JP6596398B2 - 電力変換装置 - Google Patents

電力変換装置 Download PDF

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Publication number
JP6596398B2
JP6596398B2 JP2016167140A JP2016167140A JP6596398B2 JP 6596398 B2 JP6596398 B2 JP 6596398B2 JP 2016167140 A JP2016167140 A JP 2016167140A JP 2016167140 A JP2016167140 A JP 2016167140A JP 6596398 B2 JP6596398 B2 JP 6596398B2
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JP
Japan
Prior art keywords
refrigerant
pipe
inlet
power conversion
conversion device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016167140A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018038117A (ja
Inventor
貴寛 采女
隆寛 萩本
浩央 山口
真一 谷高
友子 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP2016167140A priority Critical patent/JP6596398B2/ja
Priority to CN201710675312.6A priority patent/CN107799487B/zh
Priority to US15/672,302 priority patent/US10225962B2/en
Publication of JP2018038117A publication Critical patent/JP2018038117A/ja
Application granted granted Critical
Publication of JP6596398B2 publication Critical patent/JP6596398B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2016167140A 2016-08-29 2016-08-29 電力変換装置 Expired - Fee Related JP6596398B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016167140A JP6596398B2 (ja) 2016-08-29 2016-08-29 電力変換装置
CN201710675312.6A CN107799487B (zh) 2016-08-29 2017-08-09 电力转换装置
US15/672,302 US10225962B2 (en) 2016-08-29 2017-08-09 Power converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016167140A JP6596398B2 (ja) 2016-08-29 2016-08-29 電力変換装置

Publications (2)

Publication Number Publication Date
JP2018038117A JP2018038117A (ja) 2018-03-08
JP6596398B2 true JP6596398B2 (ja) 2019-10-23

Family

ID=61244227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016167140A Expired - Fee Related JP6596398B2 (ja) 2016-08-29 2016-08-29 電力変換装置

Country Status (3)

Country Link
US (1) US10225962B2 (zh)
JP (1) JP6596398B2 (zh)
CN (1) CN107799487B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102651940B1 (ko) * 2018-11-22 2024-03-27 현대자동차주식회사 수냉각 장치 및 이를 포함하는 수냉각식 파워 모듈 어셈블리
KR102169412B1 (ko) * 2019-02-19 2020-10-23 주식회사 고산 차량의 전기소자 냉각용 열교환기
JP7099385B2 (ja) * 2019-03-28 2022-07-12 株式会社デンソー 加圧部材
CN110719717A (zh) * 2019-09-04 2020-01-21 华为技术有限公司 双面水冷散热器
DE102019214727A1 (de) * 2019-09-26 2021-04-01 Robert Bosch Gmbh Kühlsystem und Kühlanordnung
DE102019214722A1 (de) * 2019-09-26 2021-04-01 Robert Bosch Gmbh Modulares Kühlsystem und Kühlsystemkonfiguration
DE102019214728A1 (de) * 2019-09-26 2021-04-01 Robert Bosch Gmbh Kühlsystem und Kühlanordnung
CN115943554A (zh) * 2020-08-18 2023-04-07 日立安斯泰莫株式会社 电力变换装置、电力变换装置的制造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3050681B2 (ja) * 1992-02-21 2000-06-12 インターユニット株式会社 半導体スタック
IT1293021B1 (it) * 1997-07-10 1999-02-11 Sme Elettronica Spa Modulo di potenza a semiconduttori.
EP2244289B1 (en) * 2000-04-19 2014-03-26 Denso Corporation Coolant cooled type semiconductor device
JP4089595B2 (ja) 2002-12-16 2008-05-28 株式会社デンソー 冷媒冷却型両面冷却半導体装置
DE102004057526B4 (de) * 2003-12-03 2020-08-20 Denso Corporation Stapelkühler
JP4133873B2 (ja) * 2004-03-04 2008-08-13 株式会社デンソー 熱電発電装置
EP1965424A3 (en) * 2004-11-24 2011-06-29 Danfoss Silicon Power GmbH A flow distribution module and a stack of flow distribution modules
US20060219396A1 (en) * 2005-04-04 2006-10-05 Denso Corporation Lamination-type cooler
DE102005048492B4 (de) * 2005-10-07 2009-06-04 Curamik Electronics Gmbh Elektrisches Modul
JP4345862B2 (ja) * 2007-03-27 2009-10-14 株式会社デンソー 冷却器及びこれを備えた電力変換装置
US7965508B2 (en) * 2007-03-27 2011-06-21 Denso Corporation Cooling device for electronic component and power converter equipped with the same
US7808781B2 (en) * 2008-05-13 2010-10-05 International Business Machines Corporation Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
JP5627499B2 (ja) * 2010-03-30 2014-11-19 株式会社デンソー 半導体モジュールを備えた半導体装置
JP5062302B2 (ja) * 2010-06-29 2012-10-31 株式会社デンソー 冷却器への電子部品内蔵配線基板の取付構造及びその取付方法
US9041194B2 (en) * 2011-03-17 2015-05-26 Nhk Spring Co., Ltd. Pressure unit
JP5691775B2 (ja) * 2011-04-13 2015-04-01 株式会社デンソー 電力変換装置
JP5344013B2 (ja) * 2011-09-06 2013-11-20 株式会社デンソー 電力変換装置
JP5747869B2 (ja) * 2012-06-18 2015-07-15 株式会社デンソー 電力変換装置
JP2014078599A (ja) * 2012-10-10 2014-05-01 Denso Corp 電力変換装置
US9282678B2 (en) * 2013-10-21 2016-03-08 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
JP5991345B2 (ja) * 2013-12-26 2016-09-14 株式会社デンソー 電力変換装置
JP6206359B2 (ja) * 2014-08-28 2017-10-04 トヨタ自動車株式会社 半導体装置
JP6197769B2 (ja) * 2014-09-12 2017-09-20 株式会社デンソー 電力変換装置及びその製造方法
JP2016063641A (ja) * 2014-09-18 2016-04-25 株式会社デンソー 電力変換装置
JP6394262B2 (ja) * 2014-10-14 2018-09-26 株式会社デンソー 電力変換装置

Also Published As

Publication number Publication date
CN107799487B (zh) 2020-10-09
CN107799487A (zh) 2018-03-13
US10225962B2 (en) 2019-03-05
JP2018038117A (ja) 2018-03-08
US20180064000A1 (en) 2018-03-01

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