JP7188316B2 - Camera module manufacturing method - Google Patents

Description

The present invention relates to a camera module manufacturing method.

As a camera module of this type, for example, a camera module disclosed in Patent Document 1 has been conventionally known. The camera module described in this patent document 1 has a lens and an imaging element. This camera module is of a fixed focus type in which the distance between the lens and the image sensor in the optical axis direction does not change.

Japanese Patent Application Laid-Open No. 2009-17370

A fixed-focus camera module such as the camera module of Patent Document 1 has a fixed lens component that transmits light in the optical axis direction through the lens and an image sensor that converts the light that has passed through the lens component into an electrical signal. and an imaging device substrate. The lens component is adhered and fixed to the imaging element substrate with an adhesive.

In the fixed-focus type camera module, the level of demand for high precision is increasing year by year with respect to the assembling and bonding process for bonding and fixing the lens parts to the imaging element substrate. However, in the assembling and bonding process, shrinkage of the adhesive occurs as the adhesive hardens. This shrinkage of the adhesive affects the product accuracy of the camera module and causes a decrease in the product accuracy of the camera module. As a result of detailed studies by the inventors, the above was found.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a camera module manufacturing method capable of suppressing deterioration in product accuracy of a camera module due to shrinkage of an adhesive for adhering a lens component to an imaging element substrate. With the goal.

In order to achieve the above object, the camera module manufacturing method according to claim 1 comprises:
A lens component (12) having a lens (122) and transmitting light in an optical axis direction (Db) through the lens, an imaging device (15) for converting the light passing through the lens component into an electric signal, and the imaging device A method for manufacturing a camera module comprising an imaging element substrate (16) to which is fixed and an imaging component (14) having
Performing component measurement (P02) for measuring the lens component and the imaging component, respectively;
At least one of the lens component and the imaging component is moved, and the relationship between the relative position (Pr) of the imaging element substrate with respect to the lens component in the optical axis direction and the MTF value (Vm) based on the electrical signal from the imaging element Obtaining (P04) an MTF measurement result (Rm) that is
Performing pre-curing position adjustment (P08) by moving at least one of the lens component and the imaging component so that the relative position becomes the pre-curing target position (P2r);
After the pre-curing position adjustment, perform adhesive curing for curing the adhesive (13) filled in the axial gap (12a) formed between the lens component and the imaging element substrate in the optical axis direction (P09 , P10) and
In the pre-curing position adjustment, the target value of the axial clearance (Cz) obtained after curing the adhesive, which is the post-curing target clearance determined based on the MTF measurement result and the part measurement result obtained by part measurement The above relative position where the target gap amount before curing (C2z) obtained by adding a correction amount (AMz) determined based on the shrinkage rate of the adhesive to (C1z) and the gap amount in the axial direction is used as the target position ,
moreover,
After obtaining the MTF measurement result, the relative position is set to a position where the gap amount in the axial direction becomes the target gap amount after curing, and then the MTF value is measured again (P06);
Performing MTF value collation (P07) for collating the MTF value measured in the MTF value remeasurement and the MTF measurement result,
After remeasurement of the MTF value, pre-curing position adjustment is performed.

In this way, the adhesive is cured in a state in which the relative position of the imaging device substrate with respect to the lens component is adjusted to the position in which the amount of shrinkage of the adhesive is taken into consideration. However, the effect of adhesive shrinkage is suppressed. Therefore, it is possible to suppress deterioration in product accuracy of the camera module due to shrinkage of the adhesive.

It should be noted that the reference numerals in parentheses attached to each component etc. indicate an example of the correspondence relationship between the component etc. and specific components etc. described in the embodiments described later.

2 is a schematic cross-sectional view showing a schematic configuration of a camera module in the first embodiment; FIG. 4 is a flow chart showing a process of bonding a lens component included in the camera module and an imaging element substrate among manufacturing processes of the camera module of the first embodiment. FIG. 3 is a diagram schematically showing how lens components are measured in the manufacturing process of FIG. 2 ; FIG. 3 is a diagram schematically showing how an imaging component is measured in the manufacturing process of FIG. 2 ; FIG. 2 is a cross-sectional view corresponding to FIG. 1 and is a schematic diagram showing the camera module before the lens component and the imaging element substrate are bonded together; 3 is a perspective view schematically showing a state in which the lens component is attached to the clamp jig of the camera module manufacturing apparatus and the imaging component is attached to the six-axis drive stage of the camera module manufacturing apparatus in the manufacturing process of FIG. 2; FIG. FIG. 7 is a perspective view, corresponding to FIG. 6 , schematically showing how an energy irradiation device heats an adhesive for bonding a lens component and an imaging element substrate in the manufacturing process of FIG. 2 ; 2 is a block diagram showing a control device of the camera module manufacturing apparatus and devices electrically connected to the control device in the first embodiment; FIG. The MTF measurement result, which is the relationship between the relative position of the image sensor substrate with respect to the lens component in the optical axis direction and the MTF value based on the image signal from the image sensor, measured in the manufacturing process of FIG. It is a diagram showing. FIG. 2 is a diagram showing the difference between before and after correction of the relative position of the imaging element substrate with respect to the lens component in the optical axis direction, using the cross-sectional view corresponding to FIG. 1 ;

Hereinafter, embodiments will be described with reference to the drawings. In addition, in each of the following embodiments including other embodiments described later, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
As shown in FIG. 1, the camera module 10 of this embodiment is a fixed-focus camera module. The camera module 10 includes a lens component 12 and an imaging component 14 having an imaging device 15 and an imaging device substrate 16 .

The lens component 12 has a lens case 121 and a plurality of lenses 122 . Inside the lens case 121, a light passage hole 121a is formed through which light passes through the lens component 12 in the optical axis direction Db. A plurality of lenses 122 are arranged in the light passage holes 121 a and fixed to the lens case 121 . Accordingly, the lens component 12 transmits light in the optical axis direction Db via the plurality of lenses 122 .

The imaging element 15 converts the light that has passed through the lens component 12 into an electrical signal. The image pickup device 15 is mounted on an image pickup device mounting surface 161, which is one surface of the image pickup device substrate 16, and is fixed to the image pickup device mounting surface 161 by, for example, soldering.

The imaging device substrate 16 has an imaging device mounting surface 161 as one surface of the imaging device substrate 16 and an imaging device opposite surface 162 as the other surface. The imaging element substrate 16 is an electric substrate on which a wiring pattern is formed. The imaging element substrate 16 is also called an imager substrate.

Specifically, the light incident on the camera module 10 reaches the imaging element 15 on the imaging element substrate 16 after passing through the plurality of lenses 122 in the lens component 12 from one side to the other side in the optical axis direction Db.

In addition, the lens case 121 has a case brim portion 121b extending in a direction perpendicular to the optical axis direction Db, and a case other end 121e provided on the other side in the optical axis direction Db. The case collar portion 121b has a thickness direction in the optical axis direction Db and has one surface 121c facing one side in the optical axis direction Db.

The other case end 121 e of the lens case 121 faces the imaging element mounting surface 161 of the imaging element substrate 16 . The lens component 12 is fixed to the imaging element mounting surface 161 of the imaging element substrate 16 with the adhesive 13 at the other end 121e of the case. Note that the adhesive 13 in FIG. 1 is the adhesive after curing, and the adhesive 13 in FIGS. 10A and 10B to be described later is the adhesive before curing.

The camera module 10 of this embodiment is manufactured according to the flowchart of FIG. FIG. 2 shows a manufacturing process for adhesively fixing the lens component 12 to the imaging element substrate 16. As shown in FIG.

First, in a first step P01 as a component preparation step, the lens component 12 and the imaging component 14 are prepared. After the first step P01, the process proceeds to the second step P02.

In the second step P02 as a component measurement step, as shown in FIGS. 3 and 4, component measurement is performed to measure the lens component 12 and the imaging component 14 using a measuring device 44 such as a three-dimensional measuring machine. is done. In the component measurement, the outer shape of each of the lens component 12 and the imaging component 14 is measured. Specifically, the dimensions of a plurality of predetermined measurement points in each outer shape are measured. The plurality of measurement points are determined so that the gap amount Cz of the axial gap 12a formed in the optical axis direction Db between the lens component 12 and the imaging element substrate 16 shown in FIG. 5 can be calculated.

For example, the dimensions of the plurality of measurement points include the thickness dimension Tb of the imaging device substrate 16, and the case reference dimension Lcs, which is the dimension in the optical axis direction Db from one surface 121c of the case flange 121b to the other end 121e of the case. It is included. To be more precise, the axial gap 12a is formed in the optical axis direction Db between the other end 121e of the case of the lens component 12 and the imaging element mounting surface 161 of the imaging element substrate 16. Axial clearance. After the second step P02 in FIG. 2, the process proceeds to the third step P03.

In a third process P03 as a component mounting process, the lens component 12 and the imaging component 14 are respectively mounted on the camera module manufacturing apparatus 30, as shown in FIG. The camera module manufacturing apparatus 30 includes a clamp jig 32, a six-axis drive stage 34, a light projector 36, an energy irradiation device 38, and a control device 40, as shown in FIGS.

The clamp jig 32 is a fixed fixture that does not move. The lens component 12 is attached to this clamping jig 32 of the camera module manufacturing apparatus 30 , and the imaging component 14 is attached to a six-axis drive stage 34 .

The 6-axis drive stage 34 can move in the X direction that is the X-axis direction of the orthogonal coordinate system shown in FIG. 6, the Y direction that is the Y-axis direction, the Z direction that is the Z-axis direction, and rotation about the X-axis. The imaging component 14 can be displaced in each of the direction θx, the rotation direction θy about the Y axis, and the rotation direction θz about the Z axis. Therefore, displacing the imaging component 14 by the 6-axis driving stage 34 means changing the position or posture of the imaging component 14 by the 6-axis driving stage 34 . In this embodiment, the optical axis direction Db of the lens component 12 is the Z direction. That is, the optical axis direction Db is the same direction as the Z direction.

This six-axis drive stage 34 operates independently of the clamp jig 32 . That is, even if the six-axis drive stage 34 is operated to displace the imaging component 14, the lens component 12 fixed to the clamp jig 32 is not displaced.

The light projector 36 has a collimator and emits parallel light from one side of the lens component 12 in the optical axis direction Db to the imaging device 15 through the light passage hole 121a of the lens component 12 along the optical axis direction Db. Then, the light projector 36 projects a predetermined image for MTF value calculation onto the image sensor 15 through the light passage hole 121a of the lens component 12 with the parallel light. Note that "MTF" is an abbreviation for "modulation transfer function".

The energy irradiation device 38 shown in FIG. 7 is a heating device that heats the adhesive 13 for bonding the lens component 12 and the imaging element substrate 16 together. The energy irradiation device 38 irradiates the adhesive 13 filled in the axial gap 12a (see FIG. 5) between the lens component 12 and the imaging element substrate 16 with irradiation light from the energy irradiation device 38, The adhesive 13 is heated. The adhesive 13 is a thermosetting adhesive that hardens when heated by the energy irradiation device 38 to bond the lens component 12 and the imaging element substrate 16 together. Although the irradiation light of the energy irradiation device 38 is laser light in this embodiment, light other than laser light (for example, ultraviolet rays) may be employed as the irradiation light of the energy irradiation device 38 .

A control device 40 shown in FIG. 8 is a personal computer including a central processing unit and its peripheral circuits, and operates according to a program read into the central processing unit. A display monitor for displaying various information is connected to the control device 40 .

The control device 40 is electrically connected to the image sensor 15 so that an image signal, which is an electrical signal output by the image sensor 15 , is input to the control device 40 .

The control device 40 also outputs control signals to the six-axis drive stage 34, the light projector 36, and the energy irradiation device 38, respectively. Thereby, the control device 40 controls the operation of the six-axis drive stage 34, the operation of the light projector 36, and the operation of the energy irradiation device 38, respectively. After the third step P03 in FIG. 2, the process proceeds to the fourth step P04.

In the fourth step P04 as the MTF value measuring step, first, the inclination of the imaging component 14 with respect to the lens component 12 in FIG. In this inclination adjustment of the imaging component 14 , the control device 40 causes the light projector 36 to project a predetermined image, and calculates the MTF value Vm, which changes according to the inclination of the imaging component 14 , based on the image signal from the imaging device 15 . . Then, the control device 40 adjusts the tilt of the imaging component 14, for example, so that the calculated MTF value Vm is maximized.

Next, the control device 40 moves the imaging component 14 relative to the lens component 12 in the optical axis direction Db by operating the six-axis drive stage 34, and changes according to the movement of the imaging component 14. An MTF value Vm is calculated based on the image signal from the imaging device 15 . As a result, the MTF measurement result Rm indicated by the curve Lm in FIG. 9 is obtained.

As shown in FIG. 9, this MTF measurement result Rm is the relative position Pr of the image sensor substrate 16 with respect to the lens component 12 in the optical axis direction Db (that is, the relative position Pr in the optical axis direction) and the image from the image sensor 15 It is the relationship with the MTF value Vm based on the signal. In other words, since the gap amount Cz of the axial gap 12a in FIG. 5 corresponds to the relative position Pr in the optical axis direction one-to-one, the MTF measurement result Rm in FIG. It can also be said that it is a relationship with the value Vm.

In addition, in the camera module manufacturing apparatus 30 of the present embodiment, the relative position Pr in the optical axis direction is represented by the relative position representative dimension Lap in FIG. The relative position representative dimension Lap is the distance in the optical axis direction Db from the one surface 121c of the case collar portion 121b to the surface 162 of the image sensor substrate 16 opposite to the image sensor. Also, the relative position representative dimension Lap is a dimension that the camera module manufacturing apparatus 30 has, and thus is a dimension that is determined when the operating conditions of the six-axis drive stage 34 are determined. After the fourth step P04 in FIG. 2, the process proceeds to the fifth step P05.

In a fifth step P05 as a target position determination step, the controller 40 converts the post-curing target position P1r, which is the target position of the optical axis direction relative position Pr obtained after the adhesive 13 is cured, to the MTF measurement result Rm of FIG. decision based on Specifically, the control device 40 determines the optical axis direction relative position Pr at which the MTF value Vm reaches the maximum value V1m in the MTF measurement result Rm as the post-curing target position P1r. That is, the control device 40 determines the post-curing target position dimension L1ap, which is the relative position representative dimension Lap for realizing the post-curing target position P1r. The term "after curing of the adhesive 13" as used herein may be after temporary curing or after main curing of the adhesive 13, which will be described later, but in this embodiment, it means after main curing.

Then, the control device 40 calculates a post-curing target clearance C1z, which is a target value for the clearance Cz (see FIG. 5) of the axial clearance 12a obtained after the adhesive 13 is cured. The post-curing target gap amount C1z is determined based on the MTF measurement result Rm in FIG. 9 and the part measurement result obtained in the part measurement in the second step P02. Specifically, as can be seen from FIGS. 5 and 9, the post-curing target clearance C1z is composed of the post-curing target position dimension L1ap, the case reference dimension Lcs included in the component measurement result, and the thickness dimension Tb of the imaging element substrate 16. and is calculated according to the following formula F1.
C1z=L1ap−Lcs−Tb (F1)

In addition, in the fifth step P05, the control device 40 also determines a correction amount AMz used when correcting the post-curing target position dimension L1ap. Specifically, the control device 40 determines the amount of shrinkage of the adhesive 13 when it shrinks in the optical axis direction Db as it cures, as the correction amount AMz. That is, as a result of correcting the optical axis direction relative position Pr using the correction amount AMz before curing the adhesive 13, the control device 40 corrects the optical axis direction relative position Pr to the post-curing target after curing the adhesive 13. The correction amount AMz is determined so as to be the position P1r.

Since the correction amount AMz is determined in this way, the pre-hardening target gap amount C2z, which is the target value of the gap amount Cz (see FIG. 5) of the axial gap 12a before hardening of the adhesive 13, is given by the following formula F2. is obtained by adding the correction amount AMz to the post-curing target gap amount C1z.
C2z=C1z+AMz (F2)

Further, since the correction amount AMz is "correction amount AMz=shrinkage amount of the adhesive 13", the correction amount AMz is obtained using the shrinkage rate Rs of the adhesive 13 and the pre-curing target gap amount C2z (see FIG. 9). is also given by the following formula F3. The shrinkage ratio Rs of the adhesive 13 is the ratio of the amount of shrinkage to the length before shrinkage of the adhesive 13 that shrinks as it cures. Since the shrinkage ratio Rs of the adhesive 13 is one of the physical properties of the adhesive 13, it is a value determined when the type of the adhesive 13 is determined.
AMz=C2z×Rs (F3)

Also, the following formula F4 is derived from the above formulas F2 and F3. As can be seen from the following formula F4, the correction amount AMz is a calculated value based on the shrinkage ratio Rs of the adhesive 13 and the post-curing target gap amount C1z obtained from the part measurement result in the second step P02. It is a value determined based on the shrinkage ratio Rs and part measurement results.
AMz=C1z×Rs/(1−Rs) (F4)

In this fifth step P05, the correction amount AMz is determined using the above formula F4. After the fifth step P05 in FIG. 2, the process proceeds to the sixth step P06.

In the sixth step P06 as the MTF value remeasurement step, as shown in FIGS. move. As a result, the controller 40 sets the optical axis direction relative position Pr to a position where the gap amount Cz of the axial gap 12a becomes the post-curing target gap amount C1z (that is, the post-curing target position P1r).

In short, the imaging component 14 is moved by the operation of the six-axis drive stage 34 so that the optical axis direction relative position Pr coincides with the post-curing target position P1r. Specifically, as shown in FIG. 10A, the imaging component 14 is moved by the operation of the six-axis drive stage 34 so that the relative position representative dimension Lap matches the post-curing target position dimension L1ap.

Next, the control device 40 matches the optical axis direction relative position Pr with the post-curing target position P1r, and measures the MTF value Vm based on the image signal from the imaging device 15 again. In short, MTF value remeasurement is performed to measure the MTF value Vm. After the sixth step P06 in FIG. 2, the process proceeds to the seventh step P07.

In a seventh step P07 as an MTF value collation step, the controller 40 performs MTF value collation for collating the MTF value Vm measured in the MTF value remeasurement in the sixth step P06 with the MTF measurement result Rm in FIG.

Specifically, the control device 40 checks the difference between the MTF value Vm measured in the sixth step P06 and the maximum value V1m of the MTF value Vm in the MTF measurement result Rm of FIG. As a result of the confirmation, if the difference in the MTF value Vm is within a predetermined allowable range, the controller 40 determines that there is no abnormality, and proceeds to the next step. On the other hand, if the difference in the MTF value Vm is out of the allowable range, the control device 40 determines that there is an abnormality, and stops the manufacturing process of FIG. 2, for example. After the seventh step P07 in FIG. 2, the process proceeds to the eighth step P08.

In the eighth process P08 as a position adjustment process, as shown in FIGS. 5, 6, and 9, the control device 40 moves the six-axis drive stage so that the optical axis direction relative position Pr becomes the pre-curing target position P2r. Pre-curing position adjustment for moving the imaging component 14 is performed by the operation of 34 . The pre-curing target position P2r is the target position of the optical axis direction relative position Pr before the adhesive 13 is cured. In this pre-curing position adjustment, the control device 40 uses the optical axis direction relative position Pr at which the gap amount Cz of the axial gap 12a becomes the pre-curing target gap amount C2z as the pre-curing target position P2r.

Specifically, in the pre-curing position adjustment of the eighth step P08, the control device 40 sets the pre-curing target position dimension L2ap, which is the relative position representative dimension Lap for realizing the pre-curing target position P2r, as shown in the following formula F5. Then, the correction amount AMz is added to the post-curing target gap amount C1z.
L2ap=L1ap+AMz (F5)

Then, as shown in FIG. 10B, the control device 40 moves the imaging component 14 by operating the six-axis drive stage 34 so that the relative position representative dimension Lap becomes the pre-curing target position dimension L2ap. . That is, the control device 40 moves the imaging component 14 away from the lens component 12 as indicated by the arrow Adn in FIG. It is moved in the axial direction Db by the correction amount AMz. After the eighth process P08 in FIG. 2, the process proceeds to the ninth process P09.

In the ninth step P09 as the first curing step, the controller 40 irradiates the adhesive 13 filled in the axial gap 12a between the lens component 12 and the imaging device substrate 16 with energy, as shown in FIG. Temporary curing is performed by heating with the device 38 and thereby curing the adhesive 13 . After the ninth step P09 in FIG. 2, the process proceeds to the tenth step P10.

In a tenth step P10 as a second curing step, the temporarily cured camera module 10 is heated with a heater such as a furnace, thereby further curing the adhesive 13 to perform a final curing. This main curing increases the strength of the adhesive 13, and the strength of the adhesive 13 becomes sufficiently large. In the present embodiment, the above temporary curing and final curing of the adhesive 13 are collectively referred to as adhesive curing. The camera module 10 of this embodiment is manufactured as described above.

As described above, according to the present embodiment, as shown in FIGS. 2, 9, and 10, in the eighth step P08, the imaging component is adjusted so that the optical axis direction relative position Pr becomes the pre-curing target position P2r. 14 is moved by actuation of the six-axis drive stage 34 . In the subsequent ninth step P09, temporary curing of the adhesive 13 is performed. Then, in the eighth step P08, the optical axis direction relative position Pr at which the gap amount Cz of the axial gap 12a becomes the pre-curing target gap amount C2z is used as the pre-curing target position P2r. The target gap amount before curing C2z is obtained by adding a correction amount AMz determined based on the shrinkage rate Rs of the adhesive 13 and the target gap amount after curing C1z to the target gap amount after curing C1z.

As a result, the relative position Pr of the imaging element substrate 16 with respect to the lens component 12 in the optical axis direction Db (that is, the relative position Pr in the optical axis direction) is set to a position that takes into account the shrinkage of the adhesive 13 due to curing. , the adhesive 13 is cured.

Therefore, the relative position Pr in the optical axis direction obtained after curing the adhesive 13 is less affected by the shrinkage of the adhesive 13 . Therefore, it is possible to suppress deterioration in product accuracy of the camera module 10 due to shrinkage of the adhesive 13 . In addition, it is possible to suppress variations in the relative position Pr in the optical axis direction due to shrinkage of the adhesive 13 due to curing.

Further, according to the present embodiment, in the sixth step P06 of FIG. 2, the imaging component 14 is moved by the six-axis drive stage 34 so that the optical axis direction relative position Pr coincides with the post-curing target position P1r. Then again the MTF value Vm is measured. In the following seventh step P07, the MTF value Vm remeasured in the sixth step P06 and the MTF measurement result Rm obtained in the fourth step P04 are collated.

Therefore, by checking the MTF value Vm in the seventh step P07, it is confirmed that the above MTF measurement result Rm is correct, so the defective rate of the camera module 10 can be reduced.

(Other embodiments)
(1) In the first embodiment described above, as shown in FIG. 6, the camera module manufacturing apparatus 30 adjusts the relative position of the image sensor substrate 16 with respect to the lens component 12 without moving the lens component 12. 14 is moved, but this is an example. Since the relative positions need only be adjusted, the camera module manufacturing apparatus 30 may move the lens component 12 without moving the imaging component 14, or may move both the imaging component 14 and the lens component 12. You may let

(2) In the first embodiment described above, the adhesive 13 is cured by heating as shown in FIG. 7, but this is an example. The adhesive 13 need not be thermosetting and may be cured by methods other than heating.

(3) In the above-described first embodiment, as shown in FIG. 2, it is described that the steps of manufacturing the camera module 10 are sequentially performed from the first step P01 to the tenth step P10, but this is just an example. . The steps P01 to P10 in FIG. 2 are not limited to being performed in the order shown in FIG. The steps P01 to P10 include, for example, steps that may be performed in parallel and steps that may be performed one after the other.

(4) In the first embodiment described above, as shown in FIG. 2, after the sixth step P06 and the seventh step P07 are performed, in the eighth step P08, the optical axis direction relative position Pr is set to the pre-curing target position. Although the imaging component 14 is moved to P2r, this is an example. For example, it is conceivable that the sixth process P06 and the seventh process P07 are omitted, and the eighth process P08 is performed after the fifth process P05.

(5) In the first embodiment described above, the dimensions of the measurement locations measured in the second step P02 of FIG. but this is just one example. It is conceivable that the dimension of the measurement location measured in the second step P02 is a dimension other than the thickness dimension Tb of the imaging element substrate 16 and the case reference dimension Lcs.

(6) In the first embodiment described above, the correction amount AMz shown in FIG. 10 is calculated based on the shrinkage rate Rs of the adhesive 13 and the post-curing target clearance C1z, but this is an example. Since the correction amount AMz should be "correction amount AMz=shrinkage amount of the adhesive 13", the correction amount AMz may be calculated using parameters other than the post-curing target clearance C1z, for example.

(7) It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made. Further, in the above-described embodiments, it goes without saying that the elements constituting the embodiments are not necessarily essential, except when explicitly stated as being essential or when they are considered to be clearly essential in principle. .

In addition, in the above embodiments, when numerical values such as the number, numerical value, amount, range, etc. of the constituent elements of the embodiment are mentioned, when it is explicitly stated that they are essential, and when they are clearly limited to a specific number in principle It is not limited to that particular number, except when In addition, in the above embodiments, when referring to materials, shapes, positional relationships, etc. of components, etc., unless otherwise specified or in principle limited to specific materials, shapes, positional relationships, etc., The material, shape, positional relationship, etc. are not limited.

REFERENCE SIGNS LIST 10 camera module 12 lens component 12a axial gap 13 adhesive 14 imaging component 15 imaging element 16 imaging element substrate Cz gap amount of axial gap 12a AMz correction amount Db optical axis direction

Claims (1)

A lens component (12) having a lens (122) and transmitting light in an optical axis direction (Db) through the lens, an imaging device (15) for converting the light passing through the lens component into an electric signal, and the imaging device. A method for manufacturing a camera module comprising an imaging component (14) having an imaging element substrate (16) to which an element is fixed, comprising:
performing component measurement for measuring the lens component and the imaging component (P02);
At least one of the lens component and the imaging component is moved, and an MTF based on the relative position (Pr) of the imaging element substrate with respect to the lens component in the optical axis direction and the electrical signal from the imaging element Obtaining the MTF measurement result (Rm) which is the relationship with the value (Vm) (P04);
performing pre-curing position adjustment (P08) by moving at least one of the lens component and the imaging component so that the relative position becomes the pre-curing target position (P2r);
After the pre-curing position adjustment, adhesive curing is performed to cure the adhesive (13) filled in the axial gap (12a) formed between the lens component and the imaging element substrate in the optical axis direction. doing (P09, P10),
In the pre-curing position adjustment, a target value of the clearance amount (Cz) of the axial clearance obtained after curing the adhesive is determined based on the MTF measurement result and the part measurement result obtained in the part measurement. The clearance amount of the axial clearance becomes the target clearance amount before curing (C2z) obtained by adding the correction amount (AMz) determined based on the shrinkage rate of the adhesive to the target clearance amount after curing (C1z). using the relative position as the pre-curing target position;
moreover,
After obtaining the MTF measurement result, the relative position is set to a position where the clearance amount of the axial clearance becomes the target clearance amount after curing, and then the MTF value is remeasured to measure the MTF value ( P06) and
performing MTF value collation for collating the MTF value measured in the MTF value remeasurement and the MTF measurement result (P07),
A method of manufacturing a camera module , wherein the pre-curing position adjustment is performed after remeasurement of the MTF value .

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