JP2021009066A - ウエハ型温度センサ - Google Patents
ウエハ型温度センサ Download PDFInfo
- Publication number
- JP2021009066A JP2021009066A JP2019122725A JP2019122725A JP2021009066A JP 2021009066 A JP2021009066 A JP 2021009066A JP 2019122725 A JP2019122725 A JP 2019122725A JP 2019122725 A JP2019122725 A JP 2019122725A JP 2021009066 A JP2021009066 A JP 2021009066A
- Authority
- JP
- Japan
- Prior art keywords
- recess
- wafer
- temperature sensor
- housing
- cable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 28
- 230000001070 adhesive effect Effects 0.000 claims abstract description 28
- 239000004020 conductor Substances 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 claims 3
- 238000009529 body temperature measurement Methods 0.000 abstract 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
2:温度センサ
3:第一ハウジング(ハウジング)
4:第二ハウジング
5:接着剤
6:フラットケーブル
7:コネクタ
10:第一凹部(凹部)
16:第二凹部
22:測温部
23:ケーブル
24:側部
25:頂部
100:ウエハ型温度センサ
Claims (6)
- 表面に凹部を有するウエハと、
前記凹部に配置される測温部、及び該測温部に接続されるケーブルを有する温度センサと、
前記凹部に挿入可能な一対の側部、及び該側部同士を連結する頂部を有し、前記測温部が配置された該凹部に該側部が挿入されて該測温部を該頂部で覆った状態で接着剤によって該凹部に固着されるハウジングと、を備えるウエハ型温度センサ。 - 前記凹部は、穴底に対して口元の幅が小さい請求項1に記載のウエハ型温度センサ。
- 前記側部は、前記凹部に挿入される側から前記頂部に向かって幅方向内側に傾く側部傾斜部を有する請求項1又は2に記載のウエハ型温度センサ。
- 一方の前記側部から他方の前記側部までの最大幅は、前記凹部の口元の幅よりも小さい請求項1〜3の何れか一項に記載のウエハ型温度センサ。
- 前記ウエハの表面に設けられ前記ケーブルが配置される第二凹部と、
前記第二凹部に挿入可能な一対の第二側部、及び該第二側部同士を連結する第二頂部を有し、前記ケーブルが配置された該第二凹部に該第二側部が挿入され該第二頂部が該ケーブルを覆った状態で接着剤によって該第二凹部に固着される第二ハウジングと、を備える請求項1〜4の何れか一項に記載のウエハ型温度センサ。 - 前記ケーブルに対して前記測温部とは逆側で接続される導体、及び該導体を間に挟む一対の絶縁性フィルムを有するフラットケーブルを備える請求項1〜5の何れか一項に記載のウエハ型温度センサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019122725A JP6647647B1 (ja) | 2019-07-01 | 2019-07-01 | ウエハ型温度センサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019122725A JP6647647B1 (ja) | 2019-07-01 | 2019-07-01 | ウエハ型温度センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6647647B1 JP6647647B1 (ja) | 2020-02-14 |
JP2021009066A true JP2021009066A (ja) | 2021-01-28 |
Family
ID=69568163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019122725A Active JP6647647B1 (ja) | 2019-07-01 | 2019-07-01 | ウエハ型温度センサ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6647647B1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01102840U (ja) * | 1987-12-28 | 1989-07-11 | ||
JP2000241257A (ja) * | 1999-02-24 | 2000-09-08 | Hayashi Denko Kk | 絶縁性基板の温度センサ装置 |
JP2002257635A (ja) * | 2001-03-06 | 2002-09-11 | Anritsu Keiki Kk | 温度センサ付きウエハ |
JP2004153235A (ja) * | 2002-09-04 | 2004-05-27 | Okazaki Mfg Co Ltd | ウエハー用部材接合構造 |
JP2009174889A (ja) * | 2008-01-22 | 2009-08-06 | Yamari Sangyo Kk | 管壁への熱電対取付構造及び熱電対取付方法 |
WO2017200267A1 (ko) * | 2016-05-16 | 2017-11-23 | 한국표준과학연구원 | 온도측정 웨이퍼 센서 및 그 제조방법 |
-
2019
- 2019-07-01 JP JP2019122725A patent/JP6647647B1/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01102840U (ja) * | 1987-12-28 | 1989-07-11 | ||
JP2000241257A (ja) * | 1999-02-24 | 2000-09-08 | Hayashi Denko Kk | 絶縁性基板の温度センサ装置 |
JP2002257635A (ja) * | 2001-03-06 | 2002-09-11 | Anritsu Keiki Kk | 温度センサ付きウエハ |
JP2004153235A (ja) * | 2002-09-04 | 2004-05-27 | Okazaki Mfg Co Ltd | ウエハー用部材接合構造 |
JP2009174889A (ja) * | 2008-01-22 | 2009-08-06 | Yamari Sangyo Kk | 管壁への熱電対取付構造及び熱電対取付方法 |
WO2017200267A1 (ko) * | 2016-05-16 | 2017-11-23 | 한국표준과학연구원 | 온도측정 웨이퍼 센서 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP6647647B1 (ja) | 2020-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9105375B2 (en) | Cable assembly and method of manufacturing the same | |
KR20140131571A (ko) | 낮은 프로파일 전기 장치를 위한 가요성 케이블 | |
JP6371002B1 (ja) | 温度センサ | |
KR101038755B1 (ko) | 세라믹 칩 어셈블리 | |
KR102586604B1 (ko) | 밀봉된 전기 플러그 | |
WO2012078434A2 (en) | Electrical cable connector and assembly | |
CN102280416B (zh) | 半导体装置及其制造方法 | |
EP3190396B1 (en) | Terminal-thermistor assembly | |
GB2062860A (en) | Temperature sensing assembly | |
JPH0868699A (ja) | サーミスタセンサ | |
JP2021009066A (ja) | ウエハ型温度センサ | |
US11808634B2 (en) | Temperature sensor, temperature sensor element, and method for manufacturing temperature sensor | |
JP2004219123A (ja) | 測温用プローブ | |
KR20110011196U (ko) | 필름형 서미스터와 와이어 접속용 인서트 사출 접속함 | |
KR100377417B1 (ko) | 기판온도측정 장치 및 제작 방법 | |
JP6831965B1 (ja) | 温度センサ | |
JPH0868698A (ja) | サーミスタセンサ | |
US11802798B2 (en) | Temperature sensor | |
CA2900509C (en) | Preventing stray currents in sensors in conductive media | |
JP3687240B2 (ja) | 熱電対の導線被覆構造 | |
JP7198073B2 (ja) | 温度センサ | |
EP3886156A1 (en) | Power semiconductor module arrangement | |
JP2595284B2 (ja) | 成膜装置 | |
KR100862165B1 (ko) | 확산로용 와이어 서모커플 조립장치 및 제조방법 | |
GB2225691A (en) | Parallel circuit heating cable |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190703 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20190703 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20190801 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191001 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191011 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191224 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191226 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6647647 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313532 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |