CN108471704B - 柔性工件的支撑件 - Google Patents

柔性工件的支撑件 Download PDF

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CN108471704B
CN108471704B CN201810148216.0A CN201810148216A CN108471704B CN 108471704 B CN108471704 B CN 108471704B CN 201810148216 A CN201810148216 A CN 201810148216A CN 108471704 B CN108471704 B CN 108471704B
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CN108471704A (zh
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肖特·尼尔
阿什·培迪
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ASMPT SMT Singapore Pte Ltd
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ASM Assembly Systems Singapore Pte Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06Work-clamping means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005Vacuum work holders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06Work-clamping means
    • B23Q3/08Work-clamping means other than mechanically-actuated
    • B23Q3/088Work-clamping means other than mechanically-actuated using vacuum means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/34Screens, Frames; Holders therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本发明提供一种用于支撑柔性工件的支撑件。通过成形空气导管并使其在边缘区域中变窄,以在靠近边缘的地方形成压力减少的区域,从而提高柔性工件的边缘夹紧到支撑表面上的效果。

Description

柔性工件的支撑件
技术领域
本发明涉及一种用于柔性工件的支撑件和工具支撑装置,具体涉及一种用于诸如柔性条的柔性电子元件基板的支撑件和工具支撑装置。
背景技术
众所周知,真空夹紧工艺用于诸如电子元件基板的工件。所述夹紧工艺能够在防止工件运动的同时在所述工件上进行诸如丝网印刷的操作。
虽然这种标准工具适用于刚性工件,但是,人们发现,它不适合支撑柔性工件。具体地,所述标准工具可能不能完全夹紧柔性工件的边缘,从而使所述边缘突出于支撑面。然而,针对上述问题,仅给这种工具轻微加压或者施压较大的真空力不是优选的方案,因为这样会使成本增加、效率降低。
本发明的目的就是为了解决上述问题。
发明内容
本发明通过提供一种支撑件来实现上述目的。根据所述支撑件的结构,在靠近夹紧部位的边缘的区域中产生一个增强的低压区域,这样,所述低压被施加到工件的边缘,从而使所述边缘被夹得更紧。同时,保持所述工件的中心剩余部分的压力更高、更标准。
根据本发明的一个方面,提供了一种用于支撑柔性工件的支撑件,所述支撑件包括:
具有平面夹紧部位的基本上平坦的支撑表面,在使用中,通过减压或真空,能够将工件固定到所述平面夹紧部位;
在所述支撑件内形成的内腔;
用于连接到低压源或真空源的端口,所述端口与所述内腔流体连接;
在所述支撑表面中形成的与所述内腔流体连接的凹槽,所述凹槽沿着所述支撑表面横向延伸,使得所述凹槽具有位于所述夹紧部位的周边附近的外部区域和位于所述夹紧部位中心部分内的内部区域,所述内部区域和所述外部区域的宽度分别为w1和w2,并且平行于所述支撑表面的平面,其中,
所述凹槽的外部区域的宽度w2比所述内部区域的宽度w1窄,从而在使用中,当所述端口流体连接至低压源或真空源时,所述夹紧部位周边的压力小于其中心部分的压力。
通过本发明提供的这种结构,有利地改善了柔性基板的平面度,特别是其边缘区域的平面度。
根据本发明的第二方面,提供了一种用于支撑柔性工件的工具支撑装置,所述工具支撑装置包括根据第一方面的支撑件。
在所附的从属权利要求中列出了本发明的各种优选特征。
附图说明
将参照附图描述本发明的优选实施例,其中:
图1示出了根据本发明的第一实施例的工具支撑装置的透视图。
图2示出了图1所示的工具支撑装置的侧视图。
图3示出了图1所示的工具支撑装置的平面图。
图4示出了图1所示的工具支撑装置的仰视图。
图5示出了图1所示的工具支撑装置的纵向截面图(沿着图3中的截面I-I)。
图6示出了图5所示的工具支撑装置的一端的视图。
图7示出了图5所示的工具支撑装置的另一端的视图。
图8示意性地示出了根据本发明的第二实施例的工具支撑装置的平面图。
图9示意性地示出了图8所示的沿着线A-A截取的工具支撑装置的立体的截面示图。
图10示意性地示出了图8所示的工具支撑装置上设置的放大的垫圈的截面示图。
图11示意性地示出了类似于图10所示的视图,在图中,工件被支撑着。
具体实施方式
图1至图7示出了根据本发明的第一实施例的用于支撑柔性工件,特别是柔性电子元件基板(诸如柔性条)的工具支撑装置1的透视图。柔性条的柔性的变化范围可能很广,其可以从非常柔软不能自撑到近乎刚性。但是,当施加力后,柔性条却易于弯曲。
工具支撑装置1包括本体3和支撑件5,其中,在本实施例中,所述本体为细长形。支撑件5的形式为块,其包括基本上平坦的第一支撑表面7、支撑表面7的下侧8(参见图4和图5)以及支撑件5内形成的在下侧8的下方的内腔2。在本实施例中,所述第一支撑表面为上表面;使用中,通过施加真空或减压,将至少一个工件WP夹紧在所述上表面上。所述支撑件5的下表面包括与内腔2流体连接的端口4。
如本领域人员所理解的那样,例如,支撑件5的适用材料为铝(Al)。在该实施例中,本体3和支撑件5为分离的部件,但是,它们也可以一体成型。
在该实施例中,本体3包括腔室9,其为细长形的腔室,并且流体连接到支撑件5的内腔2。
在该实施例中,本体3包括中空主体构件15,该中空主体构件15具有至少部分敞开的上表面和下表面,其内侧壁(16,17)部分地限定了腔室9,还包括耦合连接到主体构件15的基座构件19,所述基座构件19具有流体连接到腔室9的端口21,并且在使用期间,低压源或真空源被选择性地施加到所述基座构件。
支撑件5包括与支撑表面7共平面的至少一个夹紧部位-(25a,25b)。在该实施例中,提供了两个夹紧部位(25a,25b)。使用中,将一个或多个工件W夹紧到所述夹紧部位用于进行诸如丝网印刷操作的处理。如上所述,在定位公差内,可以预定义夹紧部位使其与待支撑的工件的面积基本相符。在可选实施例中,可以提供更多或更少的夹紧部位。在可选实施例中,可以以各种方式布置夹紧部位。例如,如果提供四个夹紧部位,则这些夹紧部位可以线性排列成4×1的阵列,或者可能排列成2×2的阵列。夹紧部位的尺寸或形状不需要全部相同,例如四个夹紧部位可以布置成第一3×1阵列和相邻的尺寸较大的第二1×1阵列。相邻夹紧部位之间的空间最小间距由工件放置到支撑表面上的适用公差以及随后的拾取确定。而尽可能地缩短最大间距可以最大化所支撑的工件的数量。
在该实施例中,通常,每个夹紧部位(25a,25b)为矩形,但在其它实施例中,所述夹紧部位可以是其他形状。
在该实施例中,每个夹紧部位(25a,25b)包括多个细长形的线性通道形式的凹槽30,其沿平行于支撑表面7的平面横向延伸。每个凹槽30具有内部区域31。该内部区域具有第一宽度(即在支撑表面的平面内)w1,相对于内部区域31分别位于远端的第一外部区域33和第二外部区域33,并且第一外部区域33和第二外部区域33流体地连接内部区域31。外部区域33具有比第一宽度w1较窄的第二宽度w2。内部区域31位于相应的夹紧部位(25a,25b)内的中心部分处,而仍位于夹紧部位内的外部区域33位于夹紧部位的周边的相对边缘的附近,使得在使用中,工件的外边缘区域可以基本上覆盖外部区域33。
通过这种结构,中心部分内的内部区域31限定出了使用中被施加第一真空/压力的内部区域,而外部区域33限定出了被施加比第一真空程度更大的真空或者比第一压力更小的压力的外部周边区域。所述外部周边区域有助于使一个或多个工件WP被夹紧在支撑表面7上以进行处理,从而有助于提高所述一个或多个工件WP的平面性。通过提供多个分开的外部区域33,施加在该外部周边区域处的压力/真空变得相当均匀,有助于进一步提高所述一个或多个工件WP的平面性。
在该实施例中,所述凹槽彼此间隔开,并且相互平行。
在该实施例中,每个凹槽30的内部区域31包括通孔34。通孔34在与支撑表面7的平面正交的方向上延伸穿过支撑件5到达内腔2。可以从图3中清楚地看到上述过程,其中,穿过凹槽的内部区域31可以看见端口21。内部区域31的上部开口面积和下部开口面积基本相同。
在该实施例中,凹槽30的相应的外部区域是闭合的。因此,所述外部区域不能在与支撑表面7的平面正交的方向上延伸到内腔2。可以从图5中清楚地看到上述过程,其中,可以看到外部区域33在其最低点处闭合,而内部区域31是敞开的。
在该实施例中,内部区域31的宽度w1约为2-5毫米。
在该实施例中,在支撑表面7处,外部区域33的宽度w2约为0.5毫米-1毫米。
在该实施例中,所述/每个外部区域的横截面面积约为0.25-2平方毫米,可选地,为0.5-1.5平方毫米。
在该实施例中,每个夹紧部位(25a,25b)还包括至少一个歧管41。此处,所述歧管为大致矩形(尽管具有圆角)的环形歧管,其平行地流体连接外部区域33。歧管41的形式为在支撑表面7中形成的底部闭合的通道,所述通道位于相应的夹紧部位内并且靠近相应的夹紧部位的周边。
图8到图11示意性地示出了本发明的另一个实施例。该实施例具有前述实施例的多个特征。如果可能,保留附图标记。在该实施例中,围绕每个夹紧部位设置可弹性形变的垫圈42,其位于支撑表面7中形成的底部闭合的通道中。垫圈42提供压力缓冲,使得使用中,垫圈内部的区域的压力低于其周围区域的压力。通常,周围区域的压力为大气压力。应该注意的是,在该实施例中,没有提供歧管功能。在图8-11所示的实施例中,使用了其他形式的通道,其包括接近通道顶部的扩口式间隙43,这在图10和图11所示的放大的截面示图中显示得最清楚。例如,垫圈42宽度可以约为1-3毫米,高度可以约为1-4毫米。图10示意性地示出了处于工具支撑装置未使用位置处的工具支撑装置上设置的垫圈42的截面示图,即,当所述工具支撑装置上没有支撑的基板或工件时。垫圈42为分层结构。使用中,接触基板或工件的下侧的上表面是保护性屏蔽层44,用于在使用期间保护垫圈免受损坏。例如,适用于层44的材料包括橡胶或聚氨酯,层厚度约为200微米至约为4毫米。优选地,该层44是非粘性的,以降低垫圈粘附到基板48上的风险,从而避免在移除基板时损坏垫圈。在可选实施例中,如果需要,例如,当施加的真空本身不足以安全地约束工件,层44可以设置为粘性的以提供更强的粘附性。所述层44通过具有合适的粘合剂的第一粘合层45粘合到形成垫圈42的主体的可弹性形变层46。在该实施例中,层46由闭孔硅泡沫形成。所述层46的合适厚度为约0.5-3.5毫米。层46还通过具有合适的粘合剂的第二粘合层47粘合到通道的底部。如本领域技术人员所理解的那样,各种市售粘合剂可以用于层45和层47。图11示出了与图10类似的视图。但是,在工具支撑装置被使用的情况下,基板48被保持到支撑表面7的上表面。可以看出,垫圈42的压缩层46被压扁并且凸出到间隙43中。从而,垫圈42能够与基板48贴合以形成紧密的界面,使空气基本上不能从它们中间通过。
在其他实施例(未示出)中,不使用用于垫圈42的定制通道。所述垫圈可以方便地位于如第一实施例描述的(例如参见图3)底部封闭的通道内,其中,所述通道限定出了歧管41。
在另外的实施例(未示出)中,可以保留与第一实施例描述的类似的歧管结构,并且围绕歧管的外周边增设通道和垫圈。
在另外的实施例(未示出)中,可以用单个垫圈围绕多个夹紧部位。
在任何情况下,根据具体应用,选择和设置垫圈。
最后,可以理解的是,虽然在优选实施例中已经对本发明进行了描述,但是在不偏离权利要求限定的本发明的范围的情况下,可以用多种不同的方式修改本发明。对于本领域技术人员而言,本发明范围内的其他可行性方案和替代性方案是显而易见的。特别地,应当理解的是,在本发明的范围内,可根据待支撑的工件的特定形式构造所述支撑件/工具支撑装置,包括其尺寸、形状和柔性。例如,虽然图1-9所示的凹槽沿着内部区域和外部区域的宽度基本不变,但是,该宽度可以发生变化。具体地,所述凹槽可以为平行四边形或菱形,其中间部分比端部更宽;或者实际上,所述凹槽可以是诸如椭圆形或环形(mandorla)等的任何形状。因此,内部区域各个位置处的宽度大于外部区域的宽度。此外,所述凹槽不需要与夹紧部位的边缘轴向对齐,其可以与夹紧部位成一定角度。在后一种情况下,相邻凹槽的长度可以不同。在另外的可选实施例中,凹槽没必要是线性的,也可以是弯曲的、弧形的或具有一定角度的部分。此外,虽然间距相等的凹槽是有利的,但是在一些应用中,可以使用间距不等的凹槽。在又一实施例中,多个相对较窄的外部区域可从宽度(即直径)较大的共同内部区域向外延伸或辐射。
尽管上述实施例中包括位于相应夹紧部位内并且靠近相应的夹紧部位的周边的环形歧管,而且所述歧管有助于均衡围绕夹紧部位周边的压力。但是,这种歧管并不是必需的,在可选实施例中可以省略歧管。
在可选实施例中,真空端口21不需要位于本体3的基座构件19处。例如,其也可以位于主体构件15的侧面。
垫圈42可采取各种形式。例如,可由橡胶或聚氨酯制成整个垫圈。

Claims (21)

1.一种用于支撑柔性工件的支撑件,其特征在于,所述支撑件包括:
具有夹紧部位的基本上平坦的支撑表面,该夹紧部位是平面的,在使用中,通过减压或真空,能够将工件固定到所述夹紧部位;
在所述支撑件内形成的内腔;
用于连接到低压源或真空源的端口,所述端口与所述内腔流体连接;
在所述支撑表面中形成的与所述内腔流体连接的凹槽,所述凹槽沿着所述支撑表面横向延伸,使得所述凹槽具有位于所述夹紧部位的周边附近的外部区域和位于所述夹紧部位中心部分内的内部区域,所述内部区域和所述外部区域的宽度分别为 w1和 w2,并且平行于所述支撑表面的平面,其中,
所述凹槽的外部区域的宽度w2比所述内部区域的宽度w1窄,从而在使用中,当所述端口流体连接至低压源或真空源时,所述夹紧部位周边的压力小于其中心部分的压力。
所述凹槽的外部区域是闭合的,使得所述外部区域不能在与所述支撑表面的平面正交的方向上延伸到所述内腔。
2.根据权利要求1所述的支撑件,其特征在于,包括:在所述支撑表面中形成的与所述内腔流体连接的多个凹槽,其中,每个凹槽沿着所述支撑表面横向延伸,使得每个凹槽具有位于所述夹紧部位的周边附近的相应外部区域和位于所述夹紧部位中心部分内的内部区域;所述内部区域和所述外部区域的分别具有平行于所述支撑表面的平面的宽度,其中,每个凹槽的外部区域的宽度比相应的内部区域的宽度窄。
3.根据权利要求1所述的支撑件,其特征在于,包括:多个夹紧部位,所述多个夹紧部位是共平面的,其中,使用中,一个或多个工件能够固定到所述多个夹紧部位;每个夹紧部位包括沿所述支撑表面横向延伸的至少一个凹槽,使得所述每个凹槽具有位于所述相应夹紧部位的周边附近的外部区域和位于所述相应夹紧部位中心部分内的内部区域;所述内部区域和所述外部区域分别具有平行于所述支撑表面的平面的宽度;各个凹槽的外部区域的宽度比相应的内部区域的宽度窄。
4.根据权利要求1所述的支撑件,其特征在于,所述每个凹槽的相应的内部区域包括通孔;所述通孔在与所述支撑表面的平面正交的方向上延伸穿过所述支撑件到达所述内腔。
5.根据权利要求1所述的支撑件,其特征在于,所述凹槽包括第一外部区域和第二外部区域,其中,所述第一外部区域和所述第二外部区域位于所述内部区域的相对远端处。
6.根据权利要求5所述的支撑件,其特征在于,所述第一外部区域和所述第二外部区域位于所述夹紧部位的周边的相对边缘附近。
7.根据权利要求5或6所述的支撑件,其特征在于,所述凹槽包括细长形的通道。
8.根据权利要求7所述的支撑件,其特征在于,所述细长形的通道包括细长形线性通道。
9.根据权利要求8所述的支撑件,其特征在于,所述细长形线性通道与另一细长形线性通道间隔开、并且平行。
10.根据权利要求1所述的支撑件,其特征在于,所述内部区域的宽度w1为2-5毫米。
11.根据权利要求1所述的支撑件,其特征在于,在所述支撑表面处,所述外部区域的宽度w2为0.5-1毫米。
12.根据权利要求1所述的支撑件,其特征在于,所述外部区域的横截面面积为0.25-2平方毫米。
13.根据权利要求12所述的支撑件,其特征在于,所述外部区域的横截面面积为0.5-1.5平方毫米。
14.根据权利要求3所述的支撑件,其特征在于,每个夹紧部位还包括至少一个歧管,所述至少一个歧管平行地流体连接所述每个凹槽的外部区域。
15.根据权利要求14所述的支撑件,其特征在于,每个夹紧部位包括环形歧管。
16.根据权利要求1所述的支撑件,其特征在于,包括:围绕所述夹紧部位的可弹性形变的垫圈。
17.一种用于支撑柔性工件的工具支撑装置,其特征在于,包括如权利要求1所述的支撑件。
18.根据权利要求17所述的工具支撑装置,其特征在于,包括:本体,其中,所述支撑件附接至所述本体或与所述本体一体成型;所述本体包括流体连接至所述支撑件的内腔的腔室。
19.根据权利要求18所述的工具支撑装置,其特征在于,所述本体和所述支撑件为分离的部件。
20.根据权利要求18或19所述的工具支撑装置,其特征在于,所述本体包括具有内壁的主体构件和耦合到所述主体构件的基座构件,所述内壁部分地限定了所述腔室,所述基座构件包括流体连接到所述腔室的端口,并且在使用期间,低压源或真空源被选择性地施加到所述基座构件。
21.根据权利要求1所述的支撑件或根据权利要求17所述的工具支撑装置,其特征在于,所述工件包括柔性电子元件基板或柔性条。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112022013038A2 (pt) * 2020-01-22 2022-09-06 Bobst Bielefeld Gmbh Sistema de lâmina de raspar
CN112091684B (zh) * 2020-09-09 2023-08-08 厦门奥拓美科技有限公司 自贴合曲面定位柔性夹具
CN114406929A (zh) * 2022-02-08 2022-04-29 苏州佳祺仕信息科技有限公司 一种定位吸附装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3413903A (en) * 1966-01-24 1968-12-03 Hycon Mfg Co High speed platen
JPS6161131U (zh) * 1984-09-26 1986-04-24
JPH0584682A (ja) * 1991-03-29 1993-04-06 Hitachi Ltd 真空チヤツク装置
US5505124A (en) * 1994-03-02 1996-04-09 Heidelberger Druckmaschinen Aktiengesellschaft Printing press with a device for providing a suction force
CN201346752Y (zh) * 2009-01-22 2009-11-18 华中科技大学 一种挠性印刷电路板专用真空吸盘
JP2012176852A (ja) * 2011-02-28 2012-09-13 Nanotemu:Kk 真空チャック
CN104039209A (zh) * 2011-11-18 2014-09-10 耐克国际有限公司 可变换板制造真空工具
CN108349093A (zh) * 2015-09-08 2018-07-31 伯克希尔格雷股份有限公司 用于在活节臂末端执行器中提供动态真空压力的系统和方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6189876B1 (en) * 1998-05-05 2001-02-20 Mcms, Inc. Method and apparatus for leveling the upper surface of a PCB
US6264187B1 (en) * 1998-10-13 2001-07-24 Galahad, Co. Method and apparatus for self-conforming support system
US6726195B1 (en) * 1998-10-13 2004-04-27 Dek International Gmbh Method for ensuring planarity when using a flexible, self conforming, workpiece support system
US6857627B2 (en) * 2001-10-23 2005-02-22 Micron Technology, Inc. Inflatable bladder with suction for supporting circuit board assembly processing
US6889967B2 (en) * 2002-09-27 2005-05-10 Gerber Technology, Inc. Perforated vacuum hold down surface
CN101441278A (zh) * 2007-11-20 2009-05-27 鸿富锦精密工业(深圳)有限公司 固持装置及固持方法
DE202008010424U1 (de) * 2008-07-30 2009-12-24 J. Schmalz Gmbh Mit Druckluft betriebener Flächensauggreifer
ITPD20130092A1 (it) * 2013-04-10 2014-10-11 Promac Srl Centro di lavorazione con supporto verticale per pezzi lunghi e flessibili
DE102015113956B4 (de) * 2015-08-24 2024-03-07 Meyer Burger (Germany) Gmbh Substratträger

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3413903A (en) * 1966-01-24 1968-12-03 Hycon Mfg Co High speed platen
JPS6161131U (zh) * 1984-09-26 1986-04-24
JPH0584682A (ja) * 1991-03-29 1993-04-06 Hitachi Ltd 真空チヤツク装置
US5505124A (en) * 1994-03-02 1996-04-09 Heidelberger Druckmaschinen Aktiengesellschaft Printing press with a device for providing a suction force
CN201346752Y (zh) * 2009-01-22 2009-11-18 华中科技大学 一种挠性印刷电路板专用真空吸盘
JP2012176852A (ja) * 2011-02-28 2012-09-13 Nanotemu:Kk 真空チャック
CN104039209A (zh) * 2011-11-18 2014-09-10 耐克国际有限公司 可变换板制造真空工具
CN108349093A (zh) * 2015-09-08 2018-07-31 伯克希尔格雷股份有限公司 用于在活节臂末端执行器中提供动态真空压力的系统和方法

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