JP2008153720A - Camera module and imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a camera module capable of preventing adhesives from entering into an imaging region and offering a high photography quality. <P>SOLUTION: The camera module comprises an image sensor 4 equipped with a sensor 6 for converting light incident upon a light-receiving region into an electrical signal for output, a lens for focusing light incident from outside onto the sensor 6 at the image sensor 4, a holding member 3 pasted up on a side of the sensor 6 at the image sensor 4 with adhesives 9 and for holding the lens, and a depression 10 formed at least at a part of an end face of the holding member 3 and for evacuating the adhesives 9. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a camera module and an imaging device mounted on, for example, a mobile phone, and more particularly to a camera module suitable for downsizing.

In recent years, camera systems have been mounted on mobile phones and the like. In such a camera system, a camera module that forms a subject image on an image sensor using a microlens is widely used.
As mobile phones and the like are miniaturized, further miniaturization of camera modules is required.

As a technique related to a camera module that achieves downsizing and high focus accuracy, a technique corresponding to Patent Document 1 has been conventionally known.
Patent Document 1 includes a lens, a lens barrel that supports the lens, and an image sensor chip that outputs an imaging signal based on light incident through the lens, and the lens barrel is placed on the image sensor chip. The image sensor chip is provided with a sensor unit and a logic circuit unit on one surface thereof, and a technique of a camera module in which the lens barrel is mounted and fixed on the logic circuit unit is disclosed.

WO03 / 015400 pamphlet

In order to reduce the size of the camera module, it has been practiced to reduce the gap between components as much as possible by adhering a lens holding part for holding a lens with an adhesive on an image sensor chip having an image sensor. . At this time, the adhesive applied to the adhesive surface of the lens holding portion may protrude and enter the imaging region of the image sensor chip, causing manufacturing defects. On the other hand, conventionally, a gap is provided between the adhesive surface and the imaging region to absorb the protrusion of the adhesive.
However, with the recent demand for miniaturization of camera modules, it is necessary to minimize the gap secured between the adhesive surface and the imaging region, and the protrusion of the adhesive has become a problem.
Here, an object of the present invention is to provide a camera module or the like having high photographing quality by preventing the protrusion of the adhesive from entering the imaging region when manufacturing the camera module.

  In order to solve the above-described problems, a camera module according to the present invention includes an image sensor including an image sensor that converts light incident on a light receiving region into an electric signal and outputs the image sensor, and image light incident from the outside. Formed on at least a part of the end surface of the holding member, a lens that collects the light in the light receiving region, a holding member that holds the lens and is bonded to the surface of the image sensor on the light receiving region side with an adhesive. And retracting means for retracting the adhesive.

In the camera module, the light receiving area of the image sensor is a square, the holding member is opened in a square shape in which the end surface of the holding member matches the light receiving area of the image sensor, and the retracting means is a corner of the end surface of the holding member. It is a dent formed to reduce the area of the end face on the inner surface side of the part.
In the camera module, the retracting means is a recess formed from the inner side to the outer side of the end surface of the holding member.
In the camera module, the retracting means is a recess formed from the outer side to the inner side of the end face of the holding member.
In the camera module, the retracting means is a first recess formed from the inner side to the outer side of the end surface of the holding member, and a second recess formed from the outer side to the inner side. The concave portions and the second concave portions are alternately formed on the end surface.

  In order to solve the above-described problems, a camera module according to the present invention includes an imaging device that converts light incident on a rectangular light receiving region into an electrical signal and outputs the electrical signal, and an imaging device that is formed on a surface on the light receiving region side. An image sensor including a logic circuit unit that processes an electrical signal to be output, a lens that collects light incident from the outside on a light receiving region of the image sensor, a lens that holds the lens, and an end surface of the image sensor A holding member having a square shape that matches the light receiving region and attached to the surface of the image sensor on the light receiving region side, and a recess formed on the inner surface side of the end surface to reduce the area of the end surface at the corner of the end surface; And at least a part of the portion where the holding member is bonded to the image sensor overlaps the logic circuit portion.

In the camera module, the lens and the holding member are formed by integral molding.
In the camera module, the holding member is bonded to the image sensor with an adhesive, and the focal point with respect to the light receiving region of the lens is adjusted with the adhesive.

  To solve the above problems, a camera module according to the present invention includes a square light receiving area, and an image sensor including an imaging element that converts light incident on the light receiving area into an electrical signal and outputs the electric signal. A lens that collects light incident from the outside onto the light receiving area of the image sensor, a plate-like cover member that transmits light incident through the lens to the light receiving area of the image sensor, A holding member that is bonded to the cover member with an adhesive and has an end face that opens in a square shape that matches the light receiving area of the image sensor, and is formed on the inner surface side of the holding member so as to reduce the area of the end face at the corner of the end face of the holding member. It is characterized by including the hollow made.

  In the camera module, the cover member includes a wiring layer on a surface opposite to a surface to which the holding member is bonded, and the image sensor covers an electric signal output from the image sensor on the surface on the light receiving area side. An electrode part that outputs to the wiring layer of the member is provided, and the electrode part of the image sensor and the wiring layer of the cover member are connected to the area on the opposite side of the cover member in the area where the holding member is bonded to the cover member It is characterized by including the place to do.

  In order to solve the above-described problems, an imaging apparatus according to the present invention includes an image sensor having a square light-receiving region and an image sensor that converts light incident on the light-receiving region into an electrical signal and outputs the electric signal. A lens that collects light from the outside onto the light receiving area of the image sensor, and an adhesive that holds the lens and opens in a square shape whose end face matches the light receiving area of the image sensor. And a holding member having a depression formed on the inner surface side of the end surface so as to reduce the area of the end surface, and an electric signal output from the image sensor of the image sensor. And a signal processing unit for processing.

  According to the present invention, it is possible to provide a camera module or the like having high photographing quality by preventing the adhesive from entering the imaging region during manufacture.

(The camera module)
(First embodiment)
The best mode (embodiment) for carrying out the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is an external perspective view showing a camera module 1 according to the present embodiment.
As shown in FIG. 1, the camera module 1 includes a lens 2, a holding member 3 that holds the lens 2, and an image sensor 4 that is bonded to the holding member 3. In addition, a part formed by attaching the lens 2 to the holding member 3 may be called a lens barrel.

The lens 2 is made of, for example, polycarbonate, an olefin material, a rigid resin such as a silicon resin, or glass. The lens 2 condenses incident light incident from the outside on a light receiving region of a sensor 6 (see FIG. 2) formed on the surface of the image sensor 4 described later.
The holding member 3 is made of a light-shielding synthetic resin such as black polycarbonate or polybutylene terephthalate. The holding member 3 has a cylindrical shape such as a square tube, and holds the lens 2 at a predetermined position on the inner periphery thereof. The holding member 3 also has a light shielding function to prevent flare and ghost due to irregular reflection of incident light. The holding member 3 is bonded to the center of an image sensor 4 described later by an adhesive 9 described later. The adhesive surface of the holding member 3 opens in a square shape in accordance with a rectangular light receiving region formed in the sensor 6 (see FIG. 2) of the image sensor 4.
The image sensor 4 includes a through hole (through hole) 5 around the bonded holding member 3. This will be described in detail below with reference to FIG.

FIG. 2 is a longitudinal sectional view of the camera module 1 according to the first embodiment.
The image sensor 4 includes a sensor 6, an electrode unit 7, and a logic circuit unit 8.
The sensor 6 functions as one of the imaging elements of the invention relating to the camera module. The sensor 6 is formed on the surface of the image sensor 4 on the light receiving area side. The sensor 6 has a rectangular light receiving region, and is formed of an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The sensor 6 converts incident light into an electrical signal and outputs it.

The electrode unit 7 is an input / output terminal electrically connected to a logic circuit unit 8 described later. More specifically, the electrode portion 7 is on the side opposite to the light receiving region through a connection path extending from the logic circuit portion 8 formed on the surface on the light receiving region side and a through hole (through hole) 5 penetrating the image sensor 4. It is formed on the surface. Then, input / output terminals are formed by solder balls and connected to an external substrate (not shown). For example, the camera module 1 is installed on a wiring board (not shown) constituting a mobile phone, a portable terminal (PDA) or a card camera, and the electrode unit 7 and the wiring board are electrically connected. Further, the camera module 1 is installed on a sub-wiring board on which passive parts such as resistors and capacitors, active parts such as transistors and LSIs are mounted, and the electrode unit 7 and the sub-wiring board are electrically connected to each other. Can be electrically connected to a mobile phone, a portable terminal (PDA) or a card camera. In addition, the electrode portion 7 may be formed on the same side as the light receiving region, and may be flip-mounted with the aperture substrate. Moreover, the electrode part 7 and a wiring board or a sub wiring board can also be electrically connected by wire bonding.
The logic circuit unit 8 performs signal processing such as amplification and noise removal on the electrical signal output from the sensor 6.

In the camera module 1 having the above configuration, measures for preventing the adhesive 9 from entering the light receiving area of the sensor 6 in the image sensor 4 will be described below.
FIG. 3 is a cross-sectional view of the camera module 1 at the cross-sectional position indicated by the alternate long and short dash line XX ′ in FIG.
As shown in FIG. 3, the adhesion surface (end surface) of the holding member 3 with the image sensor 4 is opened in a square shape in accordance with the shape of the light receiving region of the image sensor 4. Recesses 10 are formed at the four corners of the bonding surface toward the outer side. That is, a depression 10 is formed on the inner surface side of the holding member 3 at the corner of the bonding surface of the holding member 3 with the image sensor 4 (inner side of the corner region) so as to reduce the area of the bonding surface. . Thereby, in the camera module 1, it becomes possible to make the corner part of the adhesion surface of the holding member 3 and the image sensor 4 indented, and to give a distance between adjacent wall surfaces.

  FIG. 4 is a view of the adhesive application state at the corner when the adhesive 9 is applied to the adhesive surface of the holding member 3 as viewed from the adhesive surface side. FIG. 4A shows a conventional application state, and FIG. 4B shows the application state when the depression 10 is provided in the corner portion. In FIG. 4, the protruding state of the adhesive 9 is indicated by oblique lines. As shown in FIG. 4A, the protrusion width (radius of the R portion) is increased by the surface tension at the corner portion of the bonding surface of the holding member 3. A right angle is ideal for the adhesive 9 in the corner. As a countermeasure, a recess 10 was provided at the corner of the bonding surface of the holding member 3 (see FIG. 4B). Here, the depression 10 is a depression formed on the inner surface side at the corner of the adhesion surface so as to reduce the area of the adhesion surface of the holding member 3. As a result, when the holding member 3 and the image sensor 4 are bonded together, the R formed at the corner of the bonding surface of the holding member 3 due to the surface tension of the adhesive 9 can be reduced, and the adhesive 9 protrudes and the image sensor. The risk of entering the light receiving area 4 can be reduced. The depression 10 may be square or circular.

Here, a manufacturing method of the camera module 1 according to the present embodiment will be described.
The holding member 3 and the image sensor 4 are bonded by, for example, an ultraviolet curable resin. In this case, the holding member 3 is placed on the image sensor 4 at a position where the lens 2 is in focus, and then an ultraviolet curable resin is applied so that the image sensor 4 and the holding member 3 are bonded. In addition, after the ultraviolet curable resin is applied to one or both of the image sensor 4 and the holding member 3, both may be positioned. Then, the image sensor 4 and the holding member 3 are bonded and fixed by irradiating the ultraviolet curable resin with ultraviolet rays. The adhesive 9 may be a thermosetting resin or a resin that is cured with an additive.
Furthermore, it may be a method of pre-curing with ultraviolet curable resin and performing main curing by heat curing. At this time, when UV curing, it is assumed that the main curing shrinks due to heat, and the holding member is in a position to be focused after the main curing. 3 and the image sensor 4 are preferably mounted. In bonding, an adhesive 9 may be applied between the holding member 3 and the image sensor 4 and the focal length may be adjusted by the thickness of the adhesive 9. Since the focus adjustment is performed at the stage where the camera module 1 is assembled and the adhesive 9 is cured, the focus can be adjusted easily and reliably.

Thus, according to the camera module 1 according to the present embodiment, the depression 10 on the bonding surface of the holding member 3 reduces the R of the R portion formed at the corner. As a result, the protrusion of the adhesive 9 at the corner can be reduced, and the adhesive entering the light receiving region can be reduced. Thereby, a camera module with high photographing quality can be provided.
Further, according to the camera module 1 according to the present embodiment, since at least a part of the adhesive surface between the holding member 3 and the image sensor 4 overlaps the logic circuit unit 8, the logic circuit unit 8 that is not normally used. The area above can be effectively used.

(Application 1)
As shown in FIG. 3, the depressions 10 formed at the four corners of the bonding surface reduce the amount of protrusion of the adhesive 9 at the corner, but the adhesive 9 sometimes protrudes to the light receiving region even at places other than the corner. . That is, when the adhesive 9 is applied to the adhesive surface of the holding member 3, the adhesive 9 can swell near the center of the adhesive surface due to the surface tension of the adhesive 9. Due to the bulge of the adhesive 9, the adhesive 9 near the center of the adhesive surface may protrude more than other parts.
FIG. 5 is a diagram illustrating an example in which the concave portion 11 is formed toward the outer side in the center on the inner side of the contact surface.
In FIG. 5, as in the case of FIG. 3, the adhesive surface of the holding member 3 with the image sensor 4 opens in a square shape in accordance with the light receiving area of the sensor 6, and depressions 10 are formed at the four corners. A recess 11 is formed at the center of the side of the bonding surface between the holding member 3 and the image sensor 4 from the inner side toward the outer side. A concave portion 11 is provided in the center of the bonding surface to reduce the swelling of the adhesive 9 and suppress the amount of protrusion of the adhesive 9. In addition, in FIG. 5, although the shape of the recessed part 11 is made into the square shape, a semicircle shape may be sufficient. Moreover, although the one recessed part 11 is formed in the center of 1 side, according to the protrusion amount of the adhesive agent 9, a predetermined position and a predetermined number of recessed parts 11 may be formed.
(Application example 2)
FIG. 6 is a diagram illustrating an example in which the concave portion 12 is formed from the outer side toward the inner side in the center of the side of the contact surface. A recess 12 is formed in the center of the bonding surface between the holding member 3 and the image sensor 4 from the outer wall side toward the inner wall side. As in the case of Application Example 1, by providing the recess 12 at the center of the bonding surface, the swelling of the adhesive 9 near the center of the side is reduced, and the amount of protrusion of the adhesive 9 is suppressed. In particular, the amount of the adhesive 9 protruding from the adhesive surface can be reduced. In addition, in FIG. 6, although the shape of the recessed part 12 is made into the square shape, a semicircle shape may be sufficient. Further, although one recess 12 is formed at the center of one side, a predetermined position and a predetermined number of recesses 12 may be formed according to the amount of the adhesive 9 protruding.

(Application 3)
FIG. 7 shows an example in which a recess 11 directed from the inner side to the outer side and a recess 12 directed from the outer side to the inner side are formed on each of the inner side and the outer side of the contact surface. FIG.
When the concave portions 11 and 12 are provided on both the inner wall side and the outer wall side, it is desirable to form the inner wall side concave portion 11 and the outer wall side concave portion 12 alternately so as not to be in the same position. This is to prevent the strength against stress from being significantly reduced by reducing the locations where the thickness of the holding member 3 is reduced. In addition, although the shape of the recessed parts 11 and 12 is square in the figure, there is no problem even if it is a circular type. In FIG. 7, one recess 11 is formed on the inner wall side and two recesses 12 are formed on the outer wall side. However, the position and number may be appropriately selected according to the amount of protrusion of the adhesive 9. The interval at the time of alternately forming may be arbitrarily selected according to the rise of the adhesive 9.

(Application 4)
FIG. 8 is a longitudinal sectional view of a camera module 15 in which a lens and a member for holding the lens are formed by integral molding.
In the camera module 15 of the application example 4 shown in FIG. 8, the member 16 is formed by integrally molding a lens and a member for holding the lens. As a result, the number of parts to be managed at the time of manufacturing the camera module 15 is reduced, so that the manufacturing cost can be reduced. The focusing of the lens is performed by adjusting the thickness when the adhesive 9 is cured.

(Second embodiment)
FIG. 9 is a longitudinal sectional view of the camera module 20 according to the second embodiment. The same members as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
The camera module 20 according to the second embodiment is bonded to the image sensor 21 having the sensor 6, the transparent base material 22 bonded via the wiring layer 23 of the image sensor 21, and the transparent base material 22. And holding member 24. The image sensor 21 is different from the image sensor 4 according to the first embodiment in that no through hole is formed and the electrode portion 7 is formed on the surface on the light receiving region side. .

The image sensor 21 has a package structure in which the image sensor 21 is electrically connected to the transparent base material 22 including the wiring layer 23 via the electrode unit 7.
The transparent substrate 22 functions as one of the plate-like substrates of the invention according to the camera module. The transparent substrate 22 is composed of a transparent or translucent plate-like substrate such as glass. A central portion corresponding to the light receiving region of the sensor 6 is transparent or semi-transparent, and has an adhesive region that adheres to the holding member 24 around it. A wiring layer 23 is formed in advance on a surface opposite to the surface to be bonded to the holding member 24 at a position where the transmitted light is not blocked. A part of the wiring layer 23 is connected to a plurality of electrodes PAD (solder balls) included in the electrode unit 7. Thus, the transparent substrate 22 fixes the image sensor 21 and the wiring layer 23 is electrically connected to the electrode part 7 of the image sensor 21 by the electrode PAD attached to the electrode part 7.
Like the holding member 3 in the first embodiment, the holding member 24 is made of a light-shielding synthetic resin such as black polycarbonate or polybutylene terephthalate, and has a cylindrical shape such as a square tube. The lens 2 is held at a predetermined height on the inner periphery. The adhesive surface of the holding member 24 with the image sensor 21 is opened in a square shape in accordance with the light receiving area of the sensor 6. Further, there is no problem even if the holding member 24 is formed so as to cover the side surface of the transparent substrate 22.

Here, the separation distance between the image sensor 21 and the transparent substrate 22 is determined by the size of the electrode PAD. Since it is easy to control the size of the electrode PAD, the image sensor 21 and the transparent substrate 22 can be accurately positioned. Further, since the positioning is performed by the plurality of electrodes PAD, the separation distance between the image sensor 21 and the transparent substrate 22 is averaged.
Solder balls 25 are arranged at other positions on the output surface side of the transparent substrate 22. The solder balls 25 ensure electrical connection between the transparent substrate 22 and an external substrate (not shown). The solder ball 25 is also used as a spacer for separating the image sensor 21 fixed to the transparent base material 22 and the external substrate from each other.
Since the transparent base material 22 covers the electrode part 7 of the image sensor 21, the use of the upper part of the electrode part 7 as an adhesive surface with the holding member 3 increases the adhesion area and improves the adhesive strength. The length extending to the bottom surface of the leg portion of the height (the height from the transparent base material 22) to which the lens 2 is attached is the sensor 6 of the image sensor 21 in consideration of the thickness of the transparent base material 22 and the optical characteristics. It is almost the same as the focal length up to.

  In the case of the second embodiment, the solder ball 25 is used for connection to an external substrate (not shown), but it may be connected by other metal balls such as a gold ball or brought into contact with the external substrate (not shown). It may be fixed with a resin in the state, and is not limited at all. Moreover, although the transparent base material 22 is provided with the wiring layer 23 in FIG. 9, there is no problem even if it is not provided.

As described above, according to the camera module 20 according to the present embodiment, the depression 10 on the bonding surface of the holding member 24 reduces the R of the R portion formed at the corner, so that the bonding protrudes from the transparent base material 22. The protruding amount of the agent 9 can be reduced, and the adhesive that enters the light receiving region can be reduced. Thereby, a camera module with high photographing quality can be provided.
In addition, since the wiring layer 23 is formed on the surface opposite to the bonding surface between the holding member 24 and the transparent base material 22, the transparent base material 22 covers the electrode portion 7 of the image sensor 21, and thus the transparent base material 22. By using the upper part of the electrode part 7 at the time of adhesion | attachment with the holding member 24, an adhesion area can be increased and adhesive strength can be improved.

(Imaging device)
Next, a mobile phone 100 as an example of an imaging device equipped with the camera module 1 according to the first embodiment will be described. In addition to the mobile phone 100, the camera module 1 according to the first embodiment may be used in, for example, a camera mounted on a personal computer or a PDA (Personal Digital Assistant), a camera mounted on a car, a surveillance camera, or the like. It is possible to apply.

FIG. 10 is a block diagram showing the configuration of the mobile phone 100.
As shown in FIG. 10, the mobile phone 100 performs an image processor (ISP) 101 as an example of a signal processing unit that performs image processing on an image signal from the camera module 1 and various controls in the mobile phone 100. An MPU (Micro Processing Unit) 102 and an input key 103 for giving an instruction from the user to the MPU 102 are provided. In addition, the mobile phone 100 includes a liquid crystal display (LCD) 104 that displays a subject photographed by the camera module 1. The cellular phone 100 includes a memory 105 that stores various information for controlling the cellular phone 100 and a memory card 106 that records image data.
Furthermore, the mobile phone 100 receives, for example, mobile phone band radio waves via the antenna 107 and communicates with an RF (Radio Frequency) unit 108 that performs wireless communication with a server provided by a mobile phone operator or the like. A baseband unit 109 that generates a sound signal, an audio codec unit 112 that reproduces sound such as a voice during a call and a ringing melody, and a speaker 110 that outputs a ringing sound based on the signal from the audio codec unit 112 The LED 111 is provided to notify the incoming call by light.
Further, the camera module 1 communicates with the MPU 102 through an interface such as IIC or SPI, and transmits and receives signals.

  In the mobile phone 100, when the digital camera use mode is selected with the input key 103, the MPU 102 starts communication with the camera module 1. Then, the MPU 102 transmits a control signal to the camera module 1. Then, the light from the subject that has passed through the lens 2 of the camera module 1 is converted into an electrical signal by the sensor 6 of the camera module 1, and signal processing is performed by the ISP 101. The image signal processed by the ISP 101 is temporarily stored in the memory 105 of the mobile phone 100 and displayed on the LCD 104 as a through image.

By the way, the photographing of the subject is performed by the shutter button on the input key 103. When the shutter button is pressed, the MPU 102 stores the image data processed by the ISP 101 in the memory 105. The MPU 102 includes a compression / decompression circuit using a technique such as JPEG or MPEG, and the image data stored in the memory 105 is compressed by the MPU 102 and recorded on the memory card 106. Further, the image data recorded on the memory card 106 can be decompressed by the MPU 102, read into the memory 105, and displayed again on the LCD 104.
Note that the MPU 102 can select a shooting mode and set white balance, exposure, sensitivity, and the like by an operation from the input key 103. Further, when the image data processed by the ISP 101 is stored in the memory 105, digital zoom processing can be performed.

  As described above, according to the cellular phone 100 according to the present embodiment, the depression 10 on the bonding surface of the holding member 3 reduces the R of the R portion formed at the corner, so The protrusion can be reduced, and the adhesive entering the light receiving area can be reduced. Thereby, the mobile phone 100 having a camera module with high photographing quality can be provided.

1 is an external perspective view of a camera module according to a first embodiment. It is a longitudinal cross-sectional view of the camera module shown in FIG. It is sectional drawing of the camera module in the cross-sectional position shown in FIG. It is a figure which shows the state of adhesive application in the corner part of the adhesion surface of the holding member of the camera module shown in FIG. It is a figure which shows the application example 1 which formed the recessed part in the center of the side of a contact surface. It is a figure which shows the application example 2 which formed the recessed part in the center of the edge | side of a contact surface. It is a figure which shows the application example 3 which formed the recessed part from the inner wall side and the outer wall side from the both sides of the contact surface. It is a longitudinal cross-sectional view of the application example 4 which comprised the lens and the holding member by integral molding. It is a longitudinal cross-sectional view of the camera module concerning 2nd embodiment. It is the block diagram which showed the structure of the mobile telephone which employ | adopted the camera module shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,15,20 ... Camera module, 2 ... Lens, 3,24 ... Holding member, 4,21 ... Image sensor, 5 ... Through hole, 6 ... Sensor, 7 ... Electrode part, 8 ... Logic circuit part, 9 ... Adhesion Agent, 10 ... depression, 11 ... recess, 12 ... recess, 16 ... member, 22 ... transparent substrate, 23 ... wiring layer,
DESCRIPTION OF SYMBOLS 100 ... Mobile phone, 101 ... Image processor (ISP), 102 ... MPU, 103 ... Input key, 104 ... Liquid crystal display (LCD), 105 ... Memory, 106 ... Memory card, 107 ... Antenna, 108 ... RF part, 109 ... baseband part, 110 ... speaker, 111 ... LED, 112 ... audio codec part

Claims (11)

An image sensor including an image sensor that converts the light incident on the light receiving region into an electrical signal and outputs the electrical signal;
A lens that condenses light incident from the outside onto the light receiving region of the image sensor;
A holding member that holds the lens and is bonded to the surface of the image sensor on the side of the light receiving region at an end surface with an adhesive;
A camera module, comprising: a retracting means that is formed on at least a part of the end surface of the holding member and retracts the adhesive. The light receiving area of the image sensor is square,
The holding member is open in a square shape in which the end surface of the holding member is aligned with the light receiving region of the image sensor;
2. The camera module according to claim 1, wherein the retracting means is a recess formed on an inner surface side of a corner portion of the end surface of the holding member so as to reduce an area of the end surface.   The camera module according to claim 1, wherein the retracting means is a concave portion formed from an inner side to an outer side of the end surface of the holding member.   The camera module according to claim 1, wherein the retracting means is a recess formed from an outer side to an inner side of the end surface of the holding member. The retracting means is a first recess formed from the inner side of the end surface of the holding member toward the outer side, and a second recess formed from the outer side toward the inner side,
The camera module according to claim 1, wherein the first recess and the second recess are alternately formed on the end surface. An image sensor that converts the light incident on the rectangular light receiving region into an electric signal and outputs the signal, and a logic circuit unit that is formed on the surface of the light receiving region and that processes the electric signal output from the image sensor. An image sensor with
A lens that condenses light incident from the outside onto the light receiving region of the image sensor;
The lens is held, and an end surface opens in a square shape matching the light receiving region of the image sensor and is attached to the surface on the light receiving region side of the image sensor. And a holding member having a depression formed on the inner surface side of the end face so as to reduce the area of
At least a part of a portion where the holding member is bonded to the image sensor overlaps with the logic circuit unit.   The camera module according to claim 6, wherein the lens and the holding member are formed by integral molding. The holding member is bonded to the image sensor with an adhesive,
The camera module according to claim 6, wherein a focal point of the lens with respect to the light receiving region is adjusted by the adhesive. An image sensor having a rectangular light receiving area, and an image sensor that converts light incident on the light receiving area into an electrical signal and outputs the electric signal;
A lens that condenses light incident from the outside onto the light receiving region of the image sensor;
A plate-like cover member that transmits light incident through the lens to the light receiving region of the image sensor;
A holding member that holds the lens, is bonded to the cover member at an end surface with an adhesive, and the end surface is opened in a square shape that matches the light receiving region of the image sensor;
A camera module, comprising: a depression formed on an inner surface side of the holding member so as to reduce an area of the end surface at a corner portion of the end surface of the holding member. The cover member includes a wiring layer on a surface opposite to a surface to which the holding member is bonded,
The image sensor includes an electrode unit that outputs the electrical signal output from the imaging element to the wiring layer of the cover member on a surface on the light receiving region side,
The region of the surface on the opposite side of the cover member in the region where the holding member is bonded in the cover member includes a portion where the electrode portion of the image sensor and the wiring layer of the cover member are connected. The camera module according to claim 9. An image sensor having a rectangular light receiving area, and an image sensor that converts light incident on the light receiving area into an electrical signal and outputs the electric signal;
A lens that focuses light from the outside onto the light receiving region of the image sensor;
The lens is held, an end surface is opened in a square shape matching the light receiving region of the image sensor, and is adhered to the surface of the image sensor on the side of the light receiving region with an adhesive, and the end surface is provided at a corner of the end surface. A holding member having a depression formed on the inner surface side of the end face so as to reduce the area of
An image pickup apparatus comprising: a signal processing unit that is connected to the image sensor and processes the electric signal output from the image pickup element of the image sensor.

Images