JP6631425B2 - 発光素子及び発光素子の製造方法 - Google Patents

発光素子及び発光素子の製造方法 Download PDF

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JP6631425B2
JP6631425B2 JP2016134566A JP2016134566A JP6631425B2 JP 6631425 B2 JP6631425 B2 JP 6631425B2 JP 2016134566 A JP2016134566 A JP 2016134566A JP 2016134566 A JP2016134566 A JP 2016134566A JP 6631425 B2 JP6631425 B2 JP 6631425B2
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light emitting
region
light
support substrate
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JP2018006657A (ja
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石崎 順也
順也 石崎
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Shin Etsu Handotai Co Ltd
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Shin Etsu Handotai Co Ltd
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Priority to JP2016134566A priority Critical patent/JP6631425B2/ja
Priority to TW106120309A priority patent/TWI731104B/zh
Priority to CN201710521506.0A priority patent/CN107591463B/zh
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JP2016134566A 2016-07-06 2016-07-06 発光素子及び発光素子の製造方法 Active JP6631425B2 (ja)

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Application Number Priority Date Filing Date Title
JP2016134566A JP6631425B2 (ja) 2016-07-06 2016-07-06 発光素子及び発光素子の製造方法
TW106120309A TWI731104B (zh) 2016-07-06 2017-06-19 發光元件及發光元件的製造方法
CN201710521506.0A CN107591463B (zh) 2016-07-06 2017-06-30 发光组件及发光组件的制造方法

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JP2016134566A JP6631425B2 (ja) 2016-07-06 2016-07-06 発光素子及び発光素子の製造方法

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JP2018006657A JP2018006657A (ja) 2018-01-11
JP6631425B2 true JP6631425B2 (ja) 2020-01-15

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CN (1) CN107591463B (zh)
TW (1) TWI731104B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6943217B2 (ja) * 2018-04-12 2021-09-29 信越半導体株式会社 発光素子の配光特性の調整方法及び発光素子の製造方法
DE112019002037B4 (de) * 2018-04-19 2024-05-08 Dowa Electronics Materials Co., Ltd. Lichtemittierende Halbleiterelemente und Verfahren zu deren Herstellung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5019664B2 (ja) * 1998-07-28 2012-09-05 アイメック 高効率で光を発するデバイスおよびそのようなデバイスの製造方法
US6504180B1 (en) * 1998-07-28 2003-01-07 Imec Vzw And Vrije Universiteit Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom
TW466784B (en) * 2000-09-19 2001-12-01 United Epitaxy Co Ltd Method to manufacture high luminescence LED by using glass pasting
CN100477425C (zh) * 2005-05-19 2009-04-08 松下电器产业株式会社 氮化物半导体装置及其制造方法
JP2008251561A (ja) * 2007-03-29 2008-10-16 Toyoda Gosei Co Ltd 表示装置
JP5050109B2 (ja) * 2011-03-14 2012-10-17 株式会社東芝 半導体発光素子
CN104160520A (zh) * 2012-02-01 2014-11-19 松下电器产业株式会社 半导体发光元件、其制造方法和光源装置
KR20130102341A (ko) * 2012-03-07 2013-09-17 서울옵토디바이스주식회사 개선된 광 추출 효율을 갖는 발광 다이오드 및 그것을 제조하는 방법
JP6288912B2 (ja) * 2012-12-14 2018-03-07 日亜化学工業株式会社 発光素子
JP6287317B2 (ja) * 2013-02-28 2018-03-07 日亜化学工業株式会社 半導体発光素子
KR20160083408A (ko) * 2014-12-31 2016-07-12 삼성전자주식회사 퓨즈 패키지 및 이를 이용한 발광소자 모듈

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TW201803152A (zh) 2018-01-16
CN107591463B (zh) 2021-08-17
JP2018006657A (ja) 2018-01-11
TWI731104B (zh) 2021-06-21
CN107591463A (zh) 2018-01-16

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