JP6661506B2 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JP6661506B2 JP6661506B2 JP2016185672A JP2016185672A JP6661506B2 JP 6661506 B2 JP6661506 B2 JP 6661506B2 JP 2016185672 A JP2016185672 A JP 2016185672A JP 2016185672 A JP2016185672 A JP 2016185672A JP 6661506 B2 JP6661506 B2 JP 6661506B2
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- 230000006870 function Effects 0.000 description 3
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
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Description
105,106 フォトダイオード
150 画素回路(第1の画素回路)
202 周辺回路
250 画素回路(第2の画素回路)
2561,2562,2571,2572 キャパシタ(保持部)
Claims (4)
- 大きさの異なるフォトダイオードを有する第1の画素回路と、
前記第1の画素回路に接続されている第2の画素回路と、
前記第2の画素回路を駆動制御する周辺回路と、
を備え、
前記第2の画素回路は、
前記大きさの異なるフォトダイオードにより第1の露光時間に得られた第1の光信号と、前記第1の露光時間よりも短い第2の露光時間に得られた第2の光信号とを保持する保持部を有し、
前記周辺回路は、
前記第1の光信号の電圧値が所定値以上であるか否かを判定し、前記第1の光信号の電圧値が所定値以上であると判定された場合には前記第1の光信号に前記第2の光信号を加算した信号を出力信号とし、所定値以上ではないと判定された場合には前記第1の光信号を出力信号とする
ことを特徴とする固体撮像装置。 - 前記大きさの異なるフォトダイオードは、
第1のフォトダイオードと、
前記第1のフォトダイオードよりも小さい第2のフォトダイオードと、
を有して構成され、
前記第2のフォトダイオードにより得られた第1の光信号の電圧値は、前記第1のフォトダイオードにより得られた第1の光信号の電圧値よりも小さい
ことを特徴とする請求項1に記載の固体撮像装置。 - 前記第1の画素回路が形成されている第1の基板と、
前記第2の画素回路及び前記周辺回路が形成されている第2の基板と、
を備えることを特徴とする請求項2に記載の固体撮像装置。 - 前記第1の基板は、前記第1のフォトダイオードと前記第2のフォトダイオードとを分離する分離領域を有し、前記第1のフォトダイオードの大きさ及び前記第2のフォトダイオードの大きさは、前記分離領域が形成される位置により決定されることを特徴とする請求項3に記載の固体撮像装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016185672A JP6661506B2 (ja) | 2016-09-23 | 2016-09-23 | 固体撮像装置 |
US15/660,592 US11122216B2 (en) | 2016-09-23 | 2017-07-26 | Solid-state imaging device |
US17/393,751 US20210368090A1 (en) | 2016-09-23 | 2021-08-04 | Solid-state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016185672A JP6661506B2 (ja) | 2016-09-23 | 2016-09-23 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018050233A JP2018050233A (ja) | 2018-03-29 |
JP6661506B2 true JP6661506B2 (ja) | 2020-03-11 |
Family
ID=61686888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016185672A Active JP6661506B2 (ja) | 2016-09-23 | 2016-09-23 | 固体撮像装置 |
Country Status (2)
Country | Link |
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US (2) | US11122216B2 (ja) |
JP (1) | JP6661506B2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3459117B1 (en) * | 2016-05-20 | 2021-04-14 | Lumileds LLC | Method of forming a p-type layer for a light emitting device |
WO2018207731A1 (ja) * | 2017-05-10 | 2018-11-15 | ブリルニクスジャパン株式会社 | 固体撮像装置、固体撮像装置の駆動方法、および電子機器 |
JP2019165312A (ja) * | 2018-03-19 | 2019-09-26 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および電子機器 |
US10652479B2 (en) | 2018-09-19 | 2020-05-12 | Samsung Electronics Co., Ltd. | HDR image sensor with LFM and reduced Motion Blur |
WO2020227980A1 (zh) * | 2019-05-15 | 2020-11-19 | 合刃科技(深圳)有限公司 | 图像传感器、光强感知系统及方法 |
US10811453B1 (en) * | 2019-11-01 | 2020-10-20 | Omnivision Technologies, Inc. | Pillar structures for suppressing optical cross-talk |
US11670648B2 (en) * | 2020-12-10 | 2023-06-06 | Omnivision Technologies Inc. | Flicker-mitigating pixel-array substrate |
US11710752B2 (en) | 2020-12-10 | 2023-07-25 | Omnivision Technologies, Inc. | Flicker-mitigating pixel-array substrate |
US20220191416A1 (en) * | 2020-12-14 | 2022-06-16 | Omnivision Technologies, Inc. | Pixel level expandable memory array for voltage domain global shutter |
US11616926B2 (en) * | 2021-04-29 | 2023-03-28 | Samsung Electronics Co., Ltd. | Analog-to-digital converting circuit using output signal feedback and operation method thereof |
US20230074679A1 (en) * | 2021-09-03 | 2023-03-09 | Microsoft Technology Licensing, Llc | Image sensor with actively cooled sensor array |
KR20230073722A (ko) * | 2021-11-19 | 2023-05-26 | 주식회사 라온텍 | 화소 회로 및 이를 포함하는 마이크로 디스플레이 장치 |
US11979675B2 (en) * | 2022-04-25 | 2024-05-07 | Sony Semiconductor Solutions Corporation | Image sensing device with event based vision sensor pixels and imaging pixels |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001304962A (ja) * | 2000-04-26 | 2001-10-31 | Sony Corp | 光検出装置およびこれを用いた距離測定装置 |
JP2007116437A (ja) * | 2005-10-20 | 2007-05-10 | Nikon Corp | 撮像素子および撮像システム |
JP2011015219A (ja) * | 2009-07-02 | 2011-01-20 | Toshiba Corp | 固体撮像装置 |
JP6124217B2 (ja) * | 2011-04-28 | 2017-05-10 | パナソニックIpマネジメント株式会社 | 固体撮像装置及びそれを用いたカメラシステム |
JP5791571B2 (ja) * | 2011-08-02 | 2015-10-07 | キヤノン株式会社 | 撮像素子及び撮像装置 |
JP5963421B2 (ja) * | 2011-11-17 | 2016-08-03 | オリンパス株式会社 | 固体撮像装置および撮像装置 |
TWI583195B (zh) * | 2012-07-06 | 2017-05-11 | 新力股份有限公司 | A solid-state imaging device and a solid-state imaging device, and an electronic device |
JP6220225B2 (ja) | 2013-10-30 | 2017-10-25 | キヤノン株式会社 | 撮像装置、撮像装置の制御方法、プログラム、及び記録媒体 |
JP6334908B2 (ja) * | 2013-12-09 | 2018-05-30 | キヤノン株式会社 | 撮像装置及びその制御方法、及び撮像素子 |
JP6299544B2 (ja) * | 2014-09-24 | 2018-03-28 | 株式会社Jvcケンウッド | 固体撮像装置 |
US9774801B2 (en) * | 2014-12-05 | 2017-09-26 | Qualcomm Incorporated | Solid state image sensor with enhanced charge capacity and dynamic range |
JP6420195B2 (ja) * | 2015-03-27 | 2018-11-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9654712B2 (en) * | 2015-10-07 | 2017-05-16 | Semiconductor Components Industries, Llc | Pixels with a global shutter and high dynamic range |
US9854184B2 (en) * | 2016-03-01 | 2017-12-26 | Semiconductor Components Industries, Llc | Imaging pixels with a fully depleted charge transfer path |
JP6885393B2 (ja) * | 2016-03-30 | 2021-06-16 | ソニーグループ株式会社 | 固体撮像装置、固体撮像装置の製造方法および電子機器 |
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