JP6622679B2 - サークルスクラッチ検査装置 - Google Patents
サークルスクラッチ検査装置 Download PDFInfo
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- JP6622679B2 JP6622679B2 JP2016209215A JP2016209215A JP6622679B2 JP 6622679 B2 JP6622679 B2 JP 6622679B2 JP 2016209215 A JP2016209215 A JP 2016209215A JP 2016209215 A JP2016209215 A JP 2016209215A JP 6622679 B2 JP6622679 B2 JP 6622679B2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/12—Edge-based segmentation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
- G06T7/64—Analysis of geometric attributes of convexity or concavity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8809—Adjustment for highlighting flaws
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8874—Taking dimensions of defect into account
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20112—Image segmentation details
- G06T2207/20168—Radial search
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30164—Workpiece; Machine component
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30242—Counting objects in image
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Geometry (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
2 照明装置
3 カメラ
4 画像処理装置
41 2次微分画像生成手段
42 2次微分曲線生成手段
43 サークルスクラッチ判定手段
5 ワーク表面
6 穴
7 ルーラー線
Claims (3)
- ワーク表面の穴の周囲を撮像するカメラと、
前記ワーク表面での正反射光が前記カメラに直接入射しないように前記ワーク表面の前記穴の周囲に向けて光を照射する少なくとも1つの照明装置と、
前記カメラにより得られた実画像に対して画像処理を行う画像処理装置と、を備え、
前記画像処理装置は、
前記実画像中の輝度値を2次微分して2次微分画像を生成する2次微分画像生成手段と、
前記ワーク表面における検査対象領域上に設定された、前記穴の中心から放射状に広がる複数のルーラー線のそれぞれに対し、当該ルーラー線上での前記2次微分画像中の2次微分値の変化を示す2次微分曲線を生成する2次微分曲線生成手段と、
各ルーラー線上で前記2次微分曲線が第1の閾値を横切る第1参照回数をカウントするとともに、前記複数のルーラー線の前記第1参照回数の合計である第1参照総回数を算出し、前記第1参照総回数を使用してサークルスクラッチの有無を判定するサークルスクラッチ判定手段と、を含む、サークルスクラッチ検査装置。 - 前記サークルスクラッチ判定手段は、各ルーラー線上で前記2次微分曲線が前記第1の閾値よりも小さな第2の閾値を横切る第2参照回数をカウントするとともに、前記複数のルーラー線の前記第2参照回数の合計である第2参照総回数を算出し、前記第1参照総回数を前記第2参照総回数で割った値が判定基準値以上の場合にサークルスクラッチが有ると判定し、前記第1参照総回数を前記第2参照総回数で割った値が前記判定基準値未満の場合にサークルスクラッチが無いと判定する、請求項1に記載のサークルスクラッチ検査装置。
- 前記少なくとも1つの照明装置は、前記ワーク表面の前記穴の周囲に向けて互いに異なる方向から光を照射する複数の照明装置を含む、請求項1または2に記載のサークルスクラッチ検査装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016209215A JP6622679B2 (ja) | 2016-10-26 | 2016-10-26 | サークルスクラッチ検査装置 |
US15/794,848 US10565698B2 (en) | 2016-10-26 | 2017-10-26 | Circular scratch inspection apparatus |
Applications Claiming Priority (1)
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JP2016209215A JP6622679B2 (ja) | 2016-10-26 | 2016-10-26 | サークルスクラッチ検査装置 |
Publications (2)
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JP2018072055A JP2018072055A (ja) | 2018-05-10 |
JP6622679B2 true JP6622679B2 (ja) | 2019-12-18 |
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JP2016209215A Active JP6622679B2 (ja) | 2016-10-26 | 2016-10-26 | サークルスクラッチ検査装置 |
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US (1) | US10565698B2 (ja) |
JP (1) | JP6622679B2 (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3160743B2 (ja) * | 1994-11-18 | 2001-04-25 | シャープ株式会社 | 液晶パネル欠陥検査装置 |
JPH112611A (ja) * | 1997-06-11 | 1999-01-06 | Hitachi Ltd | シート状部材の製造方法およびシート状部材の検査方法およびシート状部材の欠陥検査装置 |
US6256091B1 (en) * | 1997-08-25 | 2001-07-03 | Nippon Maxis Co., Ltd. | Transparent substrate mounting platform, transparent substrate scratch inspection device, transparent substrate bevelling inspection method and device, and transparent substrate inspection method |
JP3454162B2 (ja) * | 1998-08-04 | 2003-10-06 | ダイハツ工業株式会社 | 穴のある平面プレートの傷検査装置 |
JP3732980B2 (ja) * | 1999-08-31 | 2006-01-11 | 日立ハイテク電子エンジニアリング株式会社 | ディスク表面欠陥検査装置における判定方法 |
US7623227B2 (en) * | 2004-12-19 | 2009-11-24 | Kla-Tencor Corporation | System and method for inspecting a workpiece surface using polarization of scattered light |
JP4829542B2 (ja) * | 2005-06-21 | 2011-12-07 | グンゼ株式会社 | フィルム検査装置およびフィルム検査方法 |
JP5619348B2 (ja) * | 2008-11-21 | 2014-11-05 | 住友化学株式会社 | 成形シートの欠陥検査装置 |
IT1396723B1 (it) * | 2009-11-04 | 2012-12-14 | Sacmi | Apparato per la rilevazione di difetti di elementi da esaminare, in particolare coperchi metallici, impianto di rilevazione di difetti provvisto di tale apparato e metodo di funzionamento relativo. |
JP5676387B2 (ja) * | 2011-07-27 | 2015-02-25 | 株式会社日立製作所 | 外観検査方法及びその装置 |
WO2015027198A1 (en) * | 2013-08-23 | 2015-02-26 | Kla-Tencor Corporation | Block-to-block reticle inspection |
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2016
- 2016-10-26 JP JP2016209215A patent/JP6622679B2/ja active Active
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- 2017-10-26 US US15/794,848 patent/US10565698B2/en active Active
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US20180114309A1 (en) | 2018-04-26 |
JP2018072055A (ja) | 2018-05-10 |
US10565698B2 (en) | 2020-02-18 |
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