JP6608922B2 - 光パターン化可能な組成物、パターン化高k薄膜誘電体及び関連デバイス - Google Patents
光パターン化可能な組成物、パターン化高k薄膜誘電体及び関連デバイス Download PDFInfo
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- JP6608922B2 JP6608922B2 JP2017520761A JP2017520761A JP6608922B2 JP 6608922 B2 JP6608922 B2 JP 6608922B2 JP 2017520761 A JP2017520761 A JP 2017520761A JP 2017520761 A JP2017520761 A JP 2017520761A JP 6608922 B2 JP6608922 B2 JP 6608922B2
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- thin film
- vinylidene fluoride
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
- C08F214/22—Vinylidene fluoride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
- C08F214/22—Vinylidene fluoride
- C08F214/222—Vinylidene fluoride with fluorinated vinyl ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3432—Six-membered rings
- C08K5/3435—Piperidines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/45—Heterocyclic compounds having sulfur in the ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09D127/16—Homopolymers or copolymers of vinylidene fluoride
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0384—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the main chain of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/471—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/30—Organic light-emitting transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Thin Film Transistor (AREA)
- Materials For Photolithography (AREA)
- Electroluminescent Light Sources (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462017262P | 2014-06-26 | 2014-06-26 | |
| US62/017,262 | 2014-06-26 | ||
| EP14425084.2 | 2014-06-26 | ||
| EP14425084.2A EP2960280A1 (en) | 2014-06-26 | 2014-06-26 | Photocrosslinkable compositions, patterned high k thin film dielectrics and related devices |
| PCT/US2015/038146 WO2015200872A1 (en) | 2014-06-26 | 2015-06-26 | Photopatternable compositions, patterned high k thin film dielectrics and related devices |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017522613A JP2017522613A (ja) | 2017-08-10 |
| JP2017522613A5 JP2017522613A5 (OSRAM) | 2018-07-19 |
| JP6608922B2 true JP6608922B2 (ja) | 2019-11-20 |
Family
ID=51302686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017520761A Active JP6608922B2 (ja) | 2014-06-26 | 2015-06-26 | 光パターン化可能な組成物、パターン化高k薄膜誘電体及び関連デバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10409159B2 (OSRAM) |
| EP (2) | EP2960280A1 (OSRAM) |
| JP (1) | JP6608922B2 (OSRAM) |
| KR (1) | KR102283518B1 (OSRAM) |
| CN (1) | CN106663736B (OSRAM) |
| TW (1) | TWI668516B (OSRAM) |
| WO (1) | WO2015200872A1 (OSRAM) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6462876B2 (ja) * | 2015-07-09 | 2019-01-30 | 東京応化工業株式会社 | ケイ素含有樹脂組成物 |
| KR20190004326A (ko) * | 2016-05-03 | 2019-01-11 | 허니웰 인터내셔날 인코포레이티드 | 개선된 내화학성을 갖는 발광기 디바이스 및 구성요소 및 관련 방법 |
| TW201840025A (zh) * | 2016-12-19 | 2018-11-01 | 美商康寧公司 | 具有極性彈性體介電質的有機場效電晶體 |
| TW201830746A (zh) | 2016-12-19 | 2018-08-16 | 美商康寧公司 | 極性彈性體微結構及其製造方法 |
| FR3065217B1 (fr) * | 2017-04-14 | 2020-02-28 | Arkema France | Compositions reticulables a base de copolymeres fluores electroactifs |
| FR3068976B1 (fr) * | 2017-07-17 | 2020-05-29 | Arkema France | Fabrication de films par reticulation de polymeres fluores electroactifs |
| FR3069544B1 (fr) * | 2017-07-28 | 2020-05-15 | Arkema France | Procede de preparation d'un film de polymere fluore reticule |
| KR20200038272A (ko) * | 2017-07-31 | 2020-04-10 | 코닝 인코포레이티드 | 유기 염기의 첨가를 통한 pvdf-hfp의 가속화된 열적 가교결합 및 otft 장치용 게이트 유전체 물질로서 가교결합된 pvdf-hfp의 사용 |
| FR3070041B1 (fr) | 2017-08-09 | 2019-08-30 | Arkema France | Formulations a base de fluoropolymeres electroactifs et leurs applications |
| FR3070042B1 (fr) | 2017-08-09 | 2020-08-21 | Arkema France | Transistor organique a effet de champ contenant une couche dielectrique a haute permittivite dielectrique et stable en temperature |
| GB2566972A (en) * | 2017-09-29 | 2019-04-03 | Flexenable Ltd | Patterning semiconductor for TFT device |
| WO2019170481A1 (en) * | 2018-03-07 | 2019-09-12 | Basf Se | Patterning method for preparing top-gate, bottom-contact organic field effect transistors |
| CN108493229A (zh) * | 2018-05-31 | 2018-09-04 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
| US20200013991A1 (en) * | 2018-07-06 | 2020-01-09 | University Of Maryland, College Park | Electrically-driven organic color-center-based single-photon sources and sensors |
| CN110838546A (zh) * | 2018-08-17 | 2020-02-25 | 康宁股份有限公司 | 用于有机薄膜晶体管的栅极电介质绝缘体的基于pvdf的聚合物的uv交联 |
| FR3086666B1 (fr) * | 2018-10-02 | 2021-06-25 | Arkema France | Encre de polymere fluore a vehicule cetonique et a comportement rheologique de fluide a seuil de contrainte |
| FR3089977B1 (fr) | 2018-12-17 | 2021-09-10 | Arkema France | Polymères fluorés électroactifs réticulables comprenant des groupements photoactifs |
| FR3089978B1 (fr) | 2018-12-17 | 2021-09-10 | Arkema France | Polymères fluorés électroactifs réticulables comprenant des groupements photoactifs |
| CN109698276A (zh) * | 2018-12-27 | 2019-04-30 | 广州天极电子科技有限公司 | 一种薄膜晶体管器件及其制备方法 |
| KR102839408B1 (ko) | 2019-01-17 | 2025-07-28 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| JP7628510B2 (ja) * | 2020-01-30 | 2025-02-10 | 株式会社ダイセル | 成形体ならびにその前駆体、製造方法および用途 |
| WO2021162680A1 (en) | 2020-02-11 | 2021-08-19 | Hewlett-Packard Development Company, L.P. | Dual plate olet displays |
| CN113314532B (zh) * | 2020-02-27 | 2022-11-04 | 长鑫存储技术有限公司 | 半导体结构及其形成方法 |
| CN111736428B (zh) * | 2020-04-24 | 2021-09-21 | 康宁股份有限公司 | 用于有机薄膜晶体管的可光图案化的有机半导体(osc)聚合物 |
| JP7498290B2 (ja) * | 2020-06-30 | 2024-06-11 | ノボキュア ゲーエムベーハー | 腫瘍治療電場(ttフィールド)を印加するためのポリマー絶縁層を備えるフレキシブルトランスデューサアレイ |
| US12344571B1 (en) | 2020-07-01 | 2025-07-01 | University Of Maryland, College Park | Organic color center-tailored, semiconducting carbon nanotubes and their method of manufacture |
| TWI753662B (zh) * | 2020-11-19 | 2022-01-21 | 國立成功大學 | 自含多重邏輯閘功能之有機薄膜電晶體及其製造方法 |
| KR102788810B1 (ko) * | 2021-09-17 | 2025-03-28 | 코오롱인더스트리 주식회사 | 봉지재 조성물 및 발광 소자 |
| US20240224770A1 (en) * | 2021-12-03 | 2024-07-04 | Seoul National University R&Db Foundation | Metal electrode patterning method using pattern formation control material and substrate, electronic device and display having metal electrode pattern |
| KR102740028B1 (ko) * | 2021-12-03 | 2024-12-06 | 서울대학교산학협력단 | 패턴 형성 제어 물질을 활용한 메탈 전극 패터닝 방법 및 메탈 전극 패턴을 갖는 기판, 전자 장치 및 디스플레이 |
| KR20250008261A (ko) * | 2023-07-07 | 2025-01-14 | 서울대학교산학협력단 | 금속 증착 제어 물질을 이용한 3차원 금속 전극 패터닝 방법과 이에 의해 제조된 3차원 금속 전극 패턴을 갖는 기판 |
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-
2014
- 2014-06-26 EP EP14425084.2A patent/EP2960280A1/en not_active Withdrawn
-
2015
- 2015-06-26 TW TW104120788A patent/TWI668516B/zh active
- 2015-06-26 WO PCT/US2015/038146 patent/WO2015200872A1/en not_active Ceased
- 2015-06-26 KR KR1020177001963A patent/KR102283518B1/ko active Active
- 2015-06-26 EP EP15744749.1A patent/EP3161061B1/en active Active
- 2015-06-26 CN CN201580042359.8A patent/CN106663736B/zh active Active
- 2015-06-26 JP JP2017520761A patent/JP6608922B2/ja active Active
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|---|---|
| KR102283518B1 (ko) | 2021-07-28 |
| TW201606436A (zh) | 2016-02-16 |
| TWI668516B (zh) | 2019-08-11 |
| EP3161061B1 (en) | 2020-11-18 |
| CN106663736B (zh) | 2020-01-17 |
| JP2017522613A (ja) | 2017-08-10 |
| US10409159B2 (en) | 2019-09-10 |
| US20170192354A1 (en) | 2017-07-06 |
| EP2960280A1 (en) | 2015-12-30 |
| EP3161061A1 (en) | 2017-05-03 |
| CN106663736A (zh) | 2017-05-10 |
| KR20170024007A (ko) | 2017-03-06 |
| WO2015200872A1 (en) | 2015-12-30 |
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