JP6554440B2 - 部品供給装置、部品供給方法および表面実装機 - Google Patents
部品供給装置、部品供給方法および表面実装機 Download PDFInfo
- Publication number
- JP6554440B2 JP6554440B2 JP2016090289A JP2016090289A JP6554440B2 JP 6554440 B2 JP6554440 B2 JP 6554440B2 JP 2016090289 A JP2016090289 A JP 2016090289A JP 2016090289 A JP2016090289 A JP 2016090289A JP 6554440 B2 JP6554440 B2 JP 6554440B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- component supply
- component
- main body
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/086—Supply management, e.g. supply of components or of substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/087—Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016090289A JP6554440B2 (ja) | 2016-04-28 | 2016-04-28 | 部品供給装置、部品供給方法および表面実装機 |
US16/092,656 US11606891B2 (en) | 2016-04-28 | 2017-02-06 | Component supply device and surface mounting machine |
DE112017001068.3T DE112017001068T5 (de) | 2016-04-28 | 2017-02-06 | Bauteilzuführungsvorrichtung, Bauteilzuführungsverfahren und Oberflächenmontagemaschine |
PCT/JP2017/004227 WO2017187704A1 (ja) | 2016-04-28 | 2017-02-06 | 部品供給装置、部品供給方法および表面実装機 |
CN201780008779.3A CN108605430B (zh) | 2016-04-28 | 2017-02-06 | 元件供给装置、元件供给方法及表面安装机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016090289A JP6554440B2 (ja) | 2016-04-28 | 2016-04-28 | 部品供給装置、部品供給方法および表面実装機 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017199832A JP2017199832A (ja) | 2017-11-02 |
JP2017199832A5 JP2017199832A5 (de) | 2018-07-19 |
JP6554440B2 true JP6554440B2 (ja) | 2019-07-31 |
Family
ID=60160248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016090289A Active JP6554440B2 (ja) | 2016-04-28 | 2016-04-28 | 部品供給装置、部品供給方法および表面実装機 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11606891B2 (de) |
JP (1) | JP6554440B2 (de) |
CN (1) | CN108605430B (de) |
DE (1) | DE112017001068T5 (de) |
WO (1) | WO2017187704A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6554440B2 (ja) * | 2016-04-28 | 2019-07-31 | ヤマハ発動機株式会社 | 部品供給装置、部品供給方法および表面実装機 |
JP6929189B2 (ja) | 2017-10-13 | 2021-09-01 | Toyo Tire株式会社 | 空気入りタイヤ |
WO2020003424A1 (ja) * | 2018-06-27 | 2020-01-02 | ヤマハ発動機株式会社 | 部品供給装置 |
CN113994775B (zh) * | 2019-08-27 | 2023-05-23 | 雅马哈发动机株式会社 | 元件补给支援装置、元件安装系统、元件补给支援方法 |
WO2021038713A1 (ja) * | 2019-08-27 | 2021-03-04 | ヤマハ発動機株式会社 | 部品実装機、テープフィーダ、テープセットユニット |
CN112272512B (zh) * | 2020-10-23 | 2021-10-19 | 湖南大学 | 一种smd用贴装系统 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4952113A (en) * | 1988-11-14 | 1990-08-28 | Tenryu Technics Co., Ltd. | Chip feeder for chip mounter |
KR100646909B1 (ko) | 1998-12-22 | 2006-11-23 | 마이데이터 오토메이션 아베 | 부품 장착 머신의 테잎 가이드 및 테잎 매거진 |
JP3840968B2 (ja) | 2001-12-18 | 2006-11-01 | 松下電器産業株式会社 | テープフィーダ |
JP2005528806A (ja) * | 2002-06-03 | 2005-09-22 | アセムブレオン エヌ ヴィ | コンポーネント供給装置 |
TWI236321B (en) * | 2003-04-10 | 2005-07-11 | Protec Co Ltd | Tape feeder for chip mounters |
US7243828B2 (en) * | 2004-11-12 | 2007-07-17 | Samsung Techwin Co., Ltd. | Tape feeder for component mounter and method of automatically setting tape initial position by the same |
JP2008041732A (ja) | 2006-08-02 | 2008-02-21 | Matsushita Electric Ind Co Ltd | テープフィーダ |
JP4762193B2 (ja) * | 2007-04-27 | 2011-08-31 | パナソニック株式会社 | 部品供給装置 |
US8678065B2 (en) | 2010-03-30 | 2014-03-25 | Sts Co., Ltd. | Carrier tape feeder |
JP5423644B2 (ja) * | 2010-10-14 | 2014-02-19 | パナソニック株式会社 | テープフィーダおよびテープフィーダにおけるテープ装着方法 |
JP5909643B2 (ja) * | 2012-04-13 | 2016-04-27 | パナソニックIpマネジメント株式会社 | テープフィーダおよびテープフィーダにおける設定情報の表示方法 |
JP6026796B2 (ja) | 2012-06-29 | 2016-11-16 | ヤマハ発動機株式会社 | 電子部品装着装置及び電子部品装着方法 |
JP6002937B2 (ja) * | 2012-11-28 | 2016-10-05 | パナソニックIpマネジメント株式会社 | テープフィーダ |
US9839170B2 (en) * | 2013-08-26 | 2017-12-05 | Fuji Machine Mfg. Co., Ltd. | Feeder |
JP6174547B2 (ja) | 2014-10-30 | 2017-08-02 | 株式会社小野測器 | 分布図表示装置及び方法 |
JP6554440B2 (ja) * | 2016-04-28 | 2019-07-31 | ヤマハ発動機株式会社 | 部品供給装置、部品供給方法および表面実装機 |
-
2016
- 2016-04-28 JP JP2016090289A patent/JP6554440B2/ja active Active
-
2017
- 2017-02-06 WO PCT/JP2017/004227 patent/WO2017187704A1/ja active Application Filing
- 2017-02-06 US US16/092,656 patent/US11606891B2/en active Active
- 2017-02-06 CN CN201780008779.3A patent/CN108605430B/zh active Active
- 2017-02-06 DE DE112017001068.3T patent/DE112017001068T5/de active Pending
Also Published As
Publication number | Publication date |
---|---|
CN108605430A (zh) | 2018-09-28 |
CN108605430B (zh) | 2020-04-28 |
DE112017001068T5 (de) | 2018-11-29 |
WO2017187704A1 (ja) | 2017-11-02 |
US11606891B2 (en) | 2023-03-14 |
US20190133009A1 (en) | 2019-05-02 |
JP2017199832A (ja) | 2017-11-02 |
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