JP6554788B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP6554788B2
JP6554788B2 JP2014244783A JP2014244783A JP6554788B2 JP 6554788 B2 JP6554788 B2 JP 6554788B2 JP 2014244783 A JP2014244783 A JP 2014244783A JP 2014244783 A JP2014244783 A JP 2014244783A JP 6554788 B2 JP6554788 B2 JP 6554788B2
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Japan
Prior art keywords
furnace
hydrogen
solder
decompression
metal wire
Prior art date
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Active
Application number
JP2014244783A
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English (en)
Japanese (ja)
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JP2016111078A (ja
Inventor
俊介 齋藤
俊介 齋藤
渡邉　裕彦
裕彦 渡邉
一永 大西
一永 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP2014244783A priority Critical patent/JP6554788B2/ja
Priority to CN201510762725.9A priority patent/CN105679686B/zh
Publication of JP2016111078A publication Critical patent/JP2016111078A/ja
Application granted granted Critical
Publication of JP6554788B2 publication Critical patent/JP6554788B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP2014244783A 2014-12-03 2014-12-03 半導体装置の製造方法 Active JP6554788B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014244783A JP6554788B2 (ja) 2014-12-03 2014-12-03 半導体装置の製造方法
CN201510762725.9A CN105679686B (zh) 2014-12-03 2015-11-10 半导体装置的制造方法及接合组装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014244783A JP6554788B2 (ja) 2014-12-03 2014-12-03 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2016111078A JP2016111078A (ja) 2016-06-20
JP6554788B2 true JP6554788B2 (ja) 2019-08-07

Family

ID=56122218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014244783A Active JP6554788B2 (ja) 2014-12-03 2014-12-03 半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JP6554788B2 (zh)
CN (1) CN105679686B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10606180B2 (en) * 2017-03-08 2020-03-31 Asml Netherlands B.V. EUV cleaning systems and methods thereof for an extreme ultraviolet light source
CN108987265A (zh) * 2018-06-26 2018-12-11 武汉华星光电半导体显示技术有限公司 显示器件制造方法及装置
CN111805038A (zh) * 2019-04-10 2020-10-23 薛星海 一种离线正压焊接炉系统及其操作方法
CN111805039B (zh) * 2019-04-11 2022-02-08 中科同帜半导体(江苏)有限公司 一种在线正压焊接炉系统及其操作方法
TWI738490B (zh) * 2020-07-27 2021-09-01 劉劭祺 材料處理設備及其操作方法
CN117086429A (zh) * 2023-10-18 2023-11-21 苏州申翰智能机器人有限公司 一种基于半导体基材的回流焊装置及其操作工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409543A (en) * 1992-12-22 1995-04-25 Sandia Corporation Dry soldering with hot filament produced atomic hydrogen
JP3809806B2 (ja) * 2002-03-29 2006-08-16 富士電機デバイステクノロジー株式会社 半導体装置の製造方法
JP4032899B2 (ja) * 2002-09-18 2008-01-16 トヨタ自動車株式会社 電子部品の製造方法及び該方法に用いるハンダ付け装置
US8361340B2 (en) * 2003-04-28 2013-01-29 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
JP4203673B2 (ja) * 2006-07-04 2009-01-07 パナソニック株式会社 原子状水素発生器
JP5903887B2 (ja) * 2009-09-16 2016-04-13 日立化成株式会社 印刷法用インクの製造方法
US20140179110A1 (en) * 2012-12-21 2014-06-26 Applied Materials, Inc. Methods and apparatus for processing germanium containing material, a iii-v compound containing material, or a ii-vi compound containing material disposed on a substrate using a hot wire source

Also Published As

Publication number Publication date
JP2016111078A (ja) 2016-06-20
CN105679686A (zh) 2016-06-15
CN105679686B (zh) 2018-10-23

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