JP6553489B2 - 部品実装機、および部品実装機のウエハ部品吸着高さ調整方法 - Google Patents

部品実装機、および部品実装機のウエハ部品吸着高さ調整方法 Download PDF

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JP6553489B2
JP6553489B2 JP2015225468A JP2015225468A JP6553489B2 JP 6553489 B2 JP6553489 B2 JP 6553489B2 JP 2015225468 A JP2015225468 A JP 2015225468A JP 2015225468 A JP2015225468 A JP 2015225468A JP 6553489 B2 JP6553489 B2 JP 6553489B2
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JP2017098287A5 (enExample
JP2017098287A (ja
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祐介 奈良
祐介 奈良
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015225468A 2015-11-18 2015-11-18 部品実装機、および部品実装機のウエハ部品吸着高さ調整方法 Active JP6553489B2 (ja)

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JP2017098287A5 JP2017098287A5 (enExample) 2018-11-29
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JP6752250B2 (ja) * 2018-03-28 2020-09-09 東レエンジニアリング株式会社 ツール高さ調整装置およびこれを備えたチップ部品転写装置
JP7164365B2 (ja) * 2018-09-07 2022-11-01 日清紡マイクロデバイス株式会社 電子部品搬送装置及び電子部品搬送方法
JP7421412B2 (ja) * 2020-05-01 2024-01-24 株式会社Fuji 吸着装置の状態判定装置
JP7495864B2 (ja) * 2020-10-28 2024-06-05 株式会社アマダ ワーク搬送システム及びワーク搬送方法
CN112908895A (zh) * 2021-01-20 2021-06-04 深圳市卓兴半导体科技有限公司 一种基板平面矫正方法、系统及贴合设备
KR102874275B1 (ko) * 2022-03-30 2025-10-22 시바우라 메카트로닉스 가부시끼가이샤 접촉 위치 설정 장치, 실장 장치 및 접촉 위치 설정 방법

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JP6103745B2 (ja) * 2012-05-29 2017-03-29 富士機械製造株式会社 突き上げ高さ計測システム

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