JP6557202B2 - プラズマダイシングのための装置 - Google Patents
プラズマダイシングのための装置 Download PDFInfo
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- JP6557202B2 JP6557202B2 JP2016206233A JP2016206233A JP6557202B2 JP 6557202 B2 JP6557202 B2 JP 6557202B2 JP 2016206233 A JP2016206233 A JP 2016206233A JP 2016206233 A JP2016206233 A JP 2016206233A JP 6557202 B2 JP6557202 B2 JP 6557202B2
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Description
この装置は、
チャンバと、
半導体基板をダイシングするのに適し、チャンバ内でプラズマを発生させるプラズマ発生装置と、
チャンバ内に配置され、キャリアシートに接触することによってワークピースを支持するワークピース支持物と、
使用中にフレーム部材に接触し、これによって、チャンバ内に配置されている補助要素に押し付けてキャリアシートをクランプするフレームカバー要素と、を備える。
この方法は、
本発明の第1の態様による装置を提供するステップと、
ワークピース支持物とキャリアシートを接触状態に配置することによって、ワークピースを支持するステップと、
フレーム部材をフレームカバー要素に接触させることによって、補助要素に対してキャリアシートをクランプするステップと、
半導体基板をプラズマダイシングするステップと、を含む。
12 ケガキ線
13 半導体チップ
14 ダイシングテープ
15 静電チャック
16 環状フレーム
17 フレームアセンブリ
18 内部冷却流路
19 プラズマ
110 フレームカバー
111 熱シールド
Claims (25)
- ワークピースの一部をなす形態の半導体基板をプラズマダイシングするための装置であって、
前記ワークピースはフレーム部材上のキャリアシートを備え、該キャリアシートは前記半導体基板を支持し、
前記装置は、
チャンバと、
前記半導体基板をダイシングするのに適し、前記チャンバ内でプラズマを発生させるプラズマ発生装置と、
前記チャンバ内に配置され、前記キャリアシートに接触することによって前記ワークピースを支持するワークピース支持物と、
使用中に前記フレーム部材に接触し、前記チャンバ内に配置されている補助要素に押し付けて前記キャリアシートをクランプするフレームカバー要素と、
を備え、
前記フレームカバー要素は、使用時に前記フレーム部材に接触する1つ又は複数の突起を備え、
前記補助要素は、ワークピースが前記ワークピース支持物上に存在していない時に前記フレームカバー要素の前記突起を受け入れるための1つ又は複数の開口部を備えることを特徴とする装置。 - 前記補助要素は前記ワークピース支持物であることを特徴とする請求項1に記載の装置。
- 前記補助要素は前記ワークピース支持物の周囲に配置されているシールドリングであることを特徴とする請求項1に記載の装置。
- 前記シールドリングは前記チャンバに熱接触していることを特徴とする請求項3に記載の装置。
- 前記プラズマから前記フレームカバー要素を熱的に保護するために、前記フレームカバー要素の上方に配置されている熱シールドをさらに備えることを特徴とする請求項1〜4の何れか一項に記載の装置。
- 前記熱シールドは前記フレームカバー要素から間隔を開けて配置されていることを特徴とする請求項5に記載の装置。
- 前記熱シールドは前記補助要素上に支持されていることを特徴とする請求項6に記載の装置。
- 前記熱シールドは前記フレームカバー要素に対して接触していることを特徴とする請求項5に記載の装置。
- 前記熱シールドは前記フレームカバー要素に接触する1つ又は複数の突起を備えることを特徴とする請求項8に記載の装置。
- 前記熱シールドはセラミック材料で形成されていることを特徴とする請求項5〜9の何れか一項に記載の装置。
- 前記プラズマから前記フレームカバー要素を熱的に保護するための熱シールドが存在しない請求項1〜10の何れか一項に記載の装置。
- 前記フレームカバー要素による前記補助要素に対する前記キャリアシートのクランプを補助するために、前記フレームカバー要素にクランプ力を加える少なくとも1つのクランプをさらに備えることを特徴とする請求項1〜11の何れか一項に記載の装置。
- 前記フレームカバー要素は、使用時に前記フレーム部材に接触する概ね平らな下部表面を備えることを特徴とする請求項1〜12の何れか一項に記載の装置。
- ワークピースが前記ワークピース支持物上に存在していないときに、前記フレームカバー要素が前記補助要素との熱接触状態にされるように構成されていることを特徴とする請求項1〜13の何れか一項に記載の装置。
- 前記フレームカバー要素は金属又はセラミック材料で形成されていることを特徴とする請求項1〜14の何れか一項に記載の装置。
- 前記ワークピース支持物は静電チャックであることを特徴とする請求項1〜15の何れか一項に記載の装置。
- 前記フレーム部材を前記ワークピース支持物に対して接触状態又は非接触状態にするように、前記フレーム部材を下降及び上昇させ、及び、前記フレーム部材と、任意的には、前記ワークピース支持物とに対して前記フレームカバー要素を接触状態又は非接触状態にするために前記フレームカバー要素を下降及び上昇させるリフト機構をさらに備えることを特徴とする請求項1〜16の何れか一項に記載の装置。
- 前記半導体基板と前記フレーム部材上のキャリアシートとを備えるワークピースと組み合わせており、前記キャリアシートは前記半導体基板を支持し、前記ワークピース支持物は前記キャリアシートに接触することによって前記ワークピースを支持し、前記フレーム部材は前記フレームカバー要素によってクランプされていることを特徴とする請求項1〜17の何れか一項に記載の装置。
- 前記ワークピース支持物は、前記キャリアシートに接触することによって前記ワークピースを支持し、且つ、周縁部を有するワークピース支持表面を備え、前記フレーム部材は前記ワークピースの周縁部を画定し、前記ワークピースの前記周縁部は全体として前記ワークピース支持表面の前記周縁部の内側に位置していることを特徴とする請求項18に記載の装置。
- 前記キャリアシートは、任意的に接着剤を伴った、ポリマー材料から形成されているテープを備えることを特徴とする請求項19に記載の装置。
- ワークピースの一部をなす形態の半導体基板をプラズマダイシングする方法であって、
前記ワークピースはフレーム部材上のキャリアシートを備え、前記キャリアシートは前記半導体基板を支持し、
前記方法は、
請求項1に記載の装置を提供するステップと、
前記キャリアシートをワークピース支持物と接触させることによって前記ワークピースを支持するステップと、
前記フレーム部材を前記フレームカバー要素に接触させることによって、補助要素に対して前記キャリアシートをクランプするステップと、
前記半導体基板をプラズマダイシングするステップと、
を含むことを特徴とする方法。 - 前記ワークピース支持物は、前記キャリアシートに接触することによって前記ワークピースを支持し、且つ、周縁部を有するワークピース支持表面を備え、
前記フレーム部材は前記ワークピースの周縁部を画定し、前記ワークピースの前記周縁部は全体として前記ワークピース支持表面の前記周縁部の内側に位置していることを特徴とする請求項21に記載の方法。 - 前記ワークピース支持物は静電チャックであり、前記キャリアシートに接触する前記静電チャックの一部分が、概ね平らであり且つ特徴がない上部表面であることを特徴とする請求項21又は22に記載の方法。
- 前記ワークピース支持物は前記補助要素として機能する静電チャックであり、該静電チャックは前記フレーム部材に対して作用する追加的な静電クランプ力を提供することを特徴とする請求項21〜23の何れか一項に記載の方法。
- 前記半導体基板をプラズマダイシングする前記ステップが完了した後に、前記ワークピースは前記チャンバから取り出され、前記フレームカバー要素は前記ワークピース支持物に対して熱接触状態にされることを特徴とする請求項21〜24の何れか一項に記載の方法。
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8946058B2 (en) * | 2011-03-14 | 2015-02-03 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
GB201518756D0 (en) * | 2015-10-22 | 2015-12-09 | Spts Technologies Ltd | Apparatus for plasma dicing |
JP6524536B2 (ja) * | 2016-11-09 | 2019-06-05 | パナソニックIpマネジメント株式会社 | プラズマ処理装置およびプラズマ処理方法 |
DE102018200656A1 (de) * | 2018-01-16 | 2019-07-18 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
TWI721463B (zh) * | 2019-06-21 | 2021-03-11 | 日月光半導體製造股份有限公司 | 環狀件及晶圓夾持組件 |
GB201918333D0 (en) | 2019-12-12 | 2020-01-29 | Spts Technologies Ltd | A semiconductor wafer dicing process |
US20220108908A1 (en) * | 2020-10-06 | 2022-04-07 | Applied Materials, Inc. | Shadow ring kit for plasma etch wafer singulation process |
GB202020022D0 (en) * | 2020-12-17 | 2021-02-03 | Spts Technologies Ltd | Method and apparatus |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6129808A (en) | 1998-03-31 | 2000-10-10 | Lam Research Corporation | Low contamination high density plasma etch chambers and methods for making the same |
JP2002141337A (ja) | 2000-11-02 | 2002-05-17 | Matsushita Electric Ind Co Ltd | プラズマ処理装置及びプラズマ処理方法 |
JP4013753B2 (ja) | 2002-12-11 | 2007-11-28 | 松下電器産業株式会社 | 半導体ウェハの切断方法 |
US20050016684A1 (en) * | 2003-07-25 | 2005-01-27 | Applied Materials, Inc. | Process kit for erosion resistance enhancement |
KR100578129B1 (ko) * | 2003-09-19 | 2006-05-10 | 삼성전자주식회사 | 플라즈마 식각 장치 |
JP2005252126A (ja) | 2004-03-08 | 2005-09-15 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
US20070065597A1 (en) * | 2005-09-15 | 2007-03-22 | Asm Japan K.K. | Plasma CVD film formation apparatus provided with mask |
JP2007294812A (ja) | 2006-04-27 | 2007-11-08 | Fujikura Ltd | 冷却装置およびプラズマ処理装置 |
JP4840174B2 (ja) * | 2007-02-08 | 2011-12-21 | パナソニック株式会社 | 半導体チップの製造方法 |
US7781310B2 (en) | 2007-08-07 | 2010-08-24 | Semiconductor Components Industries, Llc | Semiconductor die singulation method |
JP4858395B2 (ja) | 2007-10-12 | 2012-01-18 | パナソニック株式会社 | プラズマ処理装置 |
TW200935506A (en) * | 2007-11-16 | 2009-08-16 | Panasonic Corp | Plasma dicing apparatus and semiconductor chip manufacturing method |
US8941968B2 (en) | 2010-06-08 | 2015-01-27 | Axcelis Technologies, Inc. | Heated electrostatic chuck including mechanical clamp capability at high temperature |
US9265275B2 (en) | 2010-11-11 | 2016-02-23 | Rijk Zwaan Zaadteelt En Zaadhandel B.V. | Spinach line SP6504 |
US8946058B2 (en) * | 2011-03-14 | 2015-02-03 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
US8691702B2 (en) | 2011-03-14 | 2014-04-08 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
US8802545B2 (en) | 2011-03-14 | 2014-08-12 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
JP5528394B2 (ja) | 2011-05-30 | 2014-06-25 | パナソニック株式会社 | プラズマ処理装置、搬送キャリア、及びプラズマ処理方法 |
JP5827344B2 (ja) * | 2011-12-15 | 2015-12-02 | キヤノンアネルバ株式会社 | 処理装置およびシールド |
JP5849232B2 (ja) | 2012-09-20 | 2016-01-27 | パナソニックIpマネジメント株式会社 | プラズマ処理装置及びプラズマ処理方法 |
JP5981358B2 (ja) * | 2013-01-23 | 2016-08-31 | 東京エレクトロン株式会社 | 伝熱シート貼付方法 |
US9236305B2 (en) | 2013-01-25 | 2016-01-12 | Applied Materials, Inc. | Wafer dicing with etch chamber shield ring for film frame wafer applications |
JP5962921B2 (ja) * | 2013-05-09 | 2016-08-03 | パナソニックIpマネジメント株式会社 | プラズマ処理装置及びプラズマ処理方法 |
JP6094813B2 (ja) * | 2013-09-02 | 2017-03-15 | パナソニックIpマネジメント株式会社 | プラズマ処理装置 |
JP6024921B2 (ja) | 2013-11-01 | 2016-11-16 | パナソニックIpマネジメント株式会社 | プラズマ処理装置及びプラズマ処理方法 |
JP5938716B2 (ja) * | 2013-11-01 | 2016-06-22 | パナソニックIpマネジメント株式会社 | プラズマ処理装置及びプラズマ処理方法 |
US9293304B2 (en) * | 2013-12-17 | 2016-03-22 | Applied Materials, Inc. | Plasma thermal shield for heat dissipation in plasma chamber |
US9236284B2 (en) * | 2014-01-31 | 2016-01-12 | Applied Materials, Inc. | Cooled tape frame lift and low contact shadow ring for plasma heat isolation |
US9034771B1 (en) | 2014-05-23 | 2015-05-19 | Applied Materials, Inc. | Cooling pedestal for dicing tape thermal management during plasma dicing |
US9117868B1 (en) | 2014-08-12 | 2015-08-25 | Applied Materials, Inc. | Bipolar electrostatic chuck for dicing tape thermal management during plasma dicing |
JP2016051876A (ja) | 2014-09-02 | 2016-04-11 | パナソニックIpマネジメント株式会社 | プラズマ処理装置およびプラズマ処理方法 |
JP6296299B2 (ja) * | 2014-09-02 | 2018-03-20 | パナソニックIpマネジメント株式会社 | プラズマ処理装置およびプラズマ処理方法 |
JP6555656B2 (ja) * | 2015-02-17 | 2019-08-07 | パナソニックIpマネジメント株式会社 | プラズマ処理装置および電子部品の製造方法 |
CN106024565B (zh) * | 2015-03-31 | 2019-11-19 | 松下知识产权经营株式会社 | 等离子处理装置以及等离子处理方法 |
US9570272B2 (en) * | 2015-03-31 | 2017-02-14 | Panasonic Intellectual Property Management Co., Ltd. | Plasma processing apparatus and plasma processing method |
CN106024566B (zh) * | 2015-03-31 | 2019-07-05 | 松下知识产权经营株式会社 | 等离子处理装置以及等离子处理方法 |
US9478455B1 (en) * | 2015-06-12 | 2016-10-25 | Applied Materials, Inc. | Thermal pyrolytic graphite shadow ring assembly for heat dissipation in plasma chamber |
GB201518756D0 (en) * | 2015-10-22 | 2015-12-09 | Spts Technologies Ltd | Apparatus for plasma dicing |
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