1
First, the inorganic material substrate 3 is bonded to the ceramic package 2 and hermetically sealed by the same procedure as described above.

A module-side reference marker is provided on the upper surface of the module main body 141b, and a lens-side reference marker is provided on the upper surface or the bottom surface of the lens block 142. The adhesive a is applied to the upper surface of the module main body 141b or the bottom surface of the lens block 82. (Procedure 1)
In this state, as shown in FIG. 20, the lens block 142 is grasped (gripped) by the collet chuck 201 of the mounting apparatus by air vacuum, and the lens side reference marker and the module side reference marker are matched. The lens block 142 is placed on the module main body 141b while aligning with a visual recognition device (TV, monitor, etc.). The confirmation by the camera may be performed automatically by image processing or may be performed visually. (Procedure 2)
Then, UV is irradiated from above the lens block 142 to cure the adhesive b, and the lens block 142 is mounted on the module main body 141b. (Procedure 3)
(2) Image processing alignment 2
After step 1, grab the lens block 142 with the chuck, align the module while checking the light emitting area of each LD of the VCSEL array (which can be confirmed visually) or the light receiving area of each PD of the PD array with a visual recognition device such as a camera, etc. The lens block 82 is placed on the main body 81b.

  The chuck for gripping the lens block 142 used here does not grip the upper part of the lens block 142 like the collet chuck 201 described in FIG. It holds both side surfaces of the lens block 142. Then, procedure 3 is performed.

(3) Active alignment After step 1 (however, the lens side and module side reference markers are not required), an alignment optical fiber is connected to the lens block 142, and each LD of the VCSEL array emits light, and the light emission power is MAX. The lens block 142 is placed on the module main body 141b while aligning while monitoring the position.

  In addition, after step 1, an alignment optical fiber is connected to the lens block 142, a test optical signal is transmitted to the alignment optical fiber, and the position where the light reception power of each PD in the PD array becomes MAX is determined. The lens block 142 may be placed on the module main body 141b while aligning while monitoring.

  In this optical module 141, the lens block 142 and the module main body 141b can be integrated with each other by a simple method because the lens block 142 is mounted on the surface of the inorganic material substrate 3 with the adhesive a.

  In the optical module 141, the lens block 142 is provided with a chuck portion (the conventional lens block has no chuck portion and is not a rectangular parallelepiped). For this reason, the lens block 142 can be adsorbed by the collet chuck 201 of the mounting apparatus, and air leakage can be eliminated during air vacuum.

  Accordingly, as described in (1) Image processing alignment 1, since the lens block 142 can be gripped by the collet chuck 201, the lens block 142 can be mounted by using a mounting device in the same manner as other optical components and electrical components.

  An eighth embodiment will be described.

  As shown in FIGS. 17 to 19, the optical module 171 includes the light emitted from each LD of the VCSEL array 9 or the PD array 10 on the surface of the inorganic material substrate 3 in the optical module 1 of FIG. 1. An integrated lens block 172 that condenses incident light of each PD is mounted with an adhesive. A UV curable adhesive is used as the adhesive.

  The lens block 172 is collectively formed of a transparent synthetic resin. The lens block 172 is provided with a chuck portion (a corner portion formed by the upper surface and the side surface of the lens block 172) to be held by the collet chuck 201 (see FIG. 20) of the mounting apparatus, and is formed in a substantially rectangular parallelepiped shape as a whole. Is done.

  Four lenses 173 are formed on the bottom surface of the lens block 172 so that the emitted light of each LD of the VCSEL array 9 goes straight upward. On the front surface of the lens block 172, the emitted light of each LD of the VCSEL array 9 is forwarded. Four lenses 174 are formed to be output in a straight line.

  On the other hand, on the front surface of the lens block 172, four lenses 175 are formed that cause the incident light of each PD of the PD array to go straight backward. On the bottom surface of the lens block 172, the incident light of each PD of the PD array is Four lenses are formed that travel straight ahead.

  At the central portion of the lens block 172, a mirror 176 is formed that reflects the emitted light of each LD of the VCSEL array 9 from the top to the front and reflects the incident light of each PD of the PD array from the front to the bottom. The lens block 172 is a reflective lens block.

  On the upper surface of the lens block 172, two guide pins 177 that fit into guide holes provided in the MT optical connector are provided. The guide pin 177 may be integrally formed with the lens block 172 or may be a separate part. Further, a guide hole for fitting with a guide pin provided on the MT optical connector may be formed on the front surface of the lens block.

  The mounting method of the optical module 171 is also the same as that of the optical module 141 in FIG. This optical module 171 also provides the same operational effects as the optical module 141.

  Next, a ninth embodiment in which the metal film 14 of FIG. 1 is not formed will be described.

  As shown in FIG. 21, the optical module 211 covers the upper part of the inorganic material substrate 3 via the lens block 142 on the upper part of the inorganic material substrate 3 instead of the metal film 14 of the optical module 141 of FIG. An inner shield 212 is provided as a shield plate, and the inner shield 212 is formed so as to protrude from the peripheral edge of the inorganic material substrate 3.

  A plurality of protrusions (fins) 213 bent toward the inorganic material substrate 3 are formed on the periphery of the inner shield 212. Two guide holes 214 through which the guide pins 145 are inserted are formed in the inner shield 212, and a hole 215 serving as an optical path is formed between the guide holes 214. The inner shield 212 can be formed by press molding.

  As shown in FIG. 22, the optical module 211 is mounted on a circuit board 222 such as a flexible board included in a device such as an optical transceiver, and is housed in a case 221 of the device such as an optical transceiver. At this time, the protrusion 213 of the inner shield 211 is brought into contact with the inner surface of the case 221.

  The optical module 221 can prevent electromagnetic waves from entering and exiting without forming the metal film 14 and is strong against EMI.

  Further, as the shield plate, instead of the inner shield 212, an inner shield is provided on the upper surface of the inorganic material substrate 3 so as to cover the upper surface of the inorganic material substrate 3, and the inner shield is stretched from the periphery of the inorganic material substrate 3. You may form so that it may take out. In this case, the thinner shield is formed with a hole through which the entire lens block 142 is inserted.

  A tenth embodiment will be described.

  As shown in FIGS. 23 and 24, the optical module 231 has the VCSEL array 9 mounted on the back surface of the inorganic material substrate 3, and the driver 232 for driving the VCSEL array 9 is mounted on the inner bottom surface 2b of the ceramic package 2. The PD array 10 is mounted on the back surface of the inorganic material substrate 3 and a preamplifier 233 for amplifying the output of the PD array 10 is mounted and three-dimensionally mounted and wired.

  In the optical module 231, the driver 232 is mounted on the inner bottom surface 2 b of the ceramic package 2, so that the ceramic package 2 is prevented from being enlarged and heat generated by the driver 232 is easily escaped through the ceramic package 2.

  Further, since the optical signal input to each PD of the PD array 10 has a low intensity and the current output from each PD is weak, it is vulnerable to noise. Therefore, in the optical module 231, the preamplifier 233 is disposed on the inorganic material substrate 3 in order to bring the preamplifier 233 close to the PD array 10.

  Since the optical module 231 is three-dimensionally mounted and wired, the ceramic package 2 and the inorganic material substrate 3 can be reduced, and the optical module 231 can be reduced in size, which is very useful.

  An eleventh embodiment will be described.

  As shown in FIG. 25, the optical module 251 includes the light emitted from each LD of the VCSEL array 9 by photolithography and etching on the surface on the optical path R of the inorganic material substrate 3 in the optical module 1 of FIG. A diffractive lens (diffractive optical element: DOE) 252 is formed as a planar lens for collecting incident light of each PD in the PD array.

  The diffractive lens 252 is a lens having a shape shown in FIG. 26A manufactured by microfabrication using binary optics, and has the same function as the general aspherical lens 261 in FIG.

  Here, the binary optics means that a lens is generated at a binary level with a desired accuracy by using a plurality of masks on a planar substrate and performing a photo-etching process. In other words, binary optics uses a plurality of masks called multi-binary masks, changes the relative etching amount for each mask to 1, 2, 4,... This is a technique for obtaining height selectivity.

Specifically, when one mask is used as shown in FIG. 27A, two levels of phase levels are generated, and when two masks are used as shown in FIG. 27B, four levels of phase are generated. When a level is generated and there are three masks as shown in FIG. 27C, eight phase levels are generated. Therefore, when n is the number of masks used, 2 ⁿ step shapes are generated, which is called binary optics.

  In the optical module 251, since the diffraction lens 252 is formed on the inorganic material substrate 3, the lens function can be integrated into the inorganic material substrate 3, and an external lens is not required.

  In addition, a diffractive lens similar to the diffractive lens 252 in FIG. 26A may be formed on the back surface of the inorganic material substrate 3 below the optical path R by photolithography and etching.

1 is a perspective view of an optical module showing a preferred first embodiment of the present invention. FIG. 2 is a cross-sectional view of the optical module shown in FIG. 1 taken along line 2A-2A. It is a disassembled perspective view of the optical module shown in FIG. It is the disassembled perspective view which looked at the optical module of FIG. 3 from upper direction, and the perspective view of an inorganic material board | substrate. It is the schematic which shows the manufacturing process of the optical module shown in FIG. FIGS. 6A and 6B are cross-sectional views of an optical module showing an example in which a quartz glass substrate is used as the inorganic material substrate. It is a disassembled perspective view of the optical module which shows 2nd Embodiment. It is the disassembled perspective view which looked at the optical module of FIG. 7 from upper direction. FIG. 9A is a cross-sectional view showing a solder ball just before joining, FIG. 9A is a cross-sectional view showing a solder ball after joining, and FIG. 9C is a cross-sectional view when using a solder paste. It is a disassembled perspective view of the optical module which shows 3rd Embodiment. It is a disassembled perspective view of the optical module which shows 4th Embodiment. It is a disassembled perspective view of the optical module which shows 5th Embodiment. It is a disassembled perspective view of the optical module which shows 6th Embodiment. It is a disassembled perspective view of the optical module which shows 7th Embodiment. It is a perspective view of the lens block shown in FIG. It is a longitudinal cross-sectional view of the lens block shown in FIG. It is a perspective view of the optical module which shows 8th Embodiment. It is the perspective view which looked at the optical module of FIG. 17 from the front. It is a longitudinal cross-sectional view of the optical module shown in FIG. It is the schematic explaining the mounting method of an optical module. It is a perspective view of the optical module which shows 9th Embodiment. It is sectional drawing which shows the state which mounted the optical module shown in FIG. 21 in the apparatus. It is a perspective view of the optical module which shows 10th Embodiment. It is the perspective view which looked at the optical module shown in FIG. 23 from upper direction. It is a perspective view of the optical module which shows 11th Embodiment. FIG. 26A is a sectional view of the diffractive lens shown in FIG. 25, and FIG. 26B is a sectional view of a conventional lens. FIG. 27A to FIG. 27C are schematic diagrams for explaining a method of manufacturing a diffractive lens. It is a longitudinal cross-sectional view of the conventional optical module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical module 2 Ceramic package 4 Package side circuit pattern 3 Transparent inorganic material substrate (light transmissive member)
6 Package side electrode 7 Package side bonding frame 8 Substrate side circuit pattern (photoelectric conversion element)
9 VCSEL array (photoelectric conversion element)
10 PD array 12 Substrate side electrode 13 Substrate side joining frame 72 Package side joining frame 73 Solder ball

Claims (17)

An optical module in which a circuit pattern is formed in a package having an upper opening, a light transmitting member is provided on the upper portion of the package, and a plurality of photoelectric conversion elements are housed in the package and hermetically sealed. A circuit pattern is formed on the back surface of the transparent inorganic material substrate, and a plurality of photoelectric conversion elements are mounted on the circuit pattern, a package side electrode is formed on the upper edge surface of the package, and the package side electrode A substrate side electrode is formed on the back surface of the inorganic material substrate, a package side joining frame is formed around the package side electrode of the package, and the substrate side electrode and the substrate side electrode of the inorganic material substrate are formed. A plurality of solder balls are mounted side by side or around the package side electrode and the package side joining frame of the package. With soldered to the package-side electrode and the substrate-side electrode, and bonding the inorganic material substrate to the package,
A side wall is formed on the upper edge surface of the package, solder is applied to the side wall and the upper edge surface of the inorganic material substrate, and a ring-shaped metal plate is provided so as to cover the applied solder and soldered. And optical module. The metal film is formed on the surface other than the optical path of the inorganic material substrate, and the metal film is electrically connected to the circuit pattern of the package through a through hole formed in the inorganic material substrate. Light module. The optical module according to claim 1 , wherein a metal film is formed on a surface other than the optical path of the inorganic material substrate, and the metal film is electrically connected to a circuit pattern of the package through a conductive member such as a wire . The optical module according to claim 1 , wherein a ceramic plate or a metal plate having a thermal expansion coefficient equal to that of the inorganic material substrate is provided on a surface other than the optical path of the inorganic material substrate . The shield plate is provided on the upper surface or the upper portion of the inorganic material substrate so as to cover the upper surface or the upper portion of the inorganic material substrate, and the shield plate is formed so as to protrude from the peripheral edge of the inorganic material substrate. Light module. The optical module according to claim 1, wherein a transparent underfill is filled in a gap between the inorganic material substrate and each photoelectric conversion element . The optical module according to claim 1, wherein a control semiconductor chip for controlling each photoelectric conversion element is mounted on the back surface of the inorganic material substrate . The optical module according to claim 1, wherein a photoelectric conversion element for light emission is mounted on the back surface of the inorganic material substrate, and a drive circuit for driving the photoelectric conversion element for light emission is mounted on the inner bottom surface of the package. . The optical module according to claim 1, wherein a photoelectric conversion element for receiving light is mounted on the back surface of the inorganic material substrate, and an amplification circuit for amplifying the output of the photoelectric conversion element for receiving light is mounted . The optical module according to claim 1, wherein a sapphire substrate having lower crystallinity than a sapphire substrate used as a semiconductor thin film substrate is used as the inorganic material substrate . The optical module according to any one of claims 1 to 10, wherein an integrated lens block that collects the emitted light or incident light of the plurality of photoelectric conversion elements is mounted on the surface of the inorganic material substrate with an adhesive . The optical module according to claim 11, wherein the lens block is provided with a chuck portion for gripping with a chuck of a mounting apparatus for mounting an optical component or an electrical component . 12. The lens block is a rectilinear type in which outgoing light or incident light of the photoelectric conversion element is made to travel straight and output or input, or a reflective type in which outgoing light or incident light of the photoelectric conversion element is reflected to be input and output. Or the optical module of 12 . The optical module according to any one of claims 11 to 13, wherein the lens block is provided with a guide pin or a guide hole for fitting with the optical connector . The optical module according to claim 14, wherein the guide pin is separate from the lens block or integrated with the lens block . The light according to any one of claims 1 to 10, wherein a diffractive lens for condensing the emitted light or incident light of the plurality of photoelectric conversion elements is formed on the surface of the optical path of the inorganic material substrate by photolithography and etching. module. The light according to any one of claims 1 to 10, wherein a diffractive lens for condensing emitted light or incident light of the plurality of photoelectric conversion elements is formed on the back surface of the optical path of the inorganic material substrate by photolithography and etching. module.

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