JP6633316B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6633316B2 JP6633316B2 JP2015151550A JP2015151550A JP6633316B2 JP 6633316 B2 JP6633316 B2 JP 6633316B2 JP 2015151550 A JP2015151550 A JP 2015151550A JP 2015151550 A JP2015151550 A JP 2015151550A JP 6633316 B2 JP6633316 B2 JP 6633316B2
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- conductor
- semiconductor
- transistor
- insulator
- oxide
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- 150000003624 transition metals Chemical class 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8221—Three dimensional integrated circuits stacked in different levels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
- H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/58—Arrangements comprising a monitoring photodetector
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Memories (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
本発明の一態様は、絶縁体と、半導体と、導電体と、を有し、半導体は、絶縁体を介して、半導体と導電体とが互いに重なる領域を有し、領域は、領域の上面に垂直な方向において、上面に平行な方向よりも高い誘電率を有する半導体装置である。
または、本発明の一態様は、(1)において、領域は結晶部を有し、結晶部の一の結晶軸が配向性を有する半導体装置である。
または、本発明の一態様は、(1)または(2)において、上面に平行な方向が、チャネル幅方向である半導体装置である。
または、本発明の一態様は、絶縁体と、半導体と、導電体と、を有し、半導体は、絶縁体を介して、半導体と導電体とが互いに重なる領域を有し、半導体は、結晶構造を有する領域を有し、結晶構造は、第1の結晶軸と、第2の結晶軸と、を有し、結晶構造は、第1の結晶軸の方向における誘電率が、第2の結晶軸の方向における誘電率よりも高い半導体装置である。
または、本発明の一態様は、(4)において、第1の結晶軸は、半導体の上面の法線ベクトルと平行な方向に配向している半導体装置である。
または、本発明の一態様は、(1)乃至(5)のいずれか一において、半導体は、インジウム、亜鉛および元素M(元素Mはアルミニウム、ガリウム、イットリウムまたはスズ)から選ばれた一種以上を有する酸化物を有する半導体装置である。
本発明の一態様に係るトランジスタについて説明する。なお、以下では、酸化物半導体を用いたnチャネル型トランジスタを想定して説明する。ただし、pチャネル型トランジスタに適用するために、適宜用語などを読み替えても構わない。
図1(A)および図1(B)は、本発明の一態様のトランジスタの上面図および断面図である。図1(A)は上面図であり、図1(B)は、図1(A)に示す一点鎖線A1−A2、および一点鎖線A3−A4に対応する断面図である。なお、図1(A)の上面図では、図の明瞭化のために一部の要素を省いて図示している。
以下では、半導体406および半導体606などの半導体に適用可能な、酸化物半導体の構造について説明する。
以下では、本発明の一態様に係る半導体装置を例示する。
以下では、本発明の一態様に係るトランジスタを利用した回路の一例について説明する。
図14(A)に示す回路図は、pチャネル型のトランジスタ2200とnチャネル型のトランジスタ2100を直列に接続し、かつそれぞれのゲートを接続した、いわゆるCMOSインバータの構成を示している。
図15は、図14(A)に対応する半導体装置の断面図である。図15に示す半導体装置は、トランジスタ2200と、トランジスタ2100と、を有する。また、トランジスタ2100は、トランジスタ2200の上方に配置する。なお、トランジスタ2100として、図1に示したトランジスタを用いた例を示しているが、本発明の一態様に係る半導体装置は、これに限定されるものではない。例えば、図3、図4または図5に示したトランジスタなどを、トランジスタ2100として用いても構わない。よって、トランジスタ2100については、適宜上述したトランジスタについての記載を参酌する。
また図14(B)に示す回路図は、トランジスタ2100とトランジスタ2200のそれぞれのソースとドレインを接続した構成を示している。このような構成とすることで、いわゆるCMOSアナログスイッチとして機能させることができる。
本発明の一態様に係るトランジスタを用いた、電力が供給されない状況でも記憶内容の保持が可能で、かつ、書き込み回数にも制限が無い半導体装置(記憶装置)の一例を図18に示す。
図19は、図18(A)に対応する半導体装置の断面図である。図19に示す半導体装置は、トランジスタ3200と、トランジスタ3300と、容量素子3400と、を有する。また、トランジスタ3300および容量素子3400は、トランジスタ3200の上方に配置する。なお、トランジスタ3300としては、上述したトランジスタ2100についての記載を参照する。また、トランジスタ3200としては、図15に示したトランジスタ2200についての記載を参照する。なお、図15では、トランジスタ2200がpチャネル型トランジスタである場合について説明したが、トランジスタ3200がnチャネル型トランジスタであっても構わない。
図18(B)に示す半導体装置は、トランジスタ3200を有さない点で図18(A)に示した半導体装置と異なる。この場合も図18(A)に示した半導体装置と同様の動作により情報の書き込みおよび保持動作が可能である。
以下では、本発明の一態様に係る撮像装置について説明する。
撮像装置200が有する1つの画素211を複数の副画素212で構成し、それぞれの副画素212に特定の波長帯域の光を透過するフィルタ(カラーフィルタ)を組み合わせることで、カラー画像表示を実現するための情報を取得することができる。
以下では、シリコンを用いたトランジスタと、酸化物半導体を用いたトランジスタと、を用いて画素を構成する一例について説明する。
以下では、上述したトランジスタや上述した記憶装置などの半導体装置を含むCPUについて説明する。
以下では、本発明の一態様に係る表示装置について、図29および図30を用いて説明する。
本発明の一態様に係る半導体装置は、表示機器、パーソナルコンピュータ、記録媒体を備えた画像再生装置(代表的にはDVD:Digital Versatile Disc等の記録媒体を再生し、その画像を表示しうるディスプレイを有する装置)に用いることができる。その他に、本発明の一態様に係る半導体装置を用いることができる電子機器として、携帯電話、携帯型を含むゲーム機、携帯データ端末、電子書籍端末、ビデオカメラ、デジタルスチルカメラ等のカメラ、ゴーグル型ディスプレイ(ヘッドマウントディスプレイ)、ナビゲーションシステム、音響再生装置(カーオーディオ、デジタルオーディオプレイヤー等)、複写機、ファクシミリ、プリンタ、プリンタ複合機、現金自動預け入れ払い機(ATM)、自動販売機などが挙げられる。これら電子機器の具体例を図31に示す。
201 スイッチ
202 スイッチ
203 スイッチ
210 画素部
211 画素
212 副画素
212B 副画素
212G 副画素
212R 副画素
220 光電変換素子
230 画素回路
231 配線
247 配線
248 配線
249 配線
250 配線
253 配線
254 フィルタ
254B フィルタ
254G フィルタ
254R フィルタ
255 レンズ
256 光
257 配線
260 周辺回路
270 周辺回路
280 周辺回路
290 周辺回路
291 光源
300 シリコン基板
310 層
320 層
330 層
340 層
351 トランジスタ
352 トランジスタ
353 トランジスタ
360 フォトダイオード
361 アノード
363 低抵抗領域
370 プラグ
371 配線
372 配線
373 配線
380 絶縁体
400 基板
401 絶縁体
402 絶縁体
404 導電体
406 半導体
406a 半導体
406c 半導体
408 絶縁体
412 絶縁体
413 導電体
414 導電体
416a 導電体
416b 導電体
418 絶縁体
423a 低抵抗領域
423b 低抵抗領域
424a 導電体
424b 導電体
426a 導電体
426b 導電体
428 絶縁体
450 半導体基板
452 絶縁体
454 導電体
456 領域
460 領域
462 絶縁体
464 絶縁体
466 絶縁体
468 絶縁体
472a 領域
472b 領域
474a 導電体
474b 導電体
474c 導電体
476a 導電体
476b 導電体
478a 導電体
478b 導電体
478c 導電体
480a 導電体
480b 導電体
480c 導電体
490 絶縁体
492 絶縁体
494 絶縁体
496a 導電体
496b 導電体
496c 導電体
496d 導電体
498a 導電体
498b 導電体
498c 導電体
498d 導電体
600 基板
604 導電体
606 半導体
612 絶縁体
613 導電体
616a 導電体
616b 導電体
618 絶縁体
620 絶縁体
700 基板
704a 導電体
704b 導電体
706 半導体
712a 絶縁体
712b 絶縁体
714a 導電体
714b 導電体
716a 導電体
716b 導電体
718a 絶縁体
718b 絶縁体
718c 絶縁体
719 発光素子
720 絶縁体
721 絶縁体
731 端子
732 FPC
733a 配線
734 シール材
735 駆動回路
736 駆動回路
737 画素
741 トランジスタ
742 容量素子
743 スイッチ素子
744 信号線
750 基板
751 トランジスタ
752 容量素子
753 液晶素子
754 走査線
755 信号線
781 導電体
782 発光層
783 導電体
784 隔壁
791 導電体
792 絶縁体
793 液晶層
794 絶縁体
795 スペーサ
796 導電体
797 基板
901 筐体
902 筐体
903 表示部
904 表示部
905 マイクロフォン
906 スピーカー
907 操作キー
908 スタイラス
911 筐体
912 筐体
913 表示部
914 表示部
915 接続部
916 操作キー
921 筐体
922 表示部
923 キーボード
924 ポインティングデバイス
931 筐体
932 冷蔵室用扉
933 冷凍室用扉
941 筐体
942 筐体
943 表示部
944 操作キー
945 レンズ
946 接続部
951 車体
952 車輪
953 ダッシュボード
954 ライト
1189 ROMインターフェース
1190 基板
1191 ALU
1192 ALUコントローラ
1193 インストラクションデコーダ
1194 インタラプトコントローラ
1195 タイミングコントローラ
1196 レジスタ
1197 レジスタコントローラ
1198 バスインターフェース
1199 ROM
1200 記憶素子
1201 回路
1202 回路
1203 スイッチ
1204 スイッチ
1206 論理素子
1207 容量素子
1208 容量素子
1209 トランジスタ
1210 トランジスタ
1213 トランジスタ
1214 トランジスタ
1220 回路
2100 トランジスタ
2200 トランジスタ
3001 配線
3002 配線
3003 配線
3004 配線
3005 配線
3200 トランジスタ
3300 トランジスタ
3400 容量素子
5100 ナノ結晶
5120 基板
5161 領域
Claims (3)
- 第1のゲート電極と、
前記第1のゲート電極上方の第1のゲート絶縁体と、
前記第1のゲート絶縁体上方の酸化物半導体と、
前記酸化物半導体上方の第1の導電体及び第2の導電体と、
前記酸化物半導体上方、前記第1の導電体上方、かつ、前記第2の導電体上方の第2のゲート絶縁体と、
前記第2のゲート絶縁体上方の第2のゲート電極と、
前記第2のゲート電極上方、前記第1の導電体上方、かつ、前記第2の導電体上方の絶縁体と、を有し、
前記第1の導電体は、前記第2のゲート絶縁体を介して前記第2のゲート電極と重なる領域を有し、
前記第2の導電体は、前記第2のゲート絶縁体を介して前記第2のゲート電極と重なる領域を有し、
前記第1の導電体の下端部は、前記酸化物半導体の上端部と一致している領域を有し、
前記第2の導電体の下端部は、前記酸化物半導体の上端部と一致している領域を有し、
前記絶縁体は、前記酸化物半導体の側面と接する領域を有し、
前記酸化物半導体の膜厚方向における誘電率は、前記酸化物半導体のチャネル長方向における誘電率、または、前記酸化物半導体のチャネル幅方向における誘電率よりも高い半導体装置。 - 第1のゲート電極と、
前記第1のゲート電極上方の第1のゲート絶縁体と、
前記第1のゲート絶縁体上方の酸化物半導体と、
前記酸化物半導体上方の第1の導電体及び第2の導電体と、
前記酸化物半導体上方、前記第1の導電体上方、かつ、前記第2の導電体上方の第2のゲート絶縁体と、
前記第2のゲート絶縁体上方の第2のゲート電極と、
前記第2のゲート電極上方、前記第1の導電体上方、かつ、前記第2の導電体上方の絶縁体と、を有し、
前記第1の導電体は、前記第2のゲート絶縁体を介して前記第2のゲート電極と重なる領域を有し、
前記第2の導電体は、前記第2のゲート絶縁体を介して前記第2のゲート電極と重なる領域を有し、
前記第1の導電体の下端部は、前記酸化物半導体の上端部と一致している領域を有し、
前記第2の導電体の下端部は、前記酸化物半導体の上端部と一致している領域を有し、
前記絶縁体は、前記酸化物半導体の側面と接する領域を有し、
前記絶縁体は、酸素または水素をブロックする機能を有し、
前記酸化物半導体の膜厚方向における誘電率は、前記酸化物半導体のチャネル長方向における誘電率、または、前記酸化物半導体のチャネル幅方向における誘電率よりも高い半導体装置。 - 請求項1または請求項2において、
前記酸化物半導体は、インジウム、亜鉛、及び元素M(元素Mはアルミニウム、ガリウム、イットリウム、またはスズ)から選ばれた一種以上を有する半導体装置。
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