JP6656261B2 - 蒸発した材料を堆積させるための装置、分配管、真空堆積チャンバ、及び蒸発した材料を堆積させるための方法 - Google Patents

蒸発した材料を堆積させるための装置、分配管、真空堆積チャンバ、及び蒸発した材料を堆積させるための方法 Download PDF

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JP6656261B2
JP6656261B2 JP2017542272A JP2017542272A JP6656261B2 JP 6656261 B2 JP6656261 B2 JP 6656261B2 JP 2017542272 A JP2017542272 A JP 2017542272A JP 2017542272 A JP2017542272 A JP 2017542272A JP 6656261 B2 JP6656261 B2 JP 6656261B2
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distribution pipe
nozzles
nozzle
distribution
substrate
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JP2017535677A (ja
Inventor
シュテファン バンゲルト，
シュテファン バンゲルト，
アンドレアス ロップ，
アンドレアス ロップ，
トーマス ゲーベレ，
トーマス ゲーベレ，
ウーヴェ シュースラー，
ウーヴェ シュースラー，
ホセ マヌエル ディエゲス−カンポ，
ホセ マヌエル ディエゲス−カンポ，
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Applied Materials Inc
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Applied Materials Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45578—Elongated nozzles, tubes with holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
JP2017542272A 2014-11-07 2014-11-07 蒸発した材料を堆積させるための装置、分配管、真空堆積チャンバ、及び蒸発した材料を堆積させるための方法 Active JP6656261B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/074089 WO2016070942A1 (en) 2014-11-07 2014-11-07 Material deposition arrangement and material distribution arrangement for vacuum deposition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017173656A Division JP6543664B2 (ja) 2017-09-11 2017-09-11 真空堆積チャンバ

Publications (2)

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JP2017535677A JP2017535677A (ja) 2017-11-30
JP6656261B2 true JP6656261B2 (ja) 2020-03-04

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JP2017542272A Active JP6656261B2 (ja) 2014-11-07 2014-11-07 蒸発した材料を堆積させるための装置、分配管、真空堆積チャンバ、及び蒸発した材料を堆積させるための方法

Country Status (5)

Country Link
JP (1) JP6656261B2 (ko)
KR (2) KR101990619B1 (ko)
CN (2) CN107002221B (ko)
TW (3) TW201945565A (ko)
WO (1) WO2016070942A1 (ko)

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CN110199050A (zh) * 2017-01-31 2019-09-03 应用材料公司 材料沉积布置、真空沉积系统和其方法
CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
KR102337249B1 (ko) * 2018-04-18 2021-12-07 어플라이드 머티어리얼스, 인코포레이티드 증발된 재료를 기판 상에 증착하기 위한 증발 소스, 증착 장치, 증발된 재료의 증기압을 측정하기 위한 방법, 및 증발된 재료의 증발 레이트를 결정하기 위한 방법
JP2020521039A (ja) * 2018-05-04 2020-07-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 蒸発した材料を堆積させるための蒸発源、真空堆積システム、及び蒸発した材料を堆積させるための方法
KR20210121131A (ko) * 2019-01-30 2021-10-07 어플라이드 머티어리얼스, 인코포레이티드 진공 시스템을 세정하기 위한 방법, 기판의 진공 프로세싱을 위한 방법, 및 기판을 진공 프로세싱하기 위한 장치
CN109722651B (zh) * 2019-02-18 2021-03-23 长江存储科技有限责任公司 薄膜沉积设备及气体供给装置
TWI755956B (zh) * 2020-12-03 2022-02-21 財團法人國家實驗研究院 氣體分配模組與真空鍍膜裝置

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JP2002184571A (ja) * 2000-12-15 2002-06-28 Denso Corp 有機ｅｌ素子の製造方法
US20040035360A1 (en) * 2002-05-17 2004-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP4557170B2 (ja) * 2004-11-26 2010-10-06 三星モバイルディスプレイ株式會社 蒸発源
JP4767000B2 (ja) * 2005-11-28 2011-09-07 日立造船株式会社 真空蒸着装置
KR101106289B1 (ko) * 2006-08-04 2012-01-18 순천향대학교 산학협력단 증착 공정을 위한 선형 증착 소스
US20080131587A1 (en) * 2006-11-30 2008-06-05 Boroson Michael L Depositing organic material onto an oled substrate
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US20100159132A1 (en) * 2008-12-18 2010-06-24 Veeco Instruments, Inc. Linear Deposition Source
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US20100233353A1 (en) * 2009-03-16 2010-09-16 Applied Materials, Inc. Evaporator, coating installation, and method for use thereof
WO2010114118A1 (ja) * 2009-04-03 2010-10-07 東京エレクトロン株式会社 蒸着ヘッドおよび成膜装置
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Also Published As

Publication number Publication date
KR102082192B1 (ko) 2020-02-27
KR20170086679A (ko) 2017-07-26
TW201629248A (zh) 2016-08-16
JP2017535677A (ja) 2017-11-30
CN107002221B (zh) 2020-03-03
TW201805455A (zh) 2018-02-16
KR101990619B1 (ko) 2019-06-18
TWI641709B (zh) 2018-11-21
KR20170083592A (ko) 2017-07-18
TW201945565A (zh) 2019-12-01
CN107502858B (zh) 2020-06-19
WO2016070942A1 (en) 2016-05-12
CN107002221A (zh) 2017-08-01
TWI690611B (zh) 2020-04-11
CN107502858A (zh) 2017-12-22

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