TWI741381B - The image-capturing assembly - Google Patents

Abstract

An image-capturing assembly includes a printed circuit board, an optical filter, an image-capturing element located between the printed circuit board and the optical filter and a support member, wherein the support member includes a fixed part. The image-capturing element is located on the printed circuit board, and electrically connected to the printed circuit board. The support member is located on the outside of the image-capturing element. The fixed part has a relative upper surface and an inferior surface, and the inferior surface is fixed on the printed circuit board. The optical filter is fixed to the upper surface of the fixed part.

Description

Image capture component

The present invention relates to an image capturing component, in particular to an image capturing component suitable for mobile devices.

With the development of technology and the progress of the times, people's demand for mobile devices has gradually increased. The most significant evolution is the improvement of device panel specifications, including changes in size, resolution, and module thickness, which directly affect the appearance of the product.

Take mobile phones as an example. Since the functions of mobile phones are not only for communication, but nowadays common mobile phone functions such as music listening, Internet access, mobile TV and image capture, the demand for template specifications is gradually moving towards large size and high resolution. .

However, the large size means the increase in weight, which does not meet the requirements of the current society for the lightness and thinness of mobile devices such as mobile phones. However, these requirements for devices to be thinner will face the problem of insufficient internal space of the devices.

In view of this, in order to cope with the problem of insufficient internal space of the device, the present invention relates to an image capture assembly. By reconfiguring different components of the image capture assembly and improve the arrangement of the components, the performance of the image capture assembly is improved. The overall thickness.

In one embodiment, an image capturing component includes a circuit board, an optical filter, an image capturing element between the circuit board and the optical filter, and a support, wherein the support includes a fixing portion. The image capturing element is located on the circuit board and is electrically connected to the circuit board. The support is located on the outer side of the image capturing element. The fixing part has an upper surface and a lower surface opposite to each other, and the lower surface is fixed to the circuit board. The optical filter is fixed on the upper surface of the fixing part.

In one embodiment, an image capturing component includes a metal plate, a circuit board with a hollow portion, an optical filter, and an image capturing element located in the hollow portion, wherein the image capturing element is located between the metal plate and the optical filter between. The circuit board is located on the metal plate. The optical filter is located on the circuit board. The image capturing element is fixed on the metal plate.

In one embodiment, an image capturing component includes a circuit board with a concave portion, an optical filter, and an image capturing element. The optical filter is located on the circuit board. The image capturing element is located between the concave portion and the optical filter.

In one embodiment, an image capturing component includes a circuit board, an image capturing element having an active area, a first bonding layer, and an optical filter having an upper surface and a lower surface. The image capturing component is located on the circuit board. The first adhesive layer is located outside the active area of the image capturing element. The optical filter is located above the image capturing element, and the lower surface of the optical filter is fixed on the first adhesive layer.

In summary, the image capturing assembly of some embodiments of the present invention shortens the optical filter and the support by changing the placement position of the image capturing element, the optical filter, and the support, or changing the fixing method of the optical filter and the support. The distance between the image capturing components and the overall thickness of the image capturing components are reduced. In this way, the purpose of thinner and lighter mobile devices is achieved.

The image capturing component 100 is suitable for mobile devices to capture static or dynamic images, among which common mobile devices such as mobile phones, cameras, laptops, and tablet computers. For example, the image capturing component 100 includes components such as a circuit board 110, an image capturing component 130, an optical filter 150, a voice coil motor 180, and a lens 190 (lens).

In some embodiments, the image capturing assembly 100 further includes a holder 170 (holder). For example, the supporting member 170 includes a fixing portion 171 for fixing the optical filter 150; the supporting member 170 includes a supporting portion 173 for supporting the voice coil motor 180; or, the supporting portion 170 includes a fixing portion 171 and a supporting portion 173, The optical filter 150 and the bearing voice coil motor 180 are respectively fixed. In other embodiments, the supporting member 170 further includes a foot 175 for fixing on the circuit board 110 to increase the stability of the load bearing and the overall mechanical strength.

In some embodiments, the image capturing device 100 further includes a metal plate 500, wherein the thickness of the metal plate 500 is smaller than the thickness of the circuit board 110. In some embodiments, the metal plate 500 is a steel plate.

The circuit board 110 may be, but is not limited to, a printed circuit board (PCB), a flexible PCB (Flexible PCB), or a rigid flexible printed circuit board (RFPC). In addition, in some embodiments, to meet the needs of mobile devices, the shape of the circuit board 110 may be a flat circuit board 110, a stepped circuit board 110, a circuit board 110 with a hollow inside, or a circuit board 110 with a recess inside. Wherein, the hollow part is disposed on and penetrates the circuit board 110; the concave part is disposed on but does not penetrate the circuit board 110, that is, the concave part has a bottom surface parallel to the lower surface of the circuit board 110.

The image-capturing element 130 (image-capturing element) is used to convert the optical image signal irradiated into the image-capturing element 130 into an electrical image signal. The above-mentioned optical image signal is from the outside of the mobile device through the lens 190 and the optical filter. After 150, it is shot into the active area of the image capturing element 130, where the active area is the area used for optical sensing. In some embodiments, the image capturing element 130 is a complementary metal-oxide-semiconductor active pixel sensor (CMOS (Complementary Metal-Oxide-Semiconductor) Active pixel sensor) or a charged coupled device (Charged Coupled Device).

In addition, the image capturing element 130 is electrically connected to the circuit board 110 described above. In some embodiments, the image capturing element 130 is electrically connected to the electrical connection surface of the circuit board 110 by a wire 200, wherein the wire is a gold wire, silver wire or other metal wire; the electrical connection surface is connected to the circuit board The upper surface of 110 is coplanar or non-coplanar. In some embodiments, the wire 200 is electrically connected to the image capturing element 130 and the circuit board 110 in a wire bond manner. In some embodiments, the image capturing element 130 is located on the circuit board 110, in the recess of the circuit board 110, or in the hollow portion of the circuit board 110 and on the metal plate 500. In some embodiments, the electrical connection surface is located outside the hollow portion or recessed portion of the circuit board 110. For example, when the electrical connection surface is located outside the hollow portion or recess of the circuit board 110 and is not coplanar with the upper surface of the circuit board 110, the electrical connection surface may be located at a distance from the upper surface of the circuit board 110. On the plane of the level difference, or the above-mentioned electrical connection surface may also be adjacent to the side wall of the hollow portion or recessed portion of the circuit board 110.

The optical filter 150 (or called an optical filter) is used to filter the optical image signal incident from the lens 190. In some embodiments, the optical filter 150 is used to allow visible light to pass through and block invisible light. For example, the wavelength range of the above visible light is generally 400-700 nanometers (nm), that is, the optical filter 150 can allow 400 -700nm wavelength light passes through, blocking light whose wavelength is not 400-700nm. In other embodiments, the optical filter 150 can transmit visible light and part of infrared light. In still other embodiments, the optical filter 150 only allows infrared rays to pass through.

In some embodiments, the material of the optical filter 150 may be glass or plastic.

In addition, the optical filter 150 is disposed corresponding to the image capturing element 130, more specifically, it can be disposed at least corresponding to the active area of the image capturing element 130, so as to prevent the edge of the optical filter 150 from leaking light and affecting imaging. In some embodiments, the optical filter 150 is fixed on the outside of the active area of the support 170, the circuit board 110 or the image capturing element 130 and is close to the upper surface of the image capturing element 130. The aforementioned "close" refers to an appropriate distance between the optical filter 150 and the image capturing element 130. The appropriate distance may be, but not limited to, that the optical filter 150 does not contact the image capturing element 130, and the optical filter 150 contacts the image. The capture element 130 (that is, the distance is 0 mm) but does not generate pressure on it, or the thickness of the adhesive layer 220 between the optical filter 150 and the image capture element 130. In some embodiments, the distance between the optical filter 150 and the image capturing element 130 is 0.005 to 0.8 mm.

In some embodiments, the adhesive layer 220 is made of a polymer material with double-sided adhesive, such as foam, rubber, etc., to provide support and fixation for adjacent components of the adhesive layer 220, or it can be used with a light blocking effect. The adhesive to reduce the light entering the active area of the image capturing element 130 from the adhesive layer 220. In another embodiment, the adhesive layer 220 is a universal adhesive material, such as an adhesive (such as glue), rubber, silicone, plastic, etc., or a combination of the foregoing. In another embodiment, the adhesive layer 220 is made of thermosetting plastic or thermoplastic plastic.

For example, the optical filter 150 is located above the image capturing element 130 and fixed to the support 170, the optical filter 150 is fixed on the image capturing element 130 with the adhesive layer 220, and the optical filter 150 corresponds to the image capturing element 130 The active area is arranged in the image capturing element 130, where the adhesive layer 220 is located outside the active area of the image capturing element 130, or when the image capturing element 130 is located in the hollow or recessed portion of the circuit board 110, the optical filter 150 is located above the image capturing element 130 and Fixed on the circuit board 110.

The supporting member 170 is located on the circuit board 110 and disposed outside the image capturing element 130. In some embodiments, the number of support members 170 can be adjusted according to actual applications, that is, the number of support members 170 can be one or more.

In some embodiments, the upper surface of the supporting portion 173 of the support 170 and the upper surface of the fixing portion 171 are coplanar or not coplanar. For example, when the upper surface of the supporting portion 173 and the upper surface of the fixing portion 171 are coplanar, the voice coil motor 180 is arranged on the coplanar surface and is attached to the side of the optical filter 150, or is connected to the upper surface of the optical filter 150. Set the sides at a certain distance. Alternatively, when the upper surface of the bearing portion 173 and the upper surface of the fixing portion 171 are not coplanar, the upper surface of the bearing portion 173 is not lower than the upper surface of the fixing portion 171.

In some embodiments, the circuit board 110 includes a plurality of electronic components 300, one of the electronic components 300 is located between the carrying portion 173 of the support 170 and the circuit board 110, and the lower surface of the carrying portion 173 and the circuit board 110 The space is provided to accommodate the electronic components 300 of the circuit board 110, and the overall height and volume of the image capturing component 100 are reduced.

In some embodiments, the support member 170 is a ring-shaped element, the ring-shaped element has a hollow part, and the hollow part surrounds the image capturing element 130. In other embodiments, the image capturing element 130 has two opposite first sides and two opposite second sides, and the image capturing assembly 100 includes two supporting members 170, wherein each supporting member 170 is one The elongated elements are respectively located on the two first sides. In addition, in the above-mentioned embodiments, the term “opposite” is used to describe the positional relationship between the two parallel side edges of the component separated by a certain distance.

A voice coil motor 180 (Voice Coil Motor) is located above the optical filter 150. The voice coil motor 180 includes a moving part 181, a fixing part 183, and a support base 185. The moving part 181 can move axially relative to the fixed part 183, and when the voice coil motor 180 is activated, the relative position of the moving part 181 and the fixed part 183 can be controlled.

In some embodiments, the bearing portion 173 of the supporting member 170 is used to support the voice coil motor 180. Therefore, when the voice coil motor 180 is actuated, the moving member 181 can move in the axial direction relative to the optical filter 150. In some embodiments, the voice coil motor 180 is supported by one or more supports 170. In other embodiments, the voice coil motor 180 is provided on the circuit board 110 with a support base 185.

The lens 190 (lens) is located above the optical filter 150, and is used to adjust the light entering the lens 190 from the outside of the mobile device (that is, the optical image signal), and guide the optical image signal toward the optical filter 150 and the image capturing element 130. March. The lens 190 is fixed to the above-mentioned moving part 181. In some embodiments, the lens 190 has an outer thread, and the movable member 181 is hollow and has an inner thread. The lens 190 is fixed to the movable member by the threading of the outer thread and the inner thread of the movable member 181. Piece 181. Therefore, when the voice coil motor 180 is activated, the lens 190 can move in the axial direction, thereby changing the distance between the lens 190 and the image capturing element 130, and enabling the image capturing assembly 100 to have a focusing function.

In some embodiments, the combination of the optical filter 150 and the lens 190 may be plain glass and a lens with optical coating. The plain glass does not have a coating for filtering light, but is only ordinary glass, and the lens has Coating that filters infrared and ultraviolet rays.

There is a distance between the vertex below the lens 190 and the upper surface of the image capturing element 130 as BFL. BFL refers to the back focal length, which is measured when the lens 190 is focused at infinity. When the BFL is shortened, the overall height of the image capturing device 100 can be reduced. According to the usage requirements of different mobile devices, the image capturing components 100 of the mobile devices have different BFLs. For example, taking a mobile phone lens as an example, the BFL distance can be 0.6 to 1 mm.

Please refer to Figure 1A to Figure 4. In some embodiments, the image capturing assembly 100 includes a circuit board 110, an image capturing element 130, an optical filter 150 and a support 170. Wherein, the supporting member 170 includes a fixing portion 171; the image capturing element 130 is located between the circuit board 110 and the optical filter 150. In addition, the image capturing element 130 is located on the circuit board 110 and is electrically connected to the circuit board 110. The supporting member 170 is located on the outer side of the image capturing element 130. The fixing portion 171 has opposite upper and lower surfaces, and the lower surface is fixed to the circuit board 110. In addition, the optical filter 150 is fixed to the upper surface of the fixing portion 171.

1A and 1B are schematic top views of an image capturing assembly with a ring-shaped support. The supporting member 170 is a ring-shaped element having a hollow part, and the image capturing element 130 is located in the hollow part, and is electrically connected to the circuit board 110 by a wire 200. In one embodiment, when the lower surface of the optical filter 150 is larger than the upper surface of the image capturing element 130, the optical filter 150 is fixed on the annular support 170 with the adhesive layer 220, as shown in FIG. 1A. In another embodiment, when the lower surface of the optical filter 150 is smaller than the upper surface of the image capturing element 130, the two opposite short sides of the optical filter 150 are fixed on the annular support 170 by the adhesive layer 220, and The two opposite long sides are also fixed on the outer side of the active area of the image capturing element 130 by the adhesive layer 220.

In another embodiment, the adhesive layer 220 may be coated on the outside of the active area of the image capturing element 130, so that the active area of the image capturing element 130 is located by the supporting member 170, the image capturing element 130, the optical filter 150 and In the enclosed area surrounded by the subsequent layer 220, particles in the air can be prevented from entering between the optical filter 150 and the image capturing element 130.

1C and 1D are schematic top views of an image capturing assembly with two long strip-shaped supports. The image capturing assembly 100 includes two supporting members 170 and an image capturing element 130, wherein the image capturing element 130 has two opposite first sides and two opposite second sides, and the supporting member 170 is a long strip The components are respectively located on the two first sides. In one embodiment, when the lower surface of the optical filter 150 is larger than the upper surface of the image capturing element 130, the two opposite long sides of the optical filter 150 are fixed on the two long supports 170 with the adhesive layer 220, and The two opposite short sides are fixed on the outside of the active area of the image capturing element 130 by the adhesive layer 220, as shown in FIG. 1C. In another embodiment, when the lower surface of the optical filter 150 is smaller than the upper surface of the image capturing element 130, the two opposite short sides of the optical filter 150 are fixed on the two long support members 170 with the adhesive layer 220, and The adhesive layer 220 is fixed on the outside of the active area of the image capturing element 130 with two opposite long sides, as shown in FIG. 1D.

Please refer to FIGS. 2 to 4, combined with the cross-sections AA, BB, CC, and DD of FIGS. 1A to 1D. The cross-sections of the image capturing device 100 of the above-mentioned cross-sections AA, BB, CC, and DD can be first to third A schematic cross-sectional view of any embodiment. The above-mentioned image capturing assembly 100 includes a circuit board 110, an image capturing element 130, a supporting member 170, and an optical filter 150, wherein the supporting member 170 may be ring-shaped (that is, FIGS. 1A and 1B) or elongated (that is, FIGS. 1C and 1C). 1D), and located outside the image capturing element 130. The image capturing element 130 and the supporting member 170 are both located on the circuit board 110. Therefore, when the optical filter 150 is fixed to the fixing portion 171 of the supporting member 170, the fixing portion is not included between the optical filter 150 and the image capturing element 130 171 thickness. Thereby, the distance between the optical filter 150 and the image capturing element 130 is shortened, and the overall thickness of the image capturing element 100 is reduced.

Please refer to FIG. 2. FIG. 2 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C, or D-D according to the first embodiment of the present invention. In the first embodiment, the image capturing component 100 includes a circuit board 110, an image capturing element 130, an optical filter 150, and a supporting member 170 having a fixing portion 171, wherein the image capturing element 130 is located on the circuit board 110 and the optical The filters 150 are located between and on the circuit board 110, and are electrically connected to the circuit board 110; the support member 170 is located on the outer side of the image capturing element 130 and is disposed on the circuit board 110. The fixing portion 171 has an upper surface and a lower surface opposite to each other. The lower surface of the fixing portion 171 is fixed to the circuit board 110 by the adhesive layer 220, and the optical filter 150 is fixed on the upper surface of the fixing portion 171 by the adhesive layer 220. In addition, the length of the supporting member 170 may extend beyond the side of the optical filter 150 (as shown in FIG. 2) or be aligned with the side of the optical filter 150. In addition, the voice coil motor 180 is provided on the circuit board 110 with a support base 185.

Please refer to FIG. 3, which is a schematic cross-sectional view of the image capturing component of the cross-section line A-A, B-B, C-C or D-D according to the second embodiment of the present invention. In the second embodiment, the image capturing component 100 includes a circuit board 110, an image capturing element 130, an optical filter 150, and a supporting member 170 having a fixing portion 171 and a carrying portion 173, wherein the image capturing element 130 is located in the circuit The board 110 and the optical filter 150 are located between and on the circuit board 110, and are electrically connected to the circuit board 110; the support member 170 is located on the outer side of the image capturing element 130 and is arranged on the circuit board 110. The fixing portion 171 has an upper surface and a lower surface opposite to each other. The lower surface of the fixing portion 171 is fixed to the circuit board 110 by the adhesive layer 220, and the optical filter 150 is fixed on the upper surface of the fixing portion 171 by the adhesive layer 220. The carrying portion 173 has an upper surface and a lower surface. A space can be provided between the lower surface of the carrying portion 173 and the circuit board 110 to accommodate the electronic components 300 of the circuit board 110 to reduce the overall height and volume of the image capturing device 100. The upper surface of the supporting portion 173 and the upper surface of the fixing portion 171 are not coplanar, as shown in FIG. 3. In another implementation aspect of the second embodiment, the upper surface of the supporting portion 173 and the upper surface of the fixing portion 171 are coplanar, that is, the area where the supporting member 170 extends beyond the side of the optical filter 150 is the supporting portion 173, which It is used to carry the voice coil motor 180; and the area of the supporting member 170 located under the optical filter 150 is the fixing portion 171, which is used to set the optical filter 150.

Please refer to FIG. 4, which is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C, or D-D according to the third embodiment of the present invention. In the third embodiment, the image capturing component 100 includes a circuit board 110, an image capturing element 130, an optical filter 150, and a supporting member 170, wherein the image capturing element 130 is located between the circuit board 110 and the optical filter 150 And located on the circuit board 110 and electrically connected to the circuit board 110; the supporting member 170 is located on the outer side of the image capturing element 130 and is arranged on the circuit board 110; the supporting member 170 has a fixing portion 171, a carrying portion 173 and a foot portion 175, And it is located outside the image capturing element 130. The fixing portion 171 has an upper surface and a lower surface opposite to each other. The lower surface of the fixing portion 171 is fixed to the circuit board 110 by the adhesive layer 220, and the optical filter 150 is fixed on the upper surface of the fixing portion 171 by the adhesive layer 220. The carrying portion 173 has an upper surface and a lower surface. A space can be provided between the lower surface of the carrying portion 173 and the circuit board 110 to accommodate the electronic components 300 of the circuit board 110, so as to reduce the overall height and volume of the image capturing device 100. The foot portion 175 is located under the carrying portion 173 and is fixed on the circuit board 110 by the adhesive layer 220 to increase the stability of the supporting member 170 and the overall mechanical strength.

Please refer to FIGS. 5A and 5B. FIG. 5A is a schematic top view of an image capturing assembly 100 having a ring-shaped support 170 according to an embodiment, and FIG. 5B is an image capturing assembly having two elongated supports 170 according to an embodiment A schematic top view of the piece 100. In one embodiment, the support 170 is a ring-shaped element with a hollow portion, as shown in FIG. 5A, and surrounds the image capturing element 130, and the electrical connection between the image capturing element 130 and the circuit board 110 is located on the support Between the component 170 and the image capturing component 130. In another embodiment, the above-mentioned image capturing element 130 has two opposite first sides and two opposite second sides, and the support member 170 has a long element and is located on the two first sides, respectively, as shown in FIG. Shown in 5B.

Please refer to FIGS. 6, 6A, 7 to 10, and in conjunction with the section lines AA, BB, CC, DD, EE, or FF of FIGS. A schematic cross-sectional view of any one of the ninth embodiments. The above-mentioned image capturing assembly 100 includes a metal plate 500, a circuit board 110, an image capturing element 130, a supporting member 170, and an optical filter 150, wherein the supporting member 170 can be ring-shaped (ie, FIG. 5A) or elongated (ie, FIG. 5B), and located outside the image capturing element 130. In some embodiments, the circuit board 110 has a hollow portion penetrating through the circuit board 110, and the image capturing element 130 is located in the hollow portion, and the circuit board 110 and the image capturing element 130 are both fixed on the metal plate 500. Therefore, when the image capturing element 130 is located in the hollow portion of the circuit board 110, the thickness of the image capturing element 100 does not include the thickness of the image capturing element 130, thereby reducing the overall thickness of the image capturing element 100.

Please refer to FIG. 6 and FIG. 6A. FIG. 6 is a schematic cross-sectional view of the image capturing component of the fourth embodiment of the present invention on the cross-section line EE or FF, and FIG. 6A is a schematic cross-sectional view of the image capturing component of the fifth embodiment of the present invention . In the fourth embodiment, the image capturing assembly 100 includes a metal plate 500, a circuit board 110 having a hollow portion, an image capturing element 130, a support 170 having a supporting portion 173 and a foot portion 175, and an optical filter 150, wherein The circuit board 110 is located on the metal plate 500, the image capturing element 130 is located in the hollow portion and fixed on the metal plate 500, and the optical filter 150 is fixed on the circuit board 110 with the adhesive layer 220. The lower surface of the optical filter 150 is fixed to the upper surface of the adhesive layer 220, and the lower surface of the adhesive layer 220 is fixed to the upper surface of the circuit board 110. In addition, the foot 175 of the supporting member 170 is located below the supporting portion 173 and fixed to the circuit board 110, which increases the stability of the supporting member 170 and the overall mechanical strength. In some embodiments, the above-mentioned carrying portion 173 has a first end close to the optical filter 150 and a second end far away from the optical filter 150. The feet 175 under the two ends or under the first and second ends are fixed on the circuit board 110, so that a space is provided between the lower surface of the carrying portion 173 and the circuit board 110 to accommodate the electronic components 300 of the circuit board 110 to reduce the image Capture the overall height and volume of the component 100. In the fifth embodiment, the above-mentioned image capturing device 100 further includes an electrical connection surface located outside the hollow portion of the circuit board 110, and the image capturing element 130 is electrically connected to the upper surface of the circuit board 110 by a wire 200. The planar electrical connection surface, the electrical connection surface may be located on a plane that is one step away from the upper surface of the circuit board 110, and the electrical connection surface is adjacent to the side wall of the hollow portion, as shown in FIG. 6A. In addition, in other embodiments, the electrical connection surface is coplanar with the upper surface of the circuit board 110. The upper surface of the circuit board 110 is the other surface of the surface connected to the metal plate 500 opposite to the circuit board 110.

Please refer to FIGS. 7-9. FIGS. 7-9 are schematic cross-sectional diagrams of the image capturing components along the line A-A, B-B, C-C or D-D of the sixth embodiment to the eighth embodiment of the present invention. In the sixth embodiment, the image capturing assembly 100 includes a metal plate 500, a circuit board 110 with a hollow portion, an image capturing element 130, a supporting member 170 having a fixing portion 171, and an optical filter 150, wherein the supporting member 170 is described above The fixing portion 171 of the supporting member 170 is located on the outer side of the image capturing element 130 and disposed on the circuit board 110, and the fixing portion 171 of the supporting member 170 has an upper surface and a lower surface. The optical filter 150 is fixed on the upper surface of the fixing portion 171 by the adhesive layer 220, and the lower surface of the fixing portion 171 of the supporting member 170 is fixed on the circuit board 110. In addition, the length of the support member 170 may extend beyond the side of the optical filter 150 or be aligned with the side of the optical filter 150 (as shown in FIG. 7). In addition, the voice coil motor 180 is provided on the circuit board 110 with a support base 185. In the seventh embodiment, the supporting member 170 of the image capturing assembly 100 further includes a supporting portion 173, and the supporting portion 173 has an upper surface and a lower surface. The upper surface of the supporting portion 173 and the upper surface of the fixing portion 171 are not coplanar, and a space can be provided between the lower surface of the supporting portion 173 and the circuit board 110 to accommodate the electronic components 300 of the circuit board 110 to reduce the image capturing device 100 The overall height and volume are shown in Figure 8. In another implementation aspect of the seventh embodiment, the upper surface of the supporting portion 173 and the upper surface of the fixing portion 171 are coplanar, that is, the area where the supporting member 170 extends beyond the side of the optical filter 150 is the supporting portion 173, which It is used to carry the voice coil motor 180; and the area of the supporting member 170 located under the optical filter 150 is the fixing portion 171, which is used to set the optical filter 150. In the eighth embodiment, the supporting member 170 of the image capturing assembly 100 further includes a supporting portion 173 and a foot portion 175. A space can be provided between the lower surface of the supporting portion 173 and the circuit board 110 to accommodate the electronic components of the circuit board 110. 300 (not shown in the drawings) to reduce the overall height and volume of the image capturing component 100. In addition, the foot 175 is located below the carrying part 173 and is fixed on the circuit board 110 by the adhesive layer 220, which increases the stability and overall mechanical strength of the supporting member 170, as shown in FIG. 9.

Please refer to FIG. 10, which is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C, or D-D according to the ninth embodiment of the present invention. In the ninth embodiment, the image capturing assembly 100 includes a metal plate 500, a circuit board 110 with a hollow portion, an image capturing element 130, a supporting member 170, and an optical filter 150, wherein the supporting member 170 has a fixing portion 171, The supporting portion 173 and the foot portion 175 are located on the outer side of the image capturing element 130 and are arranged on the circuit board 110, and the fixing portion 171 and the supporting portion 173 of the supporting member 170 have an upper surface and a lower surface, respectively. The optical filter 150 is fixed on the upper surface of the fixing portion 171 with the adhesive layer 220, and the lower surface of the fixing portion 171 of the supporting member 170 is not fixed on the circuit board 110. A space can be provided between the lower surface of the carrying portion 173 and the circuit board 110 to accommodate the electronic components 300 (not shown in the drawings) of the circuit board 110, so as to reduce the overall height and volume of the image capturing device 100. In addition, the foot portion 175 is located below the supporting portion 173 and is fixed on the circuit board 110 by the adhesive layer 220, which increases the stability of the supporting member 170 and the overall mechanical strength.

Please refer to Figures 11, 11A, 12 to 15, and combined with Figures 1A to 1D, 5A and 5B as shown by the cross-section lines AA, BB, CC, DD, EE or FF, the cross section of the image capturing device 100 can be from tenth to tenth to A schematic cross-sectional view of any of the fifteenth embodiments. The above-mentioned image capturing assembly 100 includes a circuit board 110 having a concave portion, an image capturing element 130, a supporting member 170, and an optical filter 150, wherein the supporting member 170 may be ring-shaped (ie, FIG. 5A) or elongated (ie, FIG. 5B) ), and located outside the image capturing element 130 and set on the circuit board 110. In some embodiments, the circuit board 110 has a concave portion, and the image capturing element 130 is located between the concave portion and the optical filter 150. Therefore, when the image capturing element 130 is located in the recess of the circuit board 110, the thickness of the image capturing element 100 does not include the thickness of the image capturing element 130, thereby reducing the overall thickness of the image capturing element 100.

Please refer to FIGS. 11 and 11A. FIG. 11 is a schematic cross-sectional view of the image capturing component of the cross-sectional line EE or FF of the tenth embodiment of the present invention, and FIG. 11A is a cross-sectional view of the image capturing component of the eleventh embodiment of the present invention Schematic. In the tenth embodiment, the image capturing assembly 100 includes a circuit board 110 having a concave portion, an image capturing element 130, a supporting member 170 having a supporting portion 173 and a foot portion 175, and an optical filter 150, wherein the concave portion is disposed in The circuit board 110 does not penetrate the circuit board 110, the image capturing element 130 is located between the recess and the optical filter 150, and the optical filter 150 is fixed on the circuit board 110 with the adhesive layer 220. The lower surface of the optical filter 150 is fixed to the upper surface of the adhesive layer 220, and the lower surface of the adhesive layer 220 is fixed to the upper surface of the circuit board 110. In addition, the foot 175 of the support 170 is located under the carrying portion 173 and fixed on the circuit board 110, which increases the stability of the support 170 and the overall mechanical strength. In some embodiments, the above-mentioned carrying portion 173 has a first end close to the optical filter 150 and a second end far away from the optical filter 150. The feet 175 under the two ends or under the first and second ends are fixed on the circuit board 110, so that a space is provided between the lower surface of the carrying portion 173 and the circuit board 110 to accommodate the electronic components 300 of the circuit board 110 to reduce the image Capture the overall height and volume of the component 100. In the eleventh embodiment, the above-mentioned image capturing device 100 further includes an electrical connection surface located outside the recess of the circuit board 110, and the image capturing element 130 is electrically connected to the upper surface of the circuit board 110 by a wire 200. The planar electrical connection surface, the electrical connection surface may be located on a plane that is one step away from the upper surface of the circuit board 110, and the electrical connection surface is adjacent to the side wall of the recess. In addition, in other embodiments, the electrical connection surface is coplanar with the upper surface of the circuit board 110. The upper surface of the circuit board 110 is the other surface opposite to the surface of the circuit board 110 that does not have a recess.

Please refer to FIGS. 12 to 14. FIGS. 12 to 14 are schematic cross-sectional views of the image capturing component of the section line A-A, B-B, C-C or D-D of the twelfth embodiment to the fourteenth embodiment of the present invention. In the twelfth embodiment, the image capturing component 100 includes a circuit board 110 having a concave portion, an image capturing element 130, a supporting member 170 having a fixing portion 171, and an optical filter 150, wherein the image capturing element 130 is located between the concave portion and the optical filter 150. Between the optical filters 150 and fixed on the circuit board 110; the supporting member 170 is located on the outer side of the image capturing element 130 and is arranged on the circuit board 110, and the fixing portion 171 of the supporting member 170 has an upper surface and a lower surface . The optical filter 150 is fixed on the upper surface of the fixing portion 171 by the adhesive layer 220, and the lower surface of the fixing portion 171 of the supporting member 170 is fixed on the circuit board 110. In addition, the length of the support member 170 may extend beyond the side of the optical filter 150 or be aligned with the side of the optical filter 150 (as shown in FIG. 12). In addition, the voice coil motor 180 is provided on the circuit board 110 with a support base 185. In the thirteenth embodiment, the supporting member 170 of the image capturing assembly 100 further includes a bearing portion 173, and the bearing portion 173 has an upper surface and a lower surface. The upper surface of the carrying portion 173 and the upper surface of the fixing portion 171 are not coplanar, as shown in FIG. 13. In addition, a space can be provided between the lower surface of the carrying portion 173 and the circuit board 110 to accommodate the electronic components 300 (not shown in the drawings) of the circuit board 110, so as to reduce the overall height and volume of the image capturing device 100. In another implementation aspect of the thirteenth embodiment, the upper surface of the supporting portion 173 and the upper surface of the fixing portion 171 are coplanar, that is, the area where the supporting member 170 extends beyond the side of the optical filter 150 is the supporting portion 173. It is used to carry the voice coil motor 180; and the area of the support 170 located under the optical filter 150 is the fixing portion 171, which is used to set the optical filter 150. In the fourteenth embodiment, the supporting member 170 of the image capturing assembly 100 further includes a supporting portion 173 and a foot portion 175, and the foot portion 175 is located below the supporting portion 173 and is fixed on the circuit board 110 by an adhesive layer 220 , To increase the stability and overall mechanical strength of the support 170, as shown in FIG. 14.

Please refer to FIG. 15. FIG. 15 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C, or D-D according to the fifteenth embodiment of the present invention. In the fifteenth embodiment, the image capturing component 100 includes a circuit board 110 having a concave portion, an image capturing element 130, a supporting member 170, and an optical filter 150, wherein the image capturing element 130 is located between the concave portion and the optical filter 150 The supporting member 170 has a fixing portion 171, a carrying portion 173, and a foot portion 175, and is located on the outer side of the image capturing element 130 and is arranged on the circuit board 110, and the supporting member 170 is fixed The portion 171 and the carrying portion 173 have an upper surface and a lower surface, respectively. A space can be provided between the lower surface of the carrying portion 173 and the circuit board 110 to accommodate the electronic components 300 (not shown in the drawings) of the circuit board 110, so as to reduce the overall height and volume of the image capturing device 100. The optical filter 150 is fixed on the upper surface of the fixing portion 171 with the adhesive layer 220, and the lower surface of the fixing portion 171 of the supporting member 170 is not fixed on the circuit board 110. In addition, the foot portion 175 is located below the supporting portion 173 and is fixed on the circuit board 110 by the adhesive layer 220, which increases the stability of the supporting member 170 and the overall mechanical strength.

16A to 16E are schematic top views of the image capturing device of the present invention. Please refer to FIGS. 16A to 16E in conjunction with FIGS. 17, 18 to 21, where FIGS. 17, 18 to 21 are cross-sections of the image capturing components corresponding to the cut lines GG, HH, II, JJ, and KK of FIGS. 16A to 16E Schematic. The above-mentioned image capturing device 100 includes a circuit board 110, an image capturing element 130 having an active area, a first bonding layer 220 and an optical filter 150, wherein the image capturing element 130 is located on the circuit board 110; the first bonding layer 220 Located outside the active area of the image capturing element 130; the optical filter 150 has an upper surface and a lower surface, and is located above the image capturing element 130, and its lower surface is fixed on the first bonding layer 220. In some embodiments, the outer side of the active area of the image capturing element 130 includes the non-active area on the image capturing element 130 relative to the active area, the outer sidewall of the image capturing element 130, and the outer side of the image capturing element 130. On the circuit board 110, and any of the foregoing combinations. Wherein, the above-mentioned non-active area is the upper surface of the image capturing element 130 other than the active area. For example, the first bonding layer 220 is disposed in the non-active area of the image capturing element 130 (see FIGS. 17, 17A and 19); the first bonding layer 220 is disposed on the circuit board 110 outside the image capturing element 130 , That is, the first adhesive layer 220 is located on the circuit board 110 and covers or contacts at least one outer side wall of the image capturing element 130 (see FIG. 20); or, the first adhesive layer 220 is disposed on the outer side of the image capturing element 130 On the circuit board 110 and its non-active area, that is, the first bonding layer 220 is located on the non-active area on the image capturing element 130 and on the circuit board 110, and covers or contacts at least one outer side wall of the image capturing element 130 ( Please refer to Figures 18 and 21). Therefore, when the optical filter 150 is disposed above the image capturing element 130 through the first adhesive layer 220, the optical filter 150 and the image capturing element 130 can be separated by the thickness of the first adhesive layer 220, or the optical filter The chip 150 is close to the image capturing element 130. Thereby, the distance between the optical filter 150 and the image capturing element 130 is shortened, and the overall thickness of the image capturing element 100 is reduced.

Please refer to FIGS. 17 and 17A. FIG. 17 is a schematic cross-sectional view of the image capturing component along the line G-G according to the sixteenth embodiment of the present invention, and FIG. 17A is a schematic cross-sectional view of the image capturing component according to the seventeenth embodiment of the present invention. In the sixteenth embodiment, the image capturing device 100 includes a circuit board 110, an image capturing element 130 having an active area, a first bonding layer 220, and an optical filter 150, wherein the lower surface of the optical filter 150 is opposite to The two sides are less than or equal to the two opposite sides of the upper surface of the corresponding image capturing element 130. The image capturing element 130 is located on the circuit board 110, and the first bonding layer 220 is located on the upper surface of the image capturing element 130, and this upper surface is the non-active area of the image capturing element 130. In other words, the lower surface of the first bonding layer 220 contacts the inactive area of the upper surface of the image capturing element 130. The optical filter 150 has an upper surface and a lower surface, and is located above the image capturing element 130, and its lower surface is fixed on the first bonding layer 220, that is, the optical filter 150 is fixed to the image capturing by the first bonding layer 220 Above element 130. In particular, the optical filter 150 needs to be arranged corresponding to the active area of the image capturing element 130 to maintain good optical and imaging quality. In the seventeenth embodiment, the image capturing device 100 further includes a wire 200, and the image capturing element 130 is electrically connected to the circuit board 110 by the wire 200.

Please refer to FIG. 18. FIG. 18 is a schematic cross-sectional view of the image capturing component of the section line H-H of the eighteenth embodiment of the present invention. In the eighteenth embodiment, the image capturing device 100 includes a circuit board 110, an image capturing element 130 having an active area, a first bonding layer 220, and an optical filter 150. The lower surface of the optical filter 150 is opposite to The two sides are less than or equal to the two opposite sides of the upper surface of the corresponding image capturing element 130; the image capturing element 130 is located on the circuit board 110. The first bonding layer 220 is disposed on the outer side of the image capturing element 130 and the outer side of the active area. That is, the first bonding layer 220 is located on the non-active area of the image capturing element 130 and the circuit board 110. The lower surface contacts the non-active area on the upper surface of the image capturing element 130 and the circuit board 110, and covers or contacts at least one outer side wall of the image capturing element 130. In addition, the optical filter 150 is fixed above the image capturing element 130 with the first adhesive layer 220. In particular, the optical filter 150 needs to be arranged corresponding to the active area of the image capturing element 130 to maintain good optical and imaging quality.

Please refer to FIGS. 19-21. FIGS. 19-21 are schematic cross-sectional diagrams of the image capturing components along the lines I-I, J-J, and K-K according to the nineteenth to twenty-first embodiments of the present invention. The image capturing component 100 includes a circuit board 110, an image capturing element 130 having an active area, a first bonding layer 220, and an optical filter 150. The lower surface of the optical filter 150 has two opposite sides larger than its corresponding image capturing Take two opposite sides of the upper surface of the element 130, that is, the size of the optical filter 150 is larger than that of the image capturing element 130, and is arranged corresponding to the active area of the image capturing element 130. In this way, light leakage from the edge of the optical filter 150 can be avoided to cause noise to enter the active area of the image capturing element 130, affecting the processing of the optical image signal, and causing unsatisfactory imaging quality; the image capturing element 130 is located on the circuit board 110; the optical filter 150 with the first bonding layer 220 is disposed above the image capturing element 130. In the nineteenth embodiment, the above-mentioned first bonding layer 220 is located on the upper surface of the image capturing element 130, and this upper surface is the inactive area of the image capturing element 130. In other words, the lower surface of the first bonding layer 220 contacts the inactive area of the upper surface of the image capturing element 130. In the twentieth embodiment, the above-mentioned first bonding layer 220 is disposed on the circuit board 110 outside the image capturing element 130, that is, the lower surface of the first bonding layer 220 contacts the circuit board 110, and the first bonding layer 220 covers Cover or contact at least one outer side wall of the image capturing element 130. In this way, the optical filter 150 is fixed on the first bonding layer 220 so as to be located above the image capturing element 130. In the twenty-first embodiment, the above-mentioned first bonding layer 220 is disposed on the non-active area of the image capturing element 130 and the circuit board 110, that is, the lower surface of the first bonding layer 220 contacts the upper surface of the image capturing element 130 The non-active area and the circuit board 110, and the first bonding layer 220 covers or contacts at least one outer sidewall of the image capturing element 130. In addition, the optical filter 150 is fixed above the image capturing element 130 with the first adhesive layer 220.

Please refer to FIG. 22 in combination with FIG. 23. FIG. 22 is a schematic top view of an image capturing device according to an embodiment of the present invention, and FIG. 23 is a schematic cross-sectional view of the image capturing device along the line LL of the twenty-second embodiment of the present invention . In the twenty-second embodiment, the image capturing device 100 includes a circuit board 110, an image capturing element 130 having an active area, a first bonding layer 220, a second bonding layer 220A, an optical filter 150 and a supporting member 170 , Wherein the image capturing element 130 and the supporting member 170 are located on the circuit board 110. The support 170 has an opening and surrounds the outer side of the active area of the image capturing element 130. The support 170 has a fixing portion 171, and the fixing portion 171 has a lower surface. The first bonding layer 220 is located on the circuit board 110 outside the image capturing element 130, and the lower surface of the first bonding layer 220 contacts the circuit board 110. The lower surface of the optical filter 150 is fixed on the first adhesive layer 220, and the upper surface of the optical filter 150 is fixed on the lower surface of the fixing portion 171 by the second adhesive layer 220A. In some embodiments, the supporting member 170 further includes a supporting portion 173 and a foot portion 175, and is located outside the image capturing element 130. The supporting portion 173 has an upper surface and a lower surface, and the foot portion 175 is located below the supporting portion 173 and is fixed on the circuit board 110 by the adhesive layer 220 to increase the stability of the support 170 and the overall mechanical strength. In another implementation aspect of the twenty-second embodiment, the first adhesive layer 220 may further cover or contact at least one outer sidewall of the image capturing element 130.

In addition, the above-mentioned opening may be, but not limited to, a circular shape or a square shape. For example, the supporting member 170 with an opening is placed upside down to facilitate fixing the optical filter 150, and the optical filter 150 is fixed by the second adhesive layer 220A, and then the supporting member 170 and the optical filter 150 are corresponding to the image capturing element The optical filter 150 is disposed above the image capturing element 130 at the position of 130 and the first bonding layer 220. In this way, the fixability or mechanical reliability of the optical filter 150 is improved.

In addition, in some embodiments, the image capturing assembly 100 further includes a voice coil motor 180 and a lens 190, wherein the voice coil motor 180 is fixed on the upper surface of the supporting portion 173 of the support 170 (as shown in FIGS. 4, 10, 15 and 23). As shown, but not limited to the above-mentioned drawings, the above-mentioned drawings are only examples) or fixed on the circuit board 110 (as shown in FIG. 21, but not limited to the above-mentioned drawings, the above-mentioned drawings are only examples). For example, in use, the upper surface of the fixing portion and the upper surface of the carrying portion 173 can be designed to be coplanar or non-coplanar according to the applicable device. In other embodiments, the electronic component 300 is located between the circuit board 110 and the carrying portion 173 to reduce the overall height and volume of the image capturing device 100, as shown in FIG. 3.

In some embodiments, the image capturing element 130 is electrically connected to the circuit board 110 by a wire 200 (as shown in FIGS. 6A, 11A, and 17A, but not limited to the above-mentioned figures, which are only examples). In some embodiments, the first adhesive layer 220 or the adhesive layer 220 may cover one end of the above-mentioned wire 200 (as shown in FIG. 17A, but not limited to the above-mentioned drawings, which are only examples) or all of the above-mentioned wires 200 ( Not shown in the drawings) to provide structural strength and stabilize the solder joints of the electrical connection between the wire 200 and the circuit board 110 to increase the reliability of the structure.

In summary, according to the image capturing assembly 100 provided by the embodiment of the present invention, the placement position or fixing method of the image capturing element 130, the optical filter 150, and the support 170 can be changed so that the optical filter 150 The distance between the image capturing element 130 and the image capturing element 130 is shortened, so that the overall thickness of the image capturing element 100 is reduced. In this way, the purpose of thinner and lighter mobile devices is achieved.

In addition, the shapes, sizes, proportions, and relative distances between the elements in the drawings are only for illustration, and their positions or sequences can be adjusted up and down or exist at the same time, for those with ordinary knowledge in the technical field to understand the present invention. Instead of limiting the scope of implementation of the present invention.

The technical content of the present invention has been disclosed in the preferred embodiment as described above, but it is not intended to limit the present invention. Anyone who is familiar with this technique and makes some changes and modifications without departing from the spirit of the present invention should be covered in this Within the scope of the invention, therefore, the scope of protection of the present invention shall be subject to the scope of the attached patent application.

100: Image capture component 110: circuit board 130: Image capture component 150: optical filter 170: Support 171: Fixed part 173: Bearing Department 175: Foot 180: voice coil motor 181: Moving Parts 183: fixed parts 185: support seat 190: lens 200: wire 220: Adhesive layer/First Adhesive layer 220A: second layer 300: electronic components 500: metal plate BFL: back focus length A-A to L-L: cut line

FIG. 1A is a schematic top view of an image capturing assembly with a ring-shaped support according to an embodiment of the present invention; FIG. FIG. 1B is a schematic top view of an image capturing component with a ring-shaped support according to another embodiment of the present invention; FIG. FIG. 1C is a schematic top view of an image capturing assembly with two elongated support members according to an embodiment of the present invention; FIG. FIG. 1D is a schematic top view of an image capturing assembly having two elongated supports according to another embodiment of the present invention; FIG. 2 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D according to the first embodiment of the present invention; 3 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D according to the second embodiment of the present invention; 4 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D according to the third embodiment of the present invention; FIG. 5A is a schematic top view of an image capturing assembly with a ring-shaped support according to an embodiment of the present invention; FIG. FIG. 5B is a schematic top view of an image capturing assembly with two elongated supports according to an embodiment of the present invention; FIG. 6 is a schematic cross-sectional view of the image capturing component of the section line E-E or F-F according to the fourth embodiment of the present invention; 6A is a schematic cross-sectional view of the image capturing component of the fifth embodiment of the present invention; FIG. 7 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D according to the sixth embodiment of the present invention; 8 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D of the seventh embodiment of the present invention; 9 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D of the eighth embodiment of the present invention; 10 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D of the ninth embodiment of the present invention; 11 is a schematic cross-sectional view of the image capturing component of the section line E-E or F-F according to the tenth embodiment of the present invention; FIG. 11A is a schematic cross-sectional view of the image capturing component of the eleventh embodiment of the present invention; FIG. 12 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D of the twelfth embodiment of the present invention; 13 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D of the thirteenth embodiment of the present invention; 14 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D of the fourteenth embodiment of the present invention; 15 is a schematic cross-sectional view of the image capturing component of the section line A-A, B-B, C-C or D-D of the fifteenth embodiment of the present invention; FIG. 16A is a schematic top view of the image capturing component of the sixteenth embodiment of the present invention; 16B is a schematic top view of the image capturing component of the eighteenth embodiment of the present invention; 16C is a schematic top view of the image capturing component of the nineteenth embodiment of the present invention; 16D is a schematic top view of the image capturing component of the twentieth embodiment of the present invention; 16E is a schematic top view of the image capturing component of the twenty-first embodiment of the present invention; FIG. 17 is a schematic cross-sectional view of the image capturing component of the section line G-G according to the sixteenth embodiment of the present invention; FIG. 17A is a schematic cross-sectional view of an image capturing device according to a seventeenth embodiment of the present invention; 18 is a schematic cross-sectional view of the image capturing component of the section line H-H of the eighteenth embodiment of the present invention; 19 is a schematic cross-sectional view of the image capturing component of the line I-I of the nineteenth embodiment of the present invention; 20 is a schematic cross-sectional view of the image capturing component along the line J-J of the twentieth embodiment of the present invention; 21 is a schematic cross-sectional view of the image capturing component of the section line K-K according to the twenty-first embodiment of the present invention; FIG. 22 is a schematic top view of an image capturing device according to an embodiment of the present invention; and FIG. 23 is a schematic cross-sectional view of the image capturing component along the line L-L of the twenty-second embodiment of the present invention.

100: Image capture component

110: circuit board

130: Image capture component

150: optical filter

170: Support

171: Fixed part

173: Bearing Department

175: Foot

180: voice coil motor

181: Moving Parts

183: fixed parts

185: support seat

190: lens

220: Subsequent layer

BFL: back focus length

Claims (15)

An image capturing component includes: a circuit board; an optical filter; an image capturing element, the image capturing element is located between the circuit board and the optical filter, is located on the circuit board, and is electrically connected The circuit board; and a support, the support is located on the outer side of the image capturing element, the support includes a fixing portion, the fixing portion has an upper surface and a lower surface opposed to each other, the lower surface is fixed to the circuit board ; Wherein, the optical filter is fixed on the upper surface of the fixing portion; Wherein, the distance between the optical filter and the image capturing element is 0.005 to 0.8 mm. The image capturing assembly according to claim 1, wherein the support further includes a bearing portion, the bearing portion has an upper surface and a lower surface, wherein the upper surface of the bearing portion and the upper surface of the fixing portion are Coplanar or non-coplanar. The image capturing assembly according to claim 2, wherein the supporting member further includes a foot, and the foot is located below the carrying portion and fixed on the circuit board. The image capturing component according to any one of claims 1 to 3, wherein the support is a ring-shaped element, the ring-shaped element has a hollow part, and the hollow part surrounds the image capturing element. The image capturing component according to any one of claims 1 to 3, wherein the image capturing component has two opposite first sides and two opposite second sides, and the image capturing component includes two of the Each of the supports is a long element and is located on the two first sides respectively. The image capturing assembly according to any one of claim 2 or 3, further comprising: a voice coil motor fixed to the upper surface of the supporting portion, wherein the upper surface of the fixing portion and the supporting portion The upper surface is coplanar or non-coplanar; and a lens fixed to the voice coil motor. An image capturing component includes: a circuit board; an image capturing element having an active area on the circuit board; a first bonding layer located in the active area of the image capturing element And contacting the image capturing element or the circuit board, wherein the first adhesive layer is a colloid; and an optical filter having an upper surface and a lower surface, located above the image capturing element, and the lower surface is fixed to On the first adhesive layer; wherein, the distance between the optical filter and the image capturing element is 0.005 to 0.8 mm. The image capture device according to claim 7, wherein the first adhesive layer is located in a non-active area of the image capture element relative to the active area, the circuit board, or the non-active area on the image capture element Area and the circuit board. The image capturing assembly according to claim 7, further comprising: a supporting member having an opening, the supporting member being located outside the active area of the image capturing element and being fixed on the circuit board, wherein the supporting member It includes a fixing part with a lower surface. The image capturing component according to claim 7, further comprising a second adhesive layer, the second adhesive layer being located between the lower surface of the fixing portion and the upper surface of the optical filter. The image capturing assembly according to claim 9, wherein the support further includes a bearing portion, the bearing portion has an upper surface and a lower surface, wherein the upper surface of the bearing portion and the upper surface of the fixing portion are Coplanar or non-coplanar. The image capturing assembly according to claim 11, wherein the supporting member further includes a foot, and the foot is located below the carrying portion and fixed on the circuit board. The image capturing component according to any one of claims 7, 9, 11, and 12, further comprising: a voice coil motor fixed on the upper surface of the carrying portion or the circuit board; and a lens, the The lens is fixed to the voice coil motor. The image capturing component according to claim 7, further comprising: a wire, wherein the image capturing element is electrically connected to the circuit board by the wire; wherein the first adhesive layer covers one end of the wire or the All of the wires. The image capturing component according to claim 7, wherein the first adhesive layer covers at least one outer side wall of the image capturing element.

Images