JP6647647B1 - ウエハ型温度センサ - Google Patents
ウエハ型温度センサ Download PDFInfo
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- JP6647647B1 JP6647647B1 JP2019122725A JP2019122725A JP6647647B1 JP 6647647 B1 JP6647647 B1 JP 6647647B1 JP 2019122725 A JP2019122725 A JP 2019122725A JP 2019122725 A JP2019122725 A JP 2019122725A JP 6647647 B1 JP6647647 B1 JP 6647647B1
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- 230000001070 adhesive effect Effects 0.000 claims abstract description 28
- 239000004020 conductor Substances 0.000 claims description 11
- 238000009529 body temperature measurement Methods 0.000 claims description 7
- 238000010586 diagram Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 48
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
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- 230000009545 invasion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 238000012856 packing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
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- Measuring Temperature Or Quantity Of Heat (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
2:温度センサ
3:第一ハウジング(ハウジング)
4:第二ハウジング
5:接着剤
6:フラットケーブル
7:コネクタ
10:第一凹部(凹部)
16:第二凹部
22:測温部
23:ケーブル
24:側部
25:頂部
100:ウエハ型温度センサ
Claims (5)
- 表面に凹部を有するウエハと、
前記凹部に配置される測温部、及び該測温部に接続されるケーブルを有する温度センサと、
前記凹部に挿入可能な一対の側部、及び該側部同士を連結する頂部を有し、前記測温部が配置された該凹部に該側部が挿入されて該測温部を該頂部で覆った状態で接着剤によって該凹部に固着されるハウジングと、を備え、
前記側部は、前記凹部に挿入される側から前記頂部に向かって幅方向内側に傾く側部傾斜部を有するウエハ型温度センサ。 - 前記凹部は、穴底に対して口元の幅が小さい請求項1に記載のウエハ型温度センサ。
- 一方の前記側部から他方の前記側部までの最大幅は、前記凹部の口元の幅よりも小さい請求項1又は2に記載のウエハ型温度センサ。
- 前記ウエハの表面に設けられ前記ケーブルが配置される第二凹部と、
前記第二凹部に挿入可能な一対の第二側部、及び該第二側部同士を連結する第二頂部を有し、前記ケーブルが配置された該第二凹部に該第二側部が挿入され該第二頂部が該ケーブルを覆った状態で接着剤によって該第二凹部に固着される第二ハウジングと、を備える請求項1〜3の何れか一項に記載のウエハ型温度センサ。 - 前記ケーブルに対して前記測温部とは逆側で接続される導体、及び該導体を間に挟む一対の絶縁性フィルムを有するフラットケーブルを備える請求項1〜4の何れか一項に記載のウエハ型温度センサ。
Priority Applications (1)
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JP2019122725A JP6647647B1 (ja) | 2019-07-01 | 2019-07-01 | ウエハ型温度センサ |
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JP2019122725A JP6647647B1 (ja) | 2019-07-01 | 2019-07-01 | ウエハ型温度センサ |
Publications (2)
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JP6647647B1 true JP6647647B1 (ja) | 2020-02-14 |
JP2021009066A JP2021009066A (ja) | 2021-01-28 |
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JP2019122725A Active JP6647647B1 (ja) | 2019-07-01 | 2019-07-01 | ウエハ型温度センサ |
Country Status (1)
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JP (1) | JP6647647B1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01102840U (ja) * | 1987-12-28 | 1989-07-11 | ||
JP2000241257A (ja) * | 1999-02-24 | 2000-09-08 | Hayashi Denko Kk | 絶縁性基板の温度センサ装置 |
JP4718697B2 (ja) * | 2001-03-06 | 2011-07-06 | 安立計器株式会社 | 温度センサ付きウエハ |
JP2004153235A (ja) * | 2002-09-04 | 2004-05-27 | Okazaki Mfg Co Ltd | ウエハー用部材接合構造 |
JP5045454B2 (ja) * | 2008-01-22 | 2012-10-10 | 山里産業株式会社 | 管壁への熱電対取付構造及び熱電対取付方法 |
WO2017200267A1 (ko) * | 2016-05-16 | 2017-11-23 | 한국표준과학연구원 | 온도측정 웨이퍼 센서 및 그 제조방법 |
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