JP6615286B2 - 蒸着マスク、蒸着装置、蒸着方法及び有機el表示装置の製造方法 - Google Patents
蒸着マスク、蒸着装置、蒸着方法及び有機el表示装置の製造方法 Download PDFInfo
- Publication number
- JP6615286B2 JP6615286B2 JP2018142796A JP2018142796A JP6615286B2 JP 6615286 B2 JP6615286 B2 JP 6615286B2 JP 2018142796 A JP2018142796 A JP 2018142796A JP 2018142796 A JP2018142796 A JP 2018142796A JP 6615286 B2 JP6615286 B2 JP 6615286B2
- Authority
- JP
- Japan
- Prior art keywords
- vapor deposition
- deposition mask
- electromagnet
- mask
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007740 vapor deposition Methods 0.000 title claims description 259
- 238000000034 method Methods 0.000 title description 39
- 238000004519 manufacturing process Methods 0.000 title description 16
- 239000000758 substrate Substances 0.000 claims description 113
- 230000005291 magnetic effect Effects 0.000 claims description 85
- 229910052751 metal Inorganic materials 0.000 claims description 84
- 239000002184 metal Substances 0.000 claims description 84
- 230000008021 deposition Effects 0.000 claims description 78
- 230000005415 magnetization Effects 0.000 claims description 50
- 239000003302 ferromagnetic material Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 10
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 91
- 239000010410 layer Substances 0.000 description 87
- 238000000151 deposition Methods 0.000 description 76
- 239000010408 film Substances 0.000 description 62
- 229920005989 resin Polymers 0.000 description 58
- 239000011347 resin Substances 0.000 description 58
- 239000000463 material Substances 0.000 description 34
- 239000012044 organic layer Substances 0.000 description 27
- 239000011368 organic material Substances 0.000 description 13
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000000926 separation method Methods 0.000 description 9
- 239000010409 thin film Substances 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 8
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 239000000696 magnetic material Substances 0.000 description 7
- 239000002131 composite material Substances 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 230000005294 ferromagnetic effect Effects 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000005347 demagnetization Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- 229910016583 MnAl Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Description
本発明の蒸着方法は、少なくとも一部に強磁性体からなる金属層を有する蒸着マスクを形成する工程、前記蒸着マスクの金属層に磁界を印加することにより前記金属層を着磁する工程、被蒸着基板と蒸着マスクとを位置合せした後、電磁石と蒸着マスクを、間に被蒸着基板を挟んで吸着させる工程、前記蒸着マスクと対向する側に蒸着源を配置し、前記蒸着源から蒸着材料を気化させて蒸着材料を前記被蒸着基板に堆積する工程、及び前記電磁石に前記蒸着マスクを反発させる磁界を発生させることにより前記電磁石及び被蒸着基板を前記蒸着マスクから分離する工程を含むことを特徴とする。
2 被蒸着基板
3 電磁石
5 蒸着源
6 タッチプレート
7 磁性体
11 樹脂フィルム
11a 開口部
12 金属支持層
12a 開口
14 フレーム
15 マスクホルダー
21 装置基板
22 第1電極
23 バンク
25 積層膜
26 第2電極
27 保護膜
29 基板ホルダー
31 磁心
32 電磁コイル
33 樹脂
41 レーザ用マスク
41a 開口部
41b 遮光膜
42 光学レンズ
45 加工ステージ
61 支持フレーム
Claims (4)
- 電磁石と、前記電磁石の一方の磁極側に被蒸着基板を保持できるように設けられる基板ホルダーと、前記基板ホルダーにより保持される前記被蒸着基板の前記電磁石と反対側に設けられる蒸着マスクとを有し、
前記蒸着マスクが磁石となり得る強磁性体からなる金属層を有し、
前記金属層を着磁することで磁石とする第1回路と、前記電磁石に設けられ、前記金属層の着磁による磁化の磁界の向きと反対向きの磁界を発生させることにより、前記着磁による残留磁化が残留した状態で前記電磁石及び前記被蒸着基板を前記蒸着マスクから分離させる第2回路とを含む制御回路を含む蒸着装置。 - 前記第1回路は、前記金属層を第1の磁化の向きに着磁し、前記第2回路は、前記第1の磁化による磁界の向きと反対向きの磁界を発生させる、請求項1記載の蒸着装置。
- 前記電磁石が1個の前記蒸着マスクに対して複数個で形成され、前記複数個の電磁石のうち、少なくとも1個は独立して発生磁界の強度を調整する制御回路を有する請求項1又は2記載の蒸着装置。
- 前記電磁石を冷却する冷却装置が前記電磁石の近傍に設けられてなる請求項1〜3のいずれか1項に記載の蒸着装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016047210 | 2016-03-10 | ||
JP2016047210 | 2016-03-10 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018503979A Division JP6413045B2 (ja) | 2016-03-10 | 2016-07-22 | 蒸着方法及び有機el表示装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018193618A JP2018193618A (ja) | 2018-12-06 |
JP6615286B2 true JP6615286B2 (ja) | 2019-12-04 |
Family
ID=59790220
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018503979A Active JP6413045B2 (ja) | 2016-03-10 | 2016-07-22 | 蒸着方法及び有機el表示装置の製造方法 |
JP2018142796A Active JP6615286B2 (ja) | 2016-03-10 | 2018-07-30 | 蒸着マスク、蒸着装置、蒸着方法及び有機el表示装置の製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018503979A Active JP6413045B2 (ja) | 2016-03-10 | 2016-07-22 | 蒸着方法及び有機el表示装置の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10892415B2 (ja) |
JP (2) | JP6413045B2 (ja) |
CN (1) | CN109072401B (ja) |
TW (1) | TWI621723B (ja) |
WO (1) | WO2017154234A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018185860A1 (ja) * | 2017-04-04 | 2018-10-11 | 堺ディスプレイプロダクト株式会社 | 蒸着装置、蒸着方法及び有機el表示装置の製造方法 |
WO2018189833A1 (ja) | 2017-04-12 | 2018-10-18 | 堺ディスプレイプロダクト株式会社 | 蒸着装置、蒸着方法及び有機el表示装置の製造方法 |
US11038154B2 (en) * | 2017-12-25 | 2021-06-15 | Sakai Display Products Corporation | Vapor-deposition mask, vapor-deposition method and method for manufacturing organic el display apparatus |
KR102489336B1 (ko) * | 2017-12-26 | 2023-01-19 | 삼성디스플레이 주식회사 | 증착 장치 및 이를 이용한 표시 장치의 제조 방법 |
CN111788326A (zh) * | 2018-03-05 | 2020-10-16 | 堺显示器制品株式会社 | 蒸镀掩膜、其制造方法以及有机el显示装置的制造方法 |
JP7223544B2 (ja) | 2018-10-12 | 2023-02-16 | 日産自動車株式会社 | 非水電解質二次電池用負極およびこれを用いた非水電解質二次電池 |
CN109680245A (zh) * | 2019-02-20 | 2019-04-26 | 湖畔光电科技(江苏)有限公司 | 一种新型蒸镀用金属掩模板及蒸镀装置 |
EP3715499A1 (en) * | 2019-03-29 | 2020-09-30 | Picosun Oy | Substrate coating |
JP7420496B2 (ja) * | 2019-07-05 | 2024-01-23 | キヤノントッキ株式会社 | マスク保持機構、蒸着装置、および電子デバイスの製造装置 |
CN111676444A (zh) * | 2020-06-03 | 2020-09-18 | 福建华佳彩有限公司 | 一种蒸镀掩膜板和oled器件 |
CN112981317B (zh) * | 2021-02-09 | 2022-10-25 | 京东方科技集团股份有限公司 | 一种蒸镀掩膜版、蒸镀装置及蒸镀方法 |
CN117941052A (zh) * | 2021-11-10 | 2024-04-26 | 夏普显示科技株式会社 | 蒸镀装置 |
JP2023110564A (ja) * | 2022-01-28 | 2023-08-09 | 国立大学法人東京工業大学 | パターン形成装置 |
CN115863126B (zh) * | 2022-12-06 | 2023-09-12 | 安徽其芒光电科技有限公司 | 真空蒸镀成膜装置的电源机构及消磁方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60186339A (ja) * | 1984-03-02 | 1985-09-21 | Fuji Jikou Kk | エレクトロパ−マネント式磁気チヤツクの脱磁用励磁方法 |
US4963921A (en) | 1985-06-24 | 1990-10-16 | Canon Kabushiki Kaisha | Device for holding a mask |
JPS61294442A (ja) * | 1985-06-24 | 1986-12-25 | Canon Inc | マスク保持装置 |
US4913928A (en) * | 1987-06-22 | 1990-04-03 | Canon Kabushiki Kaisha | Microwave plasma chemical vapor deposition apparatus with magnet on waveguide |
JP2502451B2 (ja) * | 1993-05-17 | 1996-05-29 | 株式会社オリイ | 電磁チャックの励磁電流制御回路 |
JPH08134627A (ja) * | 1994-11-14 | 1996-05-28 | Osaka Hightech Etsuchingu Service Kk | マスキング装置 |
JP3885261B2 (ja) * | 1996-11-21 | 2007-02-21 | 東レ株式会社 | 基板支持具および基板の支持方法 |
TW490714B (en) | 1999-12-27 | 2002-06-11 | Semiconductor Energy Lab | Film formation apparatus and method for forming a film |
JP2002220656A (ja) * | 2000-11-22 | 2002-08-09 | Sanyo Electric Co Ltd | 蒸着用マスクおよびその製造方法 |
KR100422487B1 (ko) * | 2001-12-10 | 2004-03-11 | 에이엔 에스 주식회사 | 전자석을 이용한 유기전계발광소자 제작용 증착장치 및그를 이용한 증착방법 |
JP4441282B2 (ja) | 2004-02-02 | 2010-03-31 | 富士フイルム株式会社 | 蒸着マスク及び有機el表示デバイスの製造方法 |
JP4545504B2 (ja) * | 2004-07-15 | 2010-09-15 | 株式会社半導体エネルギー研究所 | 膜形成方法、発光装置の作製方法 |
JP4773834B2 (ja) * | 2006-02-03 | 2011-09-14 | キヤノン株式会社 | マスク成膜方法およびマスク成膜装置 |
KR101229020B1 (ko) * | 2006-06-22 | 2013-02-01 | 엘지디스플레이 주식회사 | 쉐도우 마스크의 자성제거 방법 및 그 장치 |
JP4969932B2 (ja) * | 2006-07-18 | 2012-07-04 | 株式会社アルバック | アライメント装置及びアライメント方法 |
WO2009118888A1 (ja) * | 2008-03-28 | 2009-10-01 | キヤノンアネルバ株式会社 | 真空処理装置、当該真空処理装置を用いた画像表示装置の製造方法及び当該真空処理装置により製造される電子装置 |
JP2010209441A (ja) * | 2009-03-12 | 2010-09-24 | Seiko Epson Corp | 成膜用マスク、有機el装置の製造装置 |
JP2011195907A (ja) * | 2010-03-19 | 2011-10-06 | Tokyo Electron Ltd | マスク保持装置及び薄膜形成装置 |
US20130199445A1 (en) | 2010-10-19 | 2013-08-08 | Sharp Kabushiki Kaisha | Vapor deposition device, vapor deposition method, and method for producing organic electroluminescence display device |
JP5935179B2 (ja) * | 2011-12-13 | 2016-06-15 | 株式会社ブイ・テクノロジー | 蒸着マスク及び蒸着マスクの製造方法 |
JP2014088594A (ja) * | 2012-10-30 | 2014-05-15 | V Technology Co Ltd | 蒸着マスク |
KR102293507B1 (ko) * | 2014-12-08 | 2021-08-24 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 이를 제조하기 위한 박막 증착용 마스크 |
-
2016
- 2016-07-22 WO PCT/JP2016/071622 patent/WO2017154234A1/ja active Application Filing
- 2016-07-22 JP JP2018503979A patent/JP6413045B2/ja active Active
- 2016-07-22 CN CN201680083276.8A patent/CN109072401B/zh active Active
- 2016-07-22 US US16/083,856 patent/US10892415B2/en active Active
- 2016-07-29 TW TW105124040A patent/TWI621723B/zh active
-
2018
- 2018-07-30 JP JP2018142796A patent/JP6615286B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TW201732059A (zh) | 2017-09-16 |
JP2018193618A (ja) | 2018-12-06 |
US10892415B2 (en) | 2021-01-12 |
JPWO2017154234A1 (ja) | 2018-06-14 |
CN109072401B (zh) | 2021-05-11 |
WO2017154234A1 (ja) | 2017-09-14 |
JP6413045B2 (ja) | 2018-10-24 |
TWI621723B (zh) | 2018-04-21 |
US20190067580A1 (en) | 2019-02-28 |
CN109072401A (zh) | 2018-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6615286B2 (ja) | 蒸着マスク、蒸着装置、蒸着方法及び有機el表示装置の製造方法 | |
US10927443B2 (en) | Vapor deposition mask, method for manufacturing vapor deposition mask, vapor deposition method, and method for manufacturing organic el display device | |
JP6302150B1 (ja) | 蒸着装置、蒸着方法及び有機el表示装置の製造方法 | |
JP2003187973A (ja) | 電磁石を用いた有機電界発光素子製作用蒸着装置及びこれを用いた蒸着方法 | |
US10799993B2 (en) | Vapor deposition apparatus, vapor deposition method and method of manufacturing organic EL display apparatus | |
US10741765B2 (en) | Vapor deposition apparatus, vapor deposition method and method of manufacturing organic EL display apparatus | |
JP6738944B2 (ja) | 蒸着装置、蒸着方法及び有機el表示装置の製造方法 | |
JP6564088B2 (ja) | 蒸着装置、蒸着方法及び有機el表示装置の製造方法 | |
JP6548761B2 (ja) | 蒸着装置、蒸着方法及び有機el表示装置の製造方法 | |
JP6745833B2 (ja) | 蒸着装置、蒸着方法及び有機el表示装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180730 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190531 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190625 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190917 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191008 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191105 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6615286 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |