JP6600706B2 - 可撓性のあるワークピースのためのサポート - Google Patents
可撓性のあるワークピースのためのサポート Download PDFInfo
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- JP6600706B2 JP6600706B2 JP2018029458A JP2018029458A JP6600706B2 JP 6600706 B2 JP6600706 B2 JP 6600706B2 JP 2018029458 A JP2018029458 A JP 2018029458A JP 2018029458 A JP2018029458 A JP 2018029458A JP 6600706 B2 JP6600706 B2 JP 6600706B2
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- support member
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- clamping
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Description
平面状のクランピング領域を有する実質的に平面状のサポート表面であって、使用時に、減圧又は真空によってワークピースがクランピング領域に固定可能である、サポート表面と、
サポート部材内に形成された内部空洞と、
低圧源又は真空源への接続のためのポートであって、内部空洞と流体接続(内部空洞との間で流体の通過を可能にするような接続)するポートと、
内部空洞と流体接続するようにサポート表面に形成された凹所であって、前記凹所が、サポート表面に沿って横に延在し、凹所が、クランピング領域の周縁の近くに位置する外側領域と、クランピング領域の中央部分の中に位置する内側領域と、を有するようになっており、内側領域及び外側領域が、サポート表面の平面に平行するそれぞれの幅w1,w2を有する、凹所と、
を備えており、
凹所の外側領域の幅(w2)は内側領域の幅(w1)よりも狭く、使用時に、ポートが低圧源又は真空源に流体接続されると、クランピング領域の周縁における圧力がクランピング領域内の中央部分における圧力よりも低くなるようになっている。
2 内部空洞
3 本体
4 ポート
5 サポート部材
7 サポート表面
8 裏面
9 チャンバ
15 主本体部材
16 内部側壁
17 内部側壁
19 ベース部材
21 真空ポート
25 クランピング領域
25a クランピング領域
25b クランピング領域
30 凹所
31 内側領域
33 外側領域
34 貫通孔
41 マニホールド
42 ガスケット
43 隙間
44 保護シールド層
45 第1の接合層
46 層
47 第2の接合層
48 基板
Claims (21)
- 可撓性のあるワークピースを支持するためのサポート部材であって、前記サポート部材が、
平面状のクランピング領域を有する実質的に平面状のサポート表面であって、使用時に、減圧又は真空によってワークピースが前記クランピング領域に固定可能である、サポート表面と、
前記サポート部材内に形成された内部空洞と、
低圧源又は真空源への接続のためのポートであって、前記内部空洞と流体接続するポートと、
前記内部空洞と流体接続するように前記サポート表面に形成された凹所であって、前記凹所が、前記サポート表面に沿って横に延在し、前記凹所が、前記クランピング領域の周縁の近くに位置する外側領域と、前記クランピング領域の中央部分の中に位置する内側領域と、を有するようになっており、前記内側領域及び前記外側領域が、前記サポート表面の平面に平行するそれぞれ幅w1,w2を有する、凹所と、
を備えており、
前記凹所の前記外側領域の前記幅(w2)は前記内側領域の前記幅(w1)よりも狭く、使用時に、前記ポートが低圧源又は真空源に流体接続されると、前記クランピング領域の前記周縁における圧力が前記クランピング領域内の前記中央部分における圧力よりも低くなるようになっており、
前記凹所の前記外側領域が閉じられており、前記外側領域が、前記サポート表面の前記平面に対して直交する方向に、前記内部空洞まで延在しないようになっている、サポート部材。 - 前記サポート部材が、前記内部空洞と流体接続するように前記サポート表面に形成された複数の凹所を備え、各凹所が、前記サポート表面に沿って横に延在し、各凹所が、前記クランピング領域の周縁の近くに位置するそれぞれの外側領域と、前記クランピング領域の中央部分の中に位置する内側領域と、を有するようになっており、前記内側領域及び前記外側領域が、前記サポート表面の前記平面に平行するそれぞれの幅を有し、各凹所の前記外側領域の前記幅は、それぞれの前記内側領域の前記幅よりも狭い、請求項1に記載のサポート部材。
- 前記サポート部材が、同一平面上にある複数のクランピング領域を備え、使用時に、1つ又は複数のワークピースが前記クランピング領域に固定可能であり、各クランピング領域が、前記サポート表面に沿って横に延在する少なくとも1つの凹所を含み、前記凹所又は各凹所が、それぞれの前記クランピング領域の周縁の近くに位置する外側領域と、それぞれの前記クランピング領域の中央部分の中に位置する内側領域と、を有するようになっており、前記内側領域及び前記外側領域は、前記サポート表面の前記平面に平行するそれぞれの幅を有し、それぞれの前記凹所の前記外側領域の前記幅は、それぞれの凹所の前記内側領域の前記幅よりも狭い、請求項1又は2に記載のサポート部材。
- 前記凹所又は各凹所のそれぞれの内側領域が貫通孔を備え、前記貫通孔が、前記サポート表面の前記平面に対して直交する方向に、前記サポート部材を貫通して前記内部空洞まで延在する、請求項1から3の何れか一項に記載のサポート部材。
- 前記凹所が、第1の外側領域及び第2の外側領域を備え、前記第1の外側領域及び第2の外側領域が、前記内側領域の相対する遠位端に位置する、請求項1から4の何れか一項に記載のサポート部材。
- 前記第1の外側領域及び前記第2の外側領域が、前記クランピング領域の前記周縁の相対する縁の近くに位置する、請求項5に記載のサポート部材。
- 前記凹所が、細長いチャンネルを備える、請求項5又は6に記載のサポート部材。
- 前記細長いチャンネルが、細長い線形のチャンネルを備える、請求項7に記載のサポート部材。
- 前記細長い線形のチャンネルが、もう1つの細長い線形のチャンネルに対して間隔をあけて平行に配設されている、請求項8に記載のサポート部材。
- 前記内側領域の前記幅(w1)が、2mmから5mmまでの間である、請求項1から9の何れか一項に記載のサポート部材。
- 前記外側領域の前記幅(w2)が、前記サポート表面において0.5mmから1mmまでの間である、請求項1から10の何れか一項に記載のサポート部材。
- 前記外側領域が、0.25mm2から2mm2までの間、随意に0.5mm2から1.5mm2までの間の断面積を有する、請求項1から11の何れか一項に記載のサポート部材。
- 各クランピング領域が、前記凹所又は各凹所の前記外側領域を平行に流体接続する少なくとも1つのマニホールドをさらに備える、請求項3から12の何れか一項に記載のサポート部材。
- 各クランピング領域が、環状のマニホールドを備える、請求項13に記載のサポート部材。
- 前記クランピング領域を取り囲む弾性変形可能なガスケットを備える、請求項1から14の何れか一項に記載のサポート部材。
- 請求項1から15の何れか一項に記載のサポート部材を備える、可撓性のあるワークピースを支持するためのツーリングサポート。
- 前記ツーリングサポートが本体を備え、前記サポート部材が、前記本体に取り付けられ、又は前記本体と一体的に形成され、前記本体が、前記サポート部材の前記内部空洞に流体接続されるチャンバを含む、請求項16に記載のツーリングサポート。
- 前記本体及び前記サポート部材が、別々の部品として形成される、請求項17に記載のツーリングサポート。
- 前記本体が、前記チャンバを部分的に画定する内部側壁を有する主本体部材と、前記主本体部材に結合されると共にポートを含むベース部材であって、前記ポートが前記チャンバに流体接続され、使用の間、低圧源又は真空源が前記ポートに選択的に適用される、ベース部材と、を備える、請求項17又は18に記載のツーリングサポート。
- 前記ワークピースが、可撓性のある電子基板である、請求項1から15の何れか一項に記載のサポート部材、又は、請求項16から19の何れか一項に記載のツーリングサポート。
- 前記ワークピースが、可撓性のあるストリップを備える、請求項1から15の何れか一項に記載のサポート部材、又は、請求項16から20の何れか一項に記載のツーリングサポート。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1702916.6A GB2559985A (en) | 2017-02-23 | 2017-02-23 | Support for flexible workpieces |
GB1702916.6 | 2017-02-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018137445A JP2018137445A (ja) | 2018-08-30 |
JP6600706B2 true JP6600706B2 (ja) | 2019-10-30 |
Family
ID=58544090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018029458A Active JP6600706B2 (ja) | 2017-02-23 | 2018-02-22 | 可撓性のあるワークピースのためのサポート |
Country Status (8)
Country | Link |
---|---|
US (1) | US11311982B2 (ja) |
EP (1) | EP3366423B1 (ja) |
JP (1) | JP6600706B2 (ja) |
KR (1) | KR102082637B1 (ja) |
CN (1) | CN108471704B (ja) |
GB (1) | GB2559985A (ja) |
MY (1) | MY188601A (ja) |
TW (1) | TWI637461B (ja) |
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CN115052749B (zh) * | 2020-01-22 | 2023-09-22 | 博斯特比勒费尔德有限公司 | 刮墨刀系统 |
CN112091684B (zh) * | 2020-09-09 | 2023-08-08 | 厦门奥拓美科技有限公司 | 自贴合曲面定位柔性夹具 |
CN114406929A (zh) * | 2022-02-08 | 2022-04-29 | 苏州佳祺仕信息科技有限公司 | 一种定位吸附装置 |
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ITPD20130092A1 (it) * | 2013-04-10 | 2014-10-11 | Promac Srl | Centro di lavorazione con supporto verticale per pezzi lunghi e flessibili |
DE102015113956B4 (de) * | 2015-08-24 | 2024-03-07 | Meyer Burger (Germany) Gmbh | Substratträger |
CA3156178C (en) | 2015-09-08 | 2023-10-31 | Berkshire Grey Operating Company, Inc. | Systems and methods for providing dynamic vacuum pressure in an articulated arm end effector |
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2017
- 2017-02-23 GB GB1702916.6A patent/GB2559985A/en not_active Withdrawn
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2018
- 2018-01-18 US US15/874,258 patent/US11311982B2/en active Active
- 2018-01-23 TW TW107102267A patent/TWI637461B/zh active
- 2018-01-23 MY MYPI2018000091A patent/MY188601A/en unknown
- 2018-02-13 CN CN201810148216.0A patent/CN108471704B/zh active Active
- 2018-02-20 KR KR1020180019846A patent/KR102082637B1/ko active IP Right Grant
- 2018-02-21 EP EP18000174.5A patent/EP3366423B1/en active Active
- 2018-02-22 JP JP2018029458A patent/JP6600706B2/ja active Active
Also Published As
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TWI637461B (zh) | 2018-10-01 |
KR20180097457A (ko) | 2018-08-31 |
GB2559985A (en) | 2018-08-29 |
GB201702916D0 (en) | 2017-04-12 |
CN108471704B (zh) | 2020-04-07 |
KR102082637B1 (ko) | 2020-02-28 |
TW201832316A (zh) | 2018-09-01 |
US20180236639A1 (en) | 2018-08-23 |
JP2018137445A (ja) | 2018-08-30 |
EP3366423B1 (en) | 2020-10-07 |
CN108471704A (zh) | 2018-08-31 |
US11311982B2 (en) | 2022-04-26 |
EP3366423A1 (en) | 2018-08-29 |
MY188601A (en) | 2021-12-22 |
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