JP6615643B2 - 被加工部材の加工方法及び加工装置 - Google Patents

被加工部材の加工方法及び加工装置 Download PDF

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Publication number
JP6615643B2
JP6615643B2 JP2016041012A JP2016041012A JP6615643B2 JP 6615643 B2 JP6615643 B2 JP 6615643B2 JP 2016041012 A JP2016041012 A JP 2016041012A JP 2016041012 A JP2016041012 A JP 2016041012A JP 6615643 B2 JP6615643 B2 JP 6615643B2
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Japan
Prior art keywords
workpiece
processing
processed
suction
holding
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Expired - Fee Related
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JP2016041012A
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Japanese (ja)
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JP2017154225A (ja
JP2017154225A5 (enExample
Inventor
誠 増田
寿 吉田
隆明 吉村
昌宏 森田
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Takatori Corp
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Takatori Corp
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Priority to JP2016041012A priority Critical patent/JP6615643B2/ja
Priority to US15/776,298 priority patent/US20180326590A1/en
Priority to PCT/JP2016/083941 priority patent/WO2017086339A1/ja
Priority to EP16866340.9A priority patent/EP3391994A4/en
Publication of JP2017154225A publication Critical patent/JP2017154225A/ja
Publication of JP2017154225A5 publication Critical patent/JP2017154225A5/ja
Application granted granted Critical
Publication of JP6615643B2 publication Critical patent/JP6615643B2/ja
Priority to US17/353,084 priority patent/US11504857B2/en
Expired - Fee Related legal-status Critical Current
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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2016041012A 2015-11-16 2016-03-03 被加工部材の加工方法及び加工装置 Expired - Fee Related JP6615643B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016041012A JP6615643B2 (ja) 2016-03-03 2016-03-03 被加工部材の加工方法及び加工装置
US15/776,298 US20180326590A1 (en) 2015-11-16 2016-11-16 Wire saw device, and processing method and processing device for workpiece
PCT/JP2016/083941 WO2017086339A1 (ja) 2015-11-16 2016-11-16 ワイヤソー装置並びに被加工物の加工方法及び加工装置
EP16866340.9A EP3391994A4 (en) 2015-11-16 2016-11-16 WIRE SAW AND PROCESSING METHOD AND PROCESSING DEVICE FOR A WORKPIECE
US17/353,084 US11504857B2 (en) 2015-11-16 2021-06-21 Wire saw device, and processing method and processing device for workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016041012A JP6615643B2 (ja) 2016-03-03 2016-03-03 被加工部材の加工方法及び加工装置

Publications (3)

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JP2017154225A JP2017154225A (ja) 2017-09-07
JP2017154225A5 JP2017154225A5 (enExample) 2019-01-31
JP6615643B2 true JP6615643B2 (ja) 2019-12-04

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JP2016041012A Expired - Fee Related JP6615643B2 (ja) 2015-11-16 2016-03-03 被加工部材の加工方法及び加工装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220142243A (ko) * 2021-04-14 2022-10-21 주식회사 케이엔제이 에지링 내경 가공장치 및 방법
KR20220142244A (ko) * 2021-04-14 2022-10-21 주식회사 케이엔제이 에지링 외경 가공장치 및 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112894869B (zh) * 2021-01-28 2022-05-17 中山市富源塑胶制品有限公司 一种注塑机械手
CN113510788B (zh) * 2021-09-14 2021-12-07 江苏汇海新材料科技有限公司 一种包装膜生产切割机械手
JP2024546687A (ja) * 2021-12-10 2024-12-26 イリノイ トゥール ワークス インコーポレイティド 可動ツーピースワークテーブルを有する材料除去機
CN117817464B (zh) * 2024-03-05 2024-05-28 中泓顺源建设科技集团有限公司 一种建筑墙面平整打磨装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963437U (ja) * 1982-10-19 1984-04-26 東京エレクトロン株式会社 半導体ウエハの吸着保持装置
JP2547395Y2 (ja) * 1990-11-22 1997-09-10 セイコー電子工業株式会社 ダイヤルの表面加工装置
JPH0740236A (ja) * 1993-07-26 1995-02-10 Hitachi Ltd 多層配線基板の平坦化加工方法
JPH10217239A (ja) * 1996-12-02 1998-08-18 Atsusato Kitamura スライシング方法およびワイヤソー装置
US6279564B1 (en) * 1997-07-07 2001-08-28 John B. Hodsden Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
JP4080401B2 (ja) * 2003-09-05 2008-04-23 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4178129B2 (ja) * 2004-05-20 2008-11-12 日本ファステム株式会社 ワイヤーソー切断装置および切断方法
JP4649307B2 (ja) * 2005-09-30 2011-03-09 株式会社東芝 機械式切断装置およびこの装置を用いた切断方法
KR101153196B1 (ko) * 2005-10-04 2012-06-18 니혼쇼료쿠키카이 가부시키가이샤 초음파 트림장치
JP2014231099A (ja) * 2013-05-28 2014-12-11 日立工機株式会社 アタッチメント及び手持ち式ワイヤソー
JP2014040001A (ja) * 2013-11-26 2014-03-06 Ihi Corp ワーク加工装置とその制御方法
JP2015155119A (ja) * 2014-02-20 2015-08-27 株式会社タカトリ ワイヤソー及び切断加工方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220142243A (ko) * 2021-04-14 2022-10-21 주식회사 케이엔제이 에지링 내경 가공장치 및 방법
KR20220142244A (ko) * 2021-04-14 2022-10-21 주식회사 케이엔제이 에지링 외경 가공장치 및 방법
KR102468583B1 (ko) 2021-04-14 2022-11-22 주식회사 케이엔제이 에지링 내경 가공장치 및 방법
KR102498344B1 (ko) 2021-04-14 2023-02-10 주식회사 케이엔제이 에지링 외경 가공장치 및 방법

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