JP2007158751A - Imaging apparatus and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact imaging apparatus with high performance by using a lens member, where a lens is integrally formed with a lens support part for supporting the lens, and to provide its manufacturing method. <P>SOLUTION: The imaging apparatus 1 includes the lens member 10 having the lens 10 and the lens support part 110b for supporting the lens 10, and an image sensor chip 20 for converting incident light from the lens 10 into an imaging signal. In the imaging apparatus 1, the lens member 10 is fixed onto the image sensor chip 20 with an adhesive 30 having the thickness of not less than 5 μm. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an imaging device and a manufacturing method thereof, and more specifically, a lens member in which a lens and a boundary tube that supports the lens are integrally formed, and an image sensor chip that converts light received by the lens into an imaging signal. The present invention relates to an imaging apparatus provided and a manufacturing method thereof.

  Currently, imaging apparatuses are widely used for applications such as mobile phones and mobile terminals (PDA: Personal Digital Assistance). There is a demand for further downsizing, higher functionality, and higher performance of the imaging apparatus. As a means for realizing miniaturization, for example, there is an imaging apparatus described in Patent Document 1.

16 and 17 are a cross-sectional view and a perspective view, respectively, showing a conventional imaging device. As shown in FIGS. 16 and 17, 401 is a substrate provided with an opening, 402 is an image sensor having a light receiving surface 402a, 403 is an optical element including an imaging lens unit 403a, and 404 is a terminal of the image sensor 402. It is the bump of the electrode provided in. The imaging element 402 is mounted face down so as to close the opening of the substrate 401, and is electrically connected to the substrate 401 by bumps 404. The optical element 403 is assembled so as to come into contact with the upper surface of the imaging device 402 in a space in the opening of the substrate 401. Here, the optical element 403 is assembled so as to contact the upper surface portion of the imaging element 402, more specifically, the portion other than the light receiving portion 402a through the opening 401a provided in the substrate 401.
Japanese Patent No. 3607160

  However, in the imaging device described in Patent Document 1, the optical axis adjustment of the Z axis and the θ axis depends on the accuracy of the optical element 403 having the lens portion 403a. Recent image pickup apparatuses are increasingly miniaturized, reduced in cost, increased in pixel count, and improved in performance. For this reason, high-precision mounting of the optical element 402 having the lens 403a and the light receiving surface 402a of the imaging element (sensor) 402 is required. However, since the optical element 403 is usually formed by molding, its accuracy is limited. Therefore, there is a problem that it is difficult to perform fine optical axis adjustment of the Z axis and the θ axis by the optical element 403.

  The present invention has been made in order to solve such problems, and uses a lens member in which a lens and a lens support portion for supporting the lens are integrally formed, thereby reducing the size and performing high-performance. An object is to provide an apparatus and a method for manufacturing the same.

  In order to achieve the above-described object, an imaging apparatus according to the present invention provides an imaging signal based on a lens member having a lens, a lens support portion that supports the lens, and incident light incident through the lens. An image sensor chip to be processed, and the lens member is fixed on the image sensor chip with an adhesive having a thickness of 5 μm or more.

  In the present invention, since the thickness of the adhesive for fixing the lens member and the image sensor chip is 5 μm or more, the optical axis required due to manufacturing tolerances can be adjusted within the required accuracy.

  The image sensor chip includes a light receiving portion that receives the incident light, and an electrode portion that is provided at least at a part of the end portion and outputs the imaging signal to the outside, from the end of the light receiving portion to the chip end. Alternatively, the light receiving portion is arranged so that the region width to the electrode portion varies depending on the portion, and the lens support portion is a cylindrical body that supports the lens therein and has at least the largest region width. And the bottom surface can be fixed by the adhesive. Thus, the adhesive strength can be maintained by adhering at least the region having the largest width and the bottom surface.

  The image sensor chip includes a light receiving portion that receives the incident light, and an electrode portion that is provided at least at a part of the end portion and outputs the imaging signal to the outside, from the end of the light receiving portion to the chip end. Alternatively, the light receiving unit is arranged so that a region width to the electrode unit varies depending on a part, the lens support unit is a cylindrical body and supports the lens therein, and a bottom surface has a width corresponding to the region width. And the bottom surface and the bottom surface excluding at least the region having the smallest region width are fixed by the adhesive. Accordingly, since the portion having the smallest region width and the bottom surface are not fixed by the adhesive, it is possible to prevent the adhesive from adhering to the electrode portion and improve the yield.

  In this case, it is preferable that the bottom surface of the lens member is fixed by the adhesive in a region where the bottom surface of the lens member is opposed to the light receiving portion on the image sensor chip. Adhering using the two regions sandwiching the light receiving portion stabilizes the adhesive strength, and adhering the minimum region reduces defects occurring in the adhering process and improves the manufacturing yield.

  Moreover, the said adhesive agent shall consist of material which has a thermosetting characteristic. In this case, the lens member may have a light-shielding film in at least a part of the region other than the lens surface. Since the lens member has the light-shielding film, the adhesive has more thermosetting characteristics than, for example, an ultraviolet curable resin. It is preferable to make it a material.

  Further, the lens support portion is a cylindrical body and supports the lens therein, and the moisture concentration of the hollow portion formed by the lower hollow portion of the lens and the image sensor chip is 10% or less. It is preferable. As a result, there is little risk of condensation or the like occurring in the cavity even when the use environment temperature of the imaging apparatus changes drastically.

  Further, the hollow portion may be formed by filling the hollow portion with an inert gas and then sealing the lens member and the image sensor chip with the adhesive. In order to make the moisture concentration less than 10%, it is possible to use inert gas or the like in addition to dry air.

  Furthermore, it is preferable that the said cavity part is 0.5 atmosphere or less. As a result, the adhesion between the lens member and the image sensor chip can be enhanced, and light scattering / attenuation in the cavity can be reduced from normal pressure.

  Further, the lens member is formed of a material having a lower transmittance than a region serving as the optical path, or a region other than the region serving as the optical path of the incident light, or formed of a material having a high light shielding property. can do. Accordingly, it is possible to suppress or prevent unnecessary light from being mixed from a region other than a region serving as an optical path of incident light.

  Further, the image sensor chip is flip-chip mounted on a mounting substrate, and a portion where the flip chip is mounted and the vicinity of an adhesive portion of the lens member with the image sensor chip are covered with a light-shielding resin material. By covering the joint between the lens member and the image sensor with a light-blocking resin material, it is possible to prevent unnecessary light from entering from the joint.

  In this case, the adhesive may be a light transmissive material. Since the adhesive is covered with a resin material having a light shielding property, the adhesive may have a light transmitting property, and the degree of freedom in selecting an adhesive material can be expanded.

  Still further, the image sensor chip is flip-chip mounted on a mounting substrate, and the lens support portion is a cylindrical body and supports the lens therein, and the lower bottom surface and the image sensor The chip is fixed by the adhesive, and at least a part of the part to be flip-flip mounted or the adhesive part of the lens support part with the image sensor chip is covered with a light-shielding resin material. The space formed by the resin material and / or the adhesive between the lower hollow portion of the lens and the image sensor chip in the lens support portion is sealed so that the water concentration is 10% or less. By setting the moisture concentration in the sealed space to 10% or less, it is difficult to cause condensation even if the environmental temperature changes greatly, resulting in poor performance. It is possible to suppress.

  The hollow portion may be formed by sealing the lens member and the image sensor chip after the hollow portion is filled with an inert gas, and is dried to reduce the water concentration to less than 10%. In addition to air, an inert gas or the like can also be used.

  Furthermore, the cavity can be set to 0.5 atm or less, and the adhesion between the lens member and the image sensor chip can be enhanced, and light scattering / attenuation in the cavity can be reduced from normal pressure.

  Furthermore, the image sensor chip is flip-chip mounted on the mounting substrate on the upper surface side, and the lens member is bonded to the upper surface of the image sensor chip, and the thickness of the adhesive is determined by the image sensor chip. It is preferable that the distance is smaller than the distance from the upper surface of the sensor chip to the mounting substrate, whereby a small image sensor chip and a lens member can be mounted on the mounting substrate.

  An image pickup apparatus according to the present invention is obtained based on a lens member having a lens and a lens support portion that supports the lens, a light receiving portion that receives incident light incident through the lens, and a light reception result thereof. An image sensor chip having an electrode part for outputting an image pickup signal to the outside, wherein the image sensor chip has the electrode part formed on at least a part of the end part, and the chip end or the electrode from the end of the light receiving part The light receiving part is arranged so that the region width to the part differs depending on the part, and the lens support part is a cylindrical body that supports the lens therein, and the bottom part has at least the largest region width. It is fixed by an adhesive.

  An image pickup apparatus according to the present invention is obtained based on a lens member having a lens and a lens support portion that supports the lens, a light receiving portion that receives incident light incident through the lens, and a light reception result thereof. An image sensor chip having an electrode part for outputting an image pickup signal to the outside, wherein the image sensor chip has the electrode part formed on at least a part of the end part, and the chip end or the electrode from the end of the light receiving part The light receiving part is arranged so that the region width to the part varies depending on the part, the lens support part is a cylindrical body and supports the lens inside, and the bottom surface is formed with a width corresponding to the region width. The portion excluding at least the portion having the smallest region width and the bottom surface are fixed by an adhesive.

  An imaging device according to the present invention includes a lens, a lens member having a lens support portion that supports the lens, and an image sensor chip that processes an imaging signal based on incident light incident through the lens, The lens member has a light-shielding film on at least a part of a region other than the lens surface on which the incident light enters, and is fixed by an adhesive on the image sensor chip, and the adhesive has a thermosetting property. Contains materials.

  An imaging device according to the present invention includes a lens, a lens member having a lens support portion that supports the lens, and an image sensor chip that processes an imaging signal based on incident light incident through the lens, The lens member is formed by forming a region other than the region serving as the optical path of the incident light from a material having a lower transmittance than the region serving as the optical path.

  An imaging device according to the present invention includes a lens, a lens member having a lens support portion that supports the lens, and an image sensor chip that processes an imaging signal based on incident light incident through the lens, The lens member is formed by forming a region other than the region serving as the optical path of the incident light from a material having a higher light shielding property than the region serving as the optical path.

  An imaging device according to the present invention includes a lens, a lens member having a lens support portion that supports the lens, and an image sensor chip that processes an imaging signal based on incident light incident through the lens, The image sensor chip is flip-flop mounted on a mounting substrate, and the lens member is fixed on the image sensor chip with a light-transmitting adhesive, and the part to be flip-flip mounted and the lens The vicinity of the bonding portion between the member and the image sensor chip is covered with a light-shielding resin material.

  An imaging device according to the present invention includes a lens, a lens member having a lens support portion that supports the lens, and an image sensor chip that processes an imaging signal based on incident light incident through the lens, The image sensor chip is flip-flop mounted on a mounting substrate, and the lens support portion is a cylindrical body that supports the lens therein, and the bottom surface and the image sensor chip are adhesives. And at least a part of the portion where the flip-flip mounting is performed and the adhesive portion of the lens member to the image sensor chip are covered with a light-shielding resin material, and the resin material and / or the adhesive The space formed by the lens lower hollow portion and the image sensor chip in the lens support portion has a moisture concentration of 10%. In which is sealed so as to be lower.

  An imaging device according to the present invention includes a lens, a lens member having a lens support portion that supports the lens, and an image sensor chip that processes an imaging signal based on incident light incident through the lens, The image sensor chip is flip-flop mounted on a mounting substrate, and the lens member is fixed to the upper surface of the image sensor chip with an adhesive, and the thickness of the adhesive is It is smaller than the distance from the upper surface of the image sensor chip to the mounting substrate.

  According to another aspect of the present invention, there is provided a manufacturing method of an imaging apparatus between a bottom surface of a lens member having a lens and a lens support portion that supports the lens, and an upper surface of an image sensor chip that converts incident light from the lens into an imaging signal. Then, an adhesive is applied in a thickness of 5 μm or more, the optical axis of the lens is adjusted, and then the adhesive is cured.

  According to the present invention, it is possible to provide a downsized and high-performance imaging apparatus and a method for manufacturing the same, using a lens member in which a lens and a lens support portion that supports the lens are integrally formed.

  Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings. In this embodiment, the present invention is applied to an imaging apparatus that includes a lens member in which a lens and a lens barrel are integrally formed, can be easily miniaturized, and can receive light with high accuracy, and a manufacturing method thereof. It is applied.

Embodiment 1 FIG.
An imaging apparatus according to a first embodiment of the present invention will be described with reference to FIGS. The imaging apparatus according to the first embodiment is a sensor module capable of automatic optical axis adjustment. FIG. 1 is a cross-sectional view showing an imaging apparatus according to the present embodiment. As shown in FIG. 1, the imaging device 1 includes a lens member 10 and an image sensor chip 20, and the lens member 10 is formed on the image sensor chip 20 by an adhesive (adhesive portion) 30 having a thickness of 5 μm or more. The lens member 10 and the image sensor chip 20 are not in contact with each other. The lens member 10 includes a lens 10a and a lens support portion 10b that supports the lens 10a. The image sensor chip 20 converts incident light from the lens 10a into an imaging signal and outputs it to the outside.

  FIG. 2 is a sectional view showing the lens member, and FIG. 3 is a plan view showing the image sensor chip. As shown in FIGS. 1 and 2, the lens member 10 includes a lens 10a that collects incident light, and a lens support portion 10b as a lens barrel for supporting the lens 10a is integrated with the lens 10a. It is formed. The lens member 10 can be formed by molding, for example. The lens 10 a is made of, for example, an aspherical convex lens, and has a function of forming incident light on the surface of the image sensor chip 20. The lens 10a is made of plastic or glass, for example.

  The lens support portion 10b is a cylindrical body having a rectangular top view, and supports the lens 10a inside the upper side. The lower side of the lens 10a is a hollow portion 10c. Then, the lower bottom surface 10 d is opposed to the image sensor chip 20, and a part or all of the bottom surface 10 d is bonded and fixed with an adhesive region 30 described later on the image sensor chip 20. In this example, the hollow portion 10c is rectangular in a top view.

  In the present embodiment, the lens support portion 10b is described as a rectangular cylindrical body in a top view, but may be cylindrical, for example. The shape is not limited to the cylindrical shape, and any shape that can support the lens 10a on the image sensor chip 20 may be used. In other words, the lens 10a may be supported by one or a plurality of support points. Although the lens member 10 is described as including one lens 10a, the lens member 10 may have a plurality of lenses 10a.

  Further, an antireflection film 11 is formed on the upper surface of the lens 10a of the lens member 10 to make the reflected light inconspicuous by the AR code. The antireflection film 11 is also formed on the lower surface side of the lens 10a from which light incident from the upper surface of the lens 10a is emitted. On the antireflection film 11 formed on the lower surface of the lens 10a, a film 12 (hereinafter referred to as an infrared absorption film) that further cuts ultraviolet / infrared rays by IR coating and transmits only visible light is formed. Yes. The performance of the imaging device 1 can be improved by the antireflection film 11 and the infrared absorption film 12. In the present embodiment, the infrared absorption film 12 is formed only on the lower surface side that is the light emission side of the lens 10a, but may be formed on the upper surface that is the light incidence side of the lens 10a. . Further, a material having a low-pass filter function may be applied to the upper surface and / or the lower surface of the lens 10a in order to remove noise or the like and further improve the performance.

  Further, a light shielding film 13 is formed on the upper surface and side surfaces of the lens member 10 other than the lens 10a. Thereby, it is possible to prevent the lens member 10 from capturing unnecessary light other than incident light from the upper surface of the lens 10a.

  As shown in FIGS. 1 and 3, the image sensor chip 20 includes a rectangular light receiving unit 22 that receives incident light from the lens 10 a formed on the surface of a base 21 made of, for example, a silicon substrate that is rectangular when viewed from above. Have. The light receiving unit 22 includes a CCD element or a CMOS element. Moreover, the electrode part 23 is formed in the periphery (4 sides) of the base 21 surface. In addition, in this Embodiment, although the electrode part 23 is demonstrated as what is formed in all the 4 sides of the base 21, the electrode part 23 may be formed only in 1 side, for example. Further, a signal processing circuit (DSP) (not shown) is provided on the same surface as the light receiving unit 22.

  The image sensor chip 20 converts the light collected by the lens 10a on the light receiving surface 22 into an electric signal (imaging signal), and the signal processing circuit appropriately performs various signal processing such as amplification processing and noise removal processing. And the signal is output to the outside through the electrode portion 23. The electrode part 23 is an input / output terminal electrically connected to the signal processing circuit. The electrode unit 23 is electrically connected to a wiring board constituting a mobile phone, a portable terminal (PDA), a card camera, or the like. The signal processing circuit is formed in a region from each of the four sides of the light receiving unit 22 to the electrode unit 23, and a protective film is formed on the upper surface thereof.

  Here, the image sensor chip 20 according to the present embodiment includes regions having distances A to D (hereinafter, referred to as the distances A to D) formed on the four sides of the light receiving unit 22 and the electrode units 23 formed on the four peripheral sides of the base 21. The light receiving unit 22 is arranged such that at least one distance (hereinafter also referred to as a region width) of the substrate region is larger than the other. In this example, the distance D is larger than the other distances A to C.

In the image sensor chip 20, if the light receiving part 22 is arranged at the center part, the area width cannot be made large, and the circuit design of the signal processing circuit becomes complicated. Further, if an area (width) for mounting the signal processing circuit is secured, the image sensor chip 20 is increased in size. In order to solve this problem, in the present embodiment, the distances A to D from the light receiving unit 22 to the electrode unit 23 are made different to satisfy the following.
A <B <C <D
In this way, by arranging the light receiving unit 22 slightly shifted from the center and making each distance different, one distance, in this example, the distance D can be increased, and a wide substrate region having the distance D is provided. Can do.

  As described above, in the image sensor chip 20, the signal processing circuit is formed in the substrate region from the four sides of the light receiving unit 22 to the electrode unit 23, and this region is also bonded to the bottom surface 10 d of the lens member 10. The substrate area to be processed. That is, a surface protective film is formed on the signal processing circuit, and the lens member 10 is bonded and fixed thereon, so that the upper part of the signal processing circuit formation area can be effectively used and the image sensor chip 20 can be used. By fixing the lens member 10 with the adhesive 30, it is possible to reduce the size of the entire element.

  Further, by devising the arrangement of the light receiving unit 22, a wide substrate area can be secured without increasing the surface area of the image sensor chip 20, and the mounting of the signal processing circuit can be facilitated. Further, in this example, the width of the bottom surface 10d of the lens support portion 10b bonded to the substrate region at the distance A is narrowed, but the width of the bottom surface 10d of the lens support portion 10b facing the region having the distance D is sufficiently wide. In addition, even if the size is reduced, the strength of the lens member 10 can be maintained and the necessary adhesive strength can be maintained. As will be described later, one or more sides of the bottom surface 10d of the lens support portion 10b may be bonded to the image sensor chip 20. In the case of this example, when only one side is bonded, it is preferable to bond the region of the distance D and the bottom surface 10d from the viewpoint of bonding strength.

  A method for manufacturing the imaging device configured as described above will be described. FIG. 4 is a plan view showing a lens member, FIG. 5 is a diagram for explaining an adhesion region of an image sensor chip, and FIG. 6 is a schematic diagram showing a state of dicing.

  A lens base constituting the lens member 10 is molded, and three alignment marks 14 for mounting on the image sensor chip 20 are formed on the upper surface (see FIG. 4). The alignment mark 14 can be formed so as to provide a light shielding property to the lens 10a. It may be formed on the light shielding film 13 instead of on the lens base. The alignment mark 14 may be formed at two or more locations. Further, the lens base can be molded as having a plurality of lenses.

  Then, a light-shielding film is formed by vapor deposition on the upper surface and side surface of the lens base other than the portion to be the imaging lens portion 10a. An AR coating is deposited on the upper and lower surfaces of the imaging lens portion 10a to form an antireflection film 11, and an IR coating is deposited on the lower surface to form an infrared absorption film 12. As described above, in the present embodiment, the infrared absorption film 12 is formed only on the lower surface of the lens 10a, but may be formed on the upper surface (incident side). Thus, the lens member 10 is formed.

  Next, the lens member 10 is mounted on the wafer 20a on which a large number of light receiving portions 22 and electrode portions 23 are formed with the alignment mark 14 as a reference. The base is made of, for example, a silicon substrate, and a plurality of light receiving portions 22 and electrode portions 23 corresponding thereto are formed, and a plurality of lens members 10 are mounted.

  Here, the mounting accuracy of the lens member 10 greatly affects the performance of the imaging apparatus. Therefore, in the present embodiment, the lens member 10 and the wafer 20a are bonded using the adhesive 30. At this time, the adhesive is cured after adjusting the optical axis.

  For example, there are the following methods for adjusting the optical axis. For example, incident light from the lens member 10 is received by the light receiving unit 22 and converted into an imaging signal. The imaging signal is taken out by applying a probe to the electrode unit 23, and the mounting position of the lens member 10 is determined depending on the quality of the imaging signal. Can be adjusted.

  Alternatively, it is possible to optically observe from the upper surface of the mounted lens member 10 and adjust the mount position so that the lens 10a is in focus. Further, information on the mounting position of XYZθ (θ: relative angle between the central axis of the lens and the optical axis) is obtained by prior inspection of the lens member 10, and mounting is performed based on this mounting position information (optical axis position information). It is also possible to adjust the position.

  As the adhesive applied between the wafer 20a and the lens member 10, a combined resin of UV curing and heat curing can be used. Here, in the case of the base 21 having the arrangement of the light receiving unit 22 and the electrode unit 23 as shown in FIG. 3, the width of each substrate region from the light receiving unit 22 to the electrode unit 23 (see FIG. 5). The widths A ′ to D ′ corresponding to the sizes of the distances A to D can be set as the bonding width bonded by the adhesive. It is assumed that the bottom surface 10d of the lens support portion 10b of the lens member 10 is formed with a width corresponding to the widths A ′ to D ′. As a result, at the largest distance D, a sufficiently wide width D ′ for obtaining the required adhesive strength can be secured, and the width of the bottom surface 10d of the lens member 10 facing this region can be made sufficiently large. It is possible to secure a sufficient thickness as the strength of the lens barrel.

  An adhesive is applied to the bottom surface 10d of the lens support portion 10b having an adhesion width corresponding to the substrate area having the area widths A to D, and the optical axis is adjusted as described above. At this time, it is necessary that the adhesive is applied with a thickness of 5 μm or more as a sufficient thickness capable of adjusting the optical axis.

  After the adhesive is applied to the bottom surface (adhesion surface) 10d of the lens member 10 in this way, the mounter performs alignment using the three alignment marks 14 and the marks formed on the surface of the wafer 20a. Then, in a dry air atmosphere, automatic adjustment of the optical axis is performed by mounting the lens member 10 at, for example, a mounting position indicated by the mounting position information. Next, the lens member is mounted in a temporarily cured state on the entire surface of the wafer 20a by performing temporary curing by UV irradiation. The entire wafer 20a is overheated, and the lens member 10 and the image sensor chip 20 are fixed by thermally curing the adhesive at once by heat curing. Finally, as shown in FIG. 6, the plurality of lens members 10 mounted on the wafer 20 a are cut by a dicing device 40 and individually divided to manufacture the imaging device 1.

  Here, by mounting in the dry air, it is preferable to control the moisture concentration of the hollow portion where the hollow portion 10c and the wafer 20a (image sensor chip 20) are sealed by the adhesive 30 to 10% or less. When the ambient temperature changes, if the moisture concentration in the cavity is high, dew condensation occurs inside the cavity, causing performance deterioration or failure of the light receiving unit 22. On the other hand, by setting the moisture concentration in the cavity to 10% or less, it is possible to prevent condensation from forming inside even if the environmental temperature changes. Therefore, the moisture concentration in the cavity is preferably 10% or less.

  Further, as described above, the thickness of the adhesive 30 interposed between the bottom surface 10d serving as the bonding surface of the lens member 10 and the bonding region of the wafer 20a (image sensor chip 20) is set to 5 μm or more. The lens member 10 is adjusted in advance by a mounter so as to be mounted at a mounting position by inspection of the lens member 10 after UV curing / thermosetting. Since each of the lens members 10 has an optimum mounting position for itself, the lens members 10 are adjusted to different positions in the wafer so that each lens member 10 has its own mounting position.

  This will be specifically described. When the mounting position is a back focus of 812 μm and θ = 1 °, the length L of the side wall (leg) constituting the hollow portion 10c of the lens member 10 is 790 ± 10 μm (see FIG. 1), and the back focus distance is 817 ±. Assuming an accuracy of 10 μm and mounter mounting system ± 2 μm, the bottom surface 10 d of the lens member 10 can be mounted by adjusting the optical axis by fixing it with an adhesive having a thickness of 5 μm or more from the surface of the image sensor chip 20. It becomes. That is, the lens member 10 is bonded to the image sensor chip 20 with the adhesive 30 having a thickness equal to or greater than the distance required for the optical axis adjustment when the lens member 10 is mounted on the image sensor chip 20, so that the deviation due to manufacturing tolerances or the like is eliminated. The resulting optical axis can be adjusted.

  In the present embodiment, since the lens member 10 is mounted in a state of being floated by 5 μm or more from the surface of the image sensor chip 20 via the adhesive 30, the optical axis adjustment can be adjusted within the mounter accuracy. . Therefore, it is possible to stabilize the quality of the imaging device. That is, the high accuracy of the lens member 10 is suitable for downsizing, cost reduction, high pixel count, and high performance by absorbing the optical axis shift due to manufacturing tolerances with the adhesive 30 having a thickness of 5 μm or more. Mounting can be realized.

  Further, in the present embodiment, the case where the mounting position is obtained by using the inspection data of the lens member 10 is described. However, the lens member 10 data is not used, and the mounting is performed by the other method described above. It is also possible. That is, when the lens member 10 is mounted, light is incident from the upper surface of the lens 10a and the optical axis is adjusted while monitoring the sensor signal taken out from the electrode unit 23, or the focus of the light receiving unit 22 is adjusted from the upper surface of the lens 10a. By adjusting the optical axis while monitoring, it is possible to mount with higher accuracy.

  In addition, the imaging apparatus 1 according to the present embodiment has a structure in which the hollow portion 10c of the lens member 10 is sealed with the wafer 20a (image sensor chip 20) and the adhesive 30, and the moisture concentration in the hollow portion is 10%. It is as follows. By providing the cavity with a sealed structure, it is possible to prevent performance degradation due to dust or the like in the environment where the imaging apparatus is used. Further, by setting the moisture concentration to 10% or less, it is possible to prevent performance deterioration due to condensation or the like with respect to changes in the environmental temperature.

  In the present embodiment, the moisture concentration in the cavity is set to 10% or less by fixing with an adhesive in dry air, but the sealing structure is similarly applied in an inert gas atmosphere such as argon or nitrogen. It is also possible to reduce the water concentration to 10% or less.

  Further, when the lens member 10 is fixed to the image sensor chip 20, it is naturally effective to use the small image sensor chip 20 for miniaturization. In this case, it is necessary to determine the fixing position, that is, the arrangement position of the light receiving unit 22 on the image sensor chip 20 in consideration of the arrangement of the connection terminals, in addition to the arrangement so as not to have optical influence. In the present embodiment, the light receiving unit 22 is laid out so that the distance from the sensor light receiving unit 22 to the electrode unit 23 in the wafer 20a (image sensor chip 20) satisfies A <B <C <D, and the width of the substrate region. Accordingly, the bonding width with the lens member 10 is set to A ′ <B ′ <C ′ <D ′, so that a sufficient bonding area can be secured by the width D ′, and thus the bonding strength and the strength of the lens support portion 10b. Can be secured. In addition, by ensuring a wide distance D, it is possible to facilitate the layout of the signal processing circuit and provide an easy-to-manufacture imaging device even when the size is reduced.

  Furthermore, in the present embodiment, the lens member 10 has a light shielding film 13 in advance. In Patent Document 1 described above, a method of applying a light shielding material after mounting a lens member on a substrate for light shielding is disclosed. However, by using the lens member 10 with a light shielding film, the manufacturing process can be simplified. Can do. In this case, when an adhesive that is cured by optical energy such as a UV curable resin is used when fixing with an adhesive, the light shielding film loses energy and it is difficult to cure the adhesive. In order to solve this problem, in the present embodiment, by using a material including a thermosetting property as the adhesive 30, the lens member 10 can be sufficiently cured even if it has the light shielding film 13. It is possible to provide an imaging device with high reliability.

Embodiment 2. FIG.
Next, an imaging apparatus according to the second embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the pressure and moisture concentration in the cavity formed by the lens member and the image sensor chip are adjusted. 7 and 8 are schematic views showing the image sensor chip and the lens member used in the second embodiment, respectively, and FIG. 9 is a diagram for explaining an adhesion region when the lens member is mounted.

  The image sensor chip 120 according to the present embodiment has the electrode parts 123 only on two opposite sides of the base 121. The lengths A to D from the light receiving unit 22 to the electrode unit 123 or the end of the base 21 are the same as those in the first embodiment, such as A <B <C <D. The lens member 110 according to the present embodiment is basically configured similarly to the lens member 10 of the first embodiment. The width of the bottom surface 110d of the lens support part 110b of the lens member 110 is A ″ <B ″ <C ″ <D ″, where the widths of the four sides of the bottom surface 110d are A ″ to D ″. It is formed as follows. Further, when the width of the adhesive applied to each of the four sides of the bottom surface 110d is A ′ to D ′, A ′ <B ′ <C ′ <D ′, and these widths are A ′ <A ″, B ′ <B ″, C ′ <C ″, and D ′ <D ″, and the adhesive is applied so as not to protrude from the bottom surface 110d.

  Furthermore, the lens portion (upper) width of the hollow portion 110c is wider than the width of the bottom surface 110d, that is, the thickness of the portion supporting the lens 10a of the hollow portion 110c is thicker than the thickness of the bottom surface 110d. Has been. With this configuration, the lens support portion 10b is made as thick as possible, and the width of the bottom surface 10d bonded to the image sensor chip 120 is reduced, so that the strength of the lens support portion 110d is ensured and the entire module is small. Can be achieved. Other configurations are the same as those of the first embodiment, and the same components are denoted by the same reference numerals and detailed description thereof is omitted.

  As shown in FIG. 9, the bottom surface 110d of the lens member 110 is 110e when viewed from above. In the image sensor chip 120, the width of the region from the light receiving portion 22 to the end portion of the electrode portion 123 or the base 21 is A <B <C <D, and the lens member 110 is arranged to correspond to this. It will be. In this case, an adhesive is applied to the area (adhesion area) indicated by 21a on the bottom surface 110d, and the lens member 110 and the image sensor chip 120 are bonded by this adhesive. As described above, the adhesive regions also have A ′ <B ′ <C ′ <D ′ corresponding to the width of A <B <C <D, respectively.

  Here, in the manufacturing method of the imaging device according to the present embodiment, the lens unit is mounted in a vacuum atmosphere by being performed in a vacuum chamber instead of a dry air atmosphere. Other manufacturing methods can be the same as those in the first embodiment. That is, after applying the adhesive and setting the optical axis adjusted to the mounting position, the applied adhesive is cured to achieve highly accurate positioning.

  According to the present embodiment, in addition to the same effects as in the first embodiment, by mounting in a vacuum atmosphere, the moisture concentration of the hollow portion in which the hollow portion 110c and the image sensor chip 120 are sealed with the adhesive is reduced. 10% or less, and the internal atmospheric pressure can be suppressed to 0.5 atm or less.

  As a result, as in the first embodiment, it is possible to prevent performance degradation due to condensation or the like with respect to temperature changes in the environment. Further, by setting the pressure in the lens cavity to 0.5 atm or less, the adhesion between the lens member 110 and the image sensor chip 120 can be improved, and an imaging apparatus with high reliability can be provided. In the present embodiment, the case of 0.5 atm or less has been described, but a lower pressure may be used. Further, if the air pressure in the hollow portion is at least smaller than the normal pressure, the adhesion between the lens member 110 and the image sensor chip 120 can be improved.

  In addition, when the lens member 110 is fixed to the image sensor chip 120 so as to seal the cavity of the lens member 110, the performance deterioration of the imaging device is a problem due to condensation due to a temperature change when the moisture concentration in the cavity is high. It was. Further, in the case where the cavity is not sealed, in addition to the same problem, there is a problem that dust or the like is mixed and the performance of the imaging apparatus is deteriorated. On the other hand, in the present embodiment, by adopting a sealed structure and setting the pressure in the lens cavity to 0.5 atm or less, light scattering / attenuation in the cavity can be suppressed more than in the case of normal pressure, and more A high-performance imaging device can be provided. Note that when the adhesive is cured, the amount of gas generated may be large. If the lens is mounted at normal pressure, the lens cavity of the imaging device may become high pressure, which may cause a decrease in reliability. However, in the present embodiment, since the lens member 110 is mounted in a vacuum state, it is possible to suppress an increase in air pressure in the lens cavity due to gas generation during the curing of the adhesive.

  Further, in the present embodiment, the width of the bottom surface 110d of the lens member 110 is set to A ″ <B ″ <C ″ <D ″. Therefore, compared with the case where all have the same width, the adhesive strength between the lens member 110 and the image sensor chip 120 and the strength of the support portion 110d of the lens member 110 can be kept large, and a highly reliable imaging device is provided. It becomes possible to do.

  Furthermore, if the thickness of the lens support portion 110d is reduced for miniaturization, the strength of the lens support portion 110d cannot be ensured. In order to solve this problem, in the present embodiment, the lens support portion 110d of the lens member 110 is formed such that the lens support portion 110d becomes thicker from the bottom surface side to the upper side. As a result, it is possible to improve or maintain the strength of the lens member 10 while keeping the adhesive portion at a necessary minimum width, and it is possible to provide a highly reliable imaging device.

  In FIG. 9, the adhesive widths A ′ to D ′ shown in 21a are formed narrower than the width (A ″ to D ″) of the lens member bottom surface 110d (A ′ <A ″, B ′ < B ″, C ′ <C ″, D ′ <D ″) are larger than the width of the bottom surface 110d (A ′> A ″, B ′> B ″, C ′> C ″). , D ′> D ″).

Embodiment 3 FIG.
An imaging apparatus according to Embodiment 3 of the present invention will be described with reference to FIGS. FIG. 10 is a diagram for explaining the adhesion region after the lens unit is mounted. FIG. 11 is a schematic cross-sectional view showing a state after the lens member is mounted on the image sensor chip. Similar to the first embodiment, the image sensor chip 220 of the imaging apparatus according to the present embodiment includes a light receiving unit 22 and electrode units 23 formed on four sides. Here, the distance between the light receiving portion 22 and the electrode portions 23 on the four sides is designed to satisfy A <C <B <D, respectively. Here, the regions having the distances A and C are opposed to each other with the light receiving unit 22 interposed therebetween, and the regions having the distances B and D are opposed to each other with the light receiving unit 22 interposed therebetween. That is, one region width (distance) A, C facing the light receiving unit 22 is smaller than the other region width (distance) B, D facing each other.

  The lens member 10 has the same configuration as that of the first embodiment. Here, the bottom surface 210d of the lens member 10 corresponding to the substrate region having the distances A to D is also formed so that the widths of the four sides thereof are A ″ <C ″ <B ″ <D ″. Yes. In the present embodiment, only the bottom surface having the widest distance D ″ and the bottom surface having the distance B ″ facing this via the light receiving unit 22 are bonded to the image sensor chip 220. That is, the adhesion region 221a is formed only in the substrate region having the distances D and B, and this region, the lens member 10, and the image sensor chip 220 are bonded and fixed. Therefore, the adhesive is applied only to the substrate regions at the distances B and D, and is not applied to the substrate regions at the distances A and C. Therefore, as shown in FIG. 11, a gap is formed between the bottom surface 210 d located on the substrate regions at distances A and C and the image sensor chip 220. In this case, the adhesive is preferably applied with a thickness of 5 μm or more as in the first embodiment, and thus the gap is preferably 5 μm or more. The lens member 10 can be mounted on the image sensor chip 220 after the manufacturing tolerance is absorbed by the thickness or gap of the adhesive and the optical axis is accurately adjusted.

  Further, in the method of manufacturing the imaging device according to the present embodiment, in the step of mounting the lens member 10 on the image sensor chip 220, mounting is performed without adjusting gas such as atmospheric pressure or gas atmosphere. Other manufacturing steps are the same as those in the first embodiment.

  In the present embodiment, only two sides of the bottom surface of the four sides of the lens member 10 are bonded to the image sensor chip 220. As a result, even if the image sensor chip is reduced in size and has an edge with a narrow adhesion area, it can be bonded to the lens member using other sides. In addition, the bonding area can be reduced by bonding only two of the four sides facing each other. Therefore, an adhesion failure or the like can be prevented as much as possible, and an imaging device with high reliability can be provided. Furthermore, since the hollow portion 10c of the lens member 10 and the image sensor chip 20 are not sealed with an adhesive, it is possible to use an adhesive that generates a large amount of gas when cured. This makes it possible to improve the degree of freedom in the selection of the adhesive material and the manufacturing process.

Embodiment 4 FIG.
An imaging apparatus according to the fourth embodiment of the present invention will be described with reference to FIG. FIG. 12 is a schematic diagram illustrating a lens member of the imaging apparatus according to the present embodiment. In the lens members of Embodiments 1 to 3 described above, both the lens and the lens support portion are formed of a light-transmitting material. However, incident light to the lens support portion is formed by forming a light shielding film or the like. Therefore, it is necessary to design so as not to reach the light receiving surface as unnecessary light. Therefore, in the present embodiment, as shown in FIG. 12, a material having a light-transmitting property only in the portion of the lens member 10 through which the light ray within the angle of view passes, that is, only the portion that becomes the optical path of incident light from the lens 310a The other part, that is, the lens support part 310b is formed by two-color molding formed of a material having a higher light shielding property than the lens 310a. The light-shielding material is obtained by mixing a light-shielding material into a light-transmissive material.

  In the present embodiment, the lens support portion 310b is made of a light-shielding material that does not transmit light, so that flare and ghost due to unnecessary light, particularly light outside the angle of view, can be reduced. A high-performance imaging device can be provided as in the case of forming a light shielding film. Further, in the present embodiment, the lens support portion 310b is described as using a light shielding material having a light shielding property. However, even if light incident on the lens support portion 310b is absorbed by a low transmittance material, the lens support portion 310b is the same. The effect of.

Embodiment 5 FIG.
An imaging apparatus according to the fifth embodiment of the present invention will be described with reference to FIG. FIG. 13 is a diagram showing the image pickup apparatus 101 mounted on a mother board such as a mobile phone. As shown in FIG. 13, the imaging apparatus 101 according to the present embodiment uses the solder bumps 50 formed on the electrode portions 23 of the image sensor chip 20 in the imaging apparatus similar to the first embodiment. The image sensor chip 20 and the wiring 53 on the mother board 52 are electrically connected by FC (flip chip) connection. Therefore, the area around the bump 50 is filled with the underfill 51. The underfill 51 absorbs the stress generated in the solder joint and relieves the pressure applied to the solder bump 50.

  Here, in the imaging device 101 according to the present embodiment, the underfill 51 is made of a material having a light shielding property. The underfill 51 is filled so as to cover not only the peripheral area of the solder bump 50 but also the adhesive portion of the lens member 10 with the image sensor chip 20. Furthermore, by performing FC connection in consideration of the height of the solder bump 50 after connection, from the distance between the image sensor chip 20 and the lens member 10, that is, the height h1 of the adhesive (adhesive portion) 130, The distance h2 between the image sensor chip 20 and the mother board 52 is large.

  Here, when the light-shielding lens unit is fixed on the image sensor chip 20 with a light-transmitting adhesive, or when there is a partial gap, the imaging device is caused by unnecessary light from the adhesive or the gap. There arises a problem that the performance of the system deteriorates. In particular, it is a problem that light outside the angle of view is mixed. In order to solve this problem, in this embodiment, the underfill 51 used for FC connection is made light-shielding so as to cover the adhesive 130, so that unnecessary light is prevented from entering the light-receiving unit 22. be able to.

  For example, in the imaging apparatus shown in Embodiment 1, when an adhesive made of a light-transmitting material is used as the adhesive 30, unnecessary light is mixed from the bonded portion, thereby reducing the performance of the imaging apparatus. In selecting an adhesive, it is necessary to select many parameters such as adhesive strength, curing method, shrinkage rate of adhesive, and the amount of gas generated when the adhesive is cured. It is preferable to increase the degree of freedom of material selection. Therefore, by using the underfill 51 having a light shielding property as in the present embodiment, it is not necessary to consider the presence or absence of light transmission in the adhesive of the fixing portion, and the material of the bonding portion can be freely selected. The degree is increased.

  Further, by making the distance to the motherboard substrate 52 larger than the distance h1 from the image sensor chip 20 to the lens member 10, the adhesive 130 can be prevented from coming into contact with the motherboard substrate 52. Therefore, the area from the electrode part 23 to the mounting of the lens member 10 can be utilized to the maximum, so that even a small imaging device can be mounted. As a result, it is possible to reduce the size of the mother board on which the image pickup apparatus is mounted, and to reduce the size of a mobile phone or the like that uses the motherboard.

Embodiment 6 FIG.
Next, an imaging apparatus according to Embodiment 6 of the present invention will be described with reference to FIGS. 14 and 15 are a perspective view and a schematic cross-sectional view, respectively, showing the imaging apparatus 201 according to the present embodiment. In the present embodiment, the image sensor chip 20 is FC-connected to a flexible printed circuit board (FPC) 60, unlike the fifth embodiment in which the image sensor chip 20 of the imaging apparatus is FC-connected to the motherboard.

  Thereby, the electrical connection of the imaging device 201 can be facilitated. In the fifth embodiment, FC connection is required to a motherboard substrate such as a cellular phone. However, in this embodiment, connector connection is possible with the motherboard substrate, thereby absorbing the FC connection yield. can do. That is, when the FC connection is directly made to the motherboard, if the yield of FC connection is poor, the whole motherboard becomes a defective product, leading to an increase in cost. On the other hand, if the imaging is connected to the FCP, only the non-defective imaging device mounted FCP can be connected to the motherboard, and it is possible to provide a substantially low-priced imaging device without deteriorating the yield. is there.

  The imaging apparatus 201 has the same configuration as that of the third embodiment. When FC connection is made to the FPC board, the hollow portion 10c and the image sensor chip 20 are hermetically sealed by filling a light-shielded underfill in a dry air atmosphere. As a result, the water concentration in the lens cavity is set to 10% or less. With such a configuration, it is possible to prevent performance degradation due to condensation or the like with respect to temperature changes in the environment where the imaging apparatus 201 is used. As described above, it is possible that the cavity is not sealed when the lens member 10 and the image sensor chip 20 are bonded together, and is sealed when the FC is connected thereafter. Even in this case, the same effects as those of the second embodiment are obtained.

  Needless to say, the sealing structure may be formed in an inert gas atmosphere such as argon or nitrogen or a vacuum atmosphere instead of dry air. In addition, the moisture concentration can be appropriately adjusted according to the use environment of the imaging device when the purpose is to prevent condensation due to a change in the environmental temperature. For example, even if the moisture concentration is 10% or higher, the usage environment does not cause dew condensation, and it may be 10% or higher. For example, the moisture concentration may be as low as 0.5%.

  It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the above-described first to sixth embodiments can be appropriately combined with one or more.

It is sectional drawing which shows the imaging device concerning Embodiment 1 of this invention. It is sectional drawing which shows the lens member in the imaging device concerning Embodiment 1 of this invention. It is a top view which shows the image sensor chip in the imaging device concerning Embodiment 1 of this invention. It is a top view which shows the lens member in the imaging device concerning Embodiment 1 of this invention. It is a figure explaining the lens member mounting position of the image sensor chip | tip in the imaging device concerning Embodiment 1 of this invention. It is a schematic diagram which shows the mode of dicing. It is a schematic diagram which shows the image sensor chip in the imaging device concerning Embodiment 2 of this invention. It is a schematic diagram which shows the lens member in the imaging device concerning Embodiment 2 of this invention. It is a figure explaining the mounting position at the time of mounting a lens member in the image sensor chip in Embodiment 2 of this invention. It is a figure explaining the adhesion area | region after the lens part mounting in Embodiment 3 of this invention. It is a figure which shows the mode after mounting the lens member in Embodiment 3 of this invention in an image sensor chip. It is a schematic diagram which shows the lens member of the imaging device concerning Embodiment 4 of this invention. It is a figure which shows the imaging device concerning Embodiment 5 of this invention. It is a perspective view which shows the imaging device concerning Embodiment 6 of this invention. It is typical sectional drawing which shows the imaging device concerning Embodiment 6 of this invention. It is sectional drawing which shows the conventional imaging device of patent document 1. It is a perspective view which shows the conventional imaging device of patent document 1.

Explanation of symbols

1,101,201 imaging device,
10,110 lens member,
10a, 310a lens,
10b, 110b, 310b lens support,
10c, 110c hollow part,
10d, 110d, 210d bottom surface,
11 Antireflection film,
12 Infrared absorbing film,
13 light shielding film,
14 mark,
20,120,220 Image sensor chip,
20a wafer,
21,121 base,
22,122 light receiving part,
23,123 electrode part,
30,130 adhesives,
40 dicing equipment,
50 bumps,
51 Underfill,
52 Motherboard board,
53 Wiring

Claims (26)

A lens member having a lens and a lens support portion for supporting the lens;
An image sensor chip for processing an imaging signal based on incident light incident through the lens,
An imaging apparatus in which the lens member is fixed on the image sensor chip with an adhesive having a thickness of 5 μm or more. The image sensor chip includes a light receiving portion that receives the incident light, and an electrode portion that is provided at least at a part of the end portion and outputs the imaging signal to the outside.
The light receiving part is arranged so that the region width from the end of the light receiving part to the chip end or the electrode part varies depending on the part,
The lens support portion is a cylindrical body that supports the lens therein, and at least a portion having the largest region width and the bottom surface are fixed by the adhesive. The imaging device described. The image sensor chip includes a light receiving portion that receives the incident light, and an electrode portion that is provided at least at a part of the end portion and outputs the imaging signal to the outside.
The light receiving part is arranged so that the region width from the end of the light receiving part to the chip end or the electrode part varies depending on the part,
The lens support portion is a cylindrical body that supports the lens therein, a bottom surface is formed with a width corresponding to the region width, and a portion excluding at least a portion having the smallest region width and the bottom surface The imaging apparatus according to claim 1, wherein the imaging device is fixed by the adhesive. The imaging device according to claim 2 or 3, wherein a bottom surface of the lens member is fixed by the adhesive in a region where the bottom surface of the lens member is opposed to the lens member via the light receiving unit. The imaging apparatus according to claim 1, wherein the adhesive is made of a material having thermosetting characteristics. The imaging device according to claim 5, wherein the lens member includes a light shielding film in at least a part of a region other than the surface of the lens on which the incident light is incident. The lens support portion is a cylindrical body that supports the lens therein, and a moisture concentration in a hollow portion formed by the lower hollow portion of the lens and the image sensor chip is 10% or less. The imaging apparatus according to claim 1, wherein: The imaging device according to claim 7, wherein the hollow portion is obtained by filling the hollow portion with an inert gas and then sealing the lens member and the image sensor chip with the adhesive. The imaging device according to claim 7, wherein the hollow portion is 0.5 atm or less. The imaging device according to claim 1, wherein the lens member is formed of a material having a transmittance lower than that of the region serving as the optical path in a region other than the region serving as the optical path of the incident light. The imaging device according to claim 1, wherein the lens member is formed of a material having a light shielding property higher than that of the region serving as the optical path in a region other than the region serving as the optical path of the incident light. The image sensor chip is flip-chip mounted on a mounting substrate,
The imaging apparatus according to claim 1, wherein a portion where the flip chip is mounted and a vicinity of an adhesion portion between the lens member and the image sensor chip are covered with a resin material having a light shielding property. The imaging apparatus according to claim 12, wherein the adhesive is made of a light-transmitting material. The image sensor chip is flip-chip mounted on a mounting substrate,
The lens support portion is a cylindrical body that supports the lens therein, and a lower bottom surface thereof and the image sensor chip are fixed by the adhesive,
At least a part of the part to be flip-flip mounted or the adhesive part of the lens support part with the image sensor chip is covered with a light-shielding resin material, and the lens support part is covered with the resin material and / or the adhesive. The imaging apparatus according to claim 1, wherein a space formed by the lower hollow portion of the lens and the image sensor chip is sealed so that the water concentration is 10% or less. The imaging device according to claim 14, wherein the hollow portion is obtained by sealing the lens member and the image sensor chip after the hollow portion is filled with an inert gas. The imaging device according to claim 14, wherein the hollow portion has a pressure of 0.5 atm or less. The image sensor chip is flip-chip mounted on the mounting substrate on the upper surface side,
The lens member is bonded to an upper surface of the image sensor chip, and a thickness of the adhesive is smaller than a distance from the upper surface of the image sensor chip to the mounting substrate. The imaging device described. A lens member having a lens and a lens support portion for supporting the lens;
A light receiving portion that receives incident light incident through the lens, and an image sensor chip having an electrode portion that outputs an imaging signal obtained based on the light reception result to the outside;
In the image sensor chip, the electrode part is formed on at least a part of an end part,
The light receiving part is arranged so that the region width from the end of the light receiving part to the chip end or the electrode part varies depending on the part,
The said lens support part is a cylindrical body, supports the said lens in the inside, and is fixed with the site | part which has the said area | region width with the largest bottom face, and an adhesive agent. A lens member having a lens and a lens support portion for supporting the lens;
A light receiving portion that receives incident light incident through the lens, and an image sensor chip having an electrode portion that outputs an imaging signal obtained based on the light reception result to the outside;
In the image sensor chip, the electrode part is formed on at least a part of an end part,
The light receiving part is arranged so that the region width from the end of the light receiving part to the chip end or the electrode part varies depending on the part,
The lens support portion is a cylindrical body that supports the lens therein, a bottom surface is formed with a width corresponding to the region width, and a portion excluding at least a portion having the smallest region width and the bottom surface And an image pickup apparatus fixed with an adhesive. A lens member having a lens and a lens support portion for supporting the lens;
An image sensor chip for processing an imaging signal based on incident light incident through the lens,
The lens member has a light-shielding film on at least a part of a region other than the lens surface on which the incident light is incident, and is fixed by an adhesive on the image sensor chip,
The image pickup apparatus, wherein the adhesive includes a material having thermosetting characteristics. A lens member having a lens and a lens support portion for supporting the lens;
An image sensor chip for processing an imaging signal based on incident light incident through the lens,
The lens device is an imaging apparatus in which a region other than a region serving as an optical path of the incident light is formed of a material having a lower transmittance than a region serving as the optical path. A lens member having a lens and a lens support portion for supporting the lens;
An image sensor chip for processing an imaging signal based on incident light incident through the lens,
The lens device is an imaging device in which a region other than a region serving as an optical path of the incident light is formed of a material having a higher light shielding property than a region serving as the optical path. A lens member having a lens and a lens support portion for supporting the lens;
An image sensor chip for processing an imaging signal based on incident light incident through the lens,
The image sensor chip is flip-flop mounted on a mounting substrate,
The lens member is fixed on the image sensor chip with an optically transparent adhesive,
An image pickup apparatus in which a portion to be flip-flip mounted and a vicinity of an adhesion portion between the lens member and the image sensor chip are covered with a light-shielding resin material. A lens member having a lens and a lens support portion for supporting the lens;
An image sensor chip for processing an imaging signal based on incident light incident through the lens,
The image sensor chip is flip-flop mounted on a mounting substrate,
The lens support portion is a cylindrical body and supports the lens therein, and the bottom surface and the image sensor chip are fixed by an adhesive,
At least a part of the part to be flip-flip mounted and the adhesive part of the lens member to the image sensor chip are covered with a light-shielding resin material, and the resin material and / or the adhesive in the lens support part. An imaging device in which a space formed by a lens lower hollow portion and the image sensor chip is sealed so that the moisture concentration is 10% or less. A lens member having a lens and a lens support portion for supporting the lens;
An image sensor chip for processing an imaging signal based on incident light incident through the lens,
The image sensor chip is flip-flop mounted on a mounting substrate,
The lens member is fixed to the upper surface of the image sensor chip with an adhesive, and the thickness of the adhesive is smaller than the distance from the upper surface of the image sensor chip to the mounting substrate. Adhering with a thickness of 5 μm or more between the bottom surface of a lens member having a lens and a lens support portion that supports the lens, and the top surface of an image sensor chip that converts incident light incident through the lens into an imaging signal Apply the agent,
The manufacturing method of the imaging device which hardens the said adhesive agent after performing the optical axis adjustment of the said lens.

Images