JP6545207B2 - 導電体および導電体の製造方法 - Google Patents
導電体および導電体の製造方法 Download PDFInfo
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- JP6545207B2 JP6545207B2 JP2017024884A JP2017024884A JP6545207B2 JP 6545207 B2 JP6545207 B2 JP 6545207B2 JP 2017024884 A JP2017024884 A JP 2017024884A JP 2017024884 A JP2017024884 A JP 2017024884A JP 6545207 B2 JP6545207 B2 JP 6545207B2
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- 239000004020 conductor Substances 0.000 title claims description 65
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 74
- 239000011888 foil Substances 0.000 claims description 74
- 229910021389 graphene Inorganic materials 0.000 claims description 68
- 239000010410 layer Substances 0.000 claims description 68
- 239000000758 substrate Substances 0.000 claims description 67
- 238000000034 method Methods 0.000 claims description 34
- 230000004888 barrier function Effects 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 239000002344 surface layer Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 5
- 239000002243 precursor Substances 0.000 claims description 5
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 3
- 150000002894 organic compounds Chemical class 0.000 claims description 3
- 239000000463 material Substances 0.000 description 17
- 238000005260 corrosion Methods 0.000 description 13
- 230000007797 corrosion Effects 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 238000005229 chemical vapour deposition Methods 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 150000002736 metal compounds Chemical class 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Carbon And Carbon Compounds (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Chemical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Physical Vapour Deposition (AREA)
- Conductive Materials (AREA)
Description
Claims (8)
- 導電体(100)を製造する方法であって、前記製造方法が、
銅、銅合金、ニッケルおよびニッケル合金の少なくとも1つから成るベース基板(102)を準備する工程、
金属を含有する箔(110)を準備する工程、
前記箔上にグラフェン層(112)を堆積して層状構造体を形成する工程;および
前記ベース基板上に層状構造体の箔側を堆積する工程
を包含する導電体(100)の製造方法。 - 前記グラフェン層(112)は、前記箔(110)上に直接堆積している請求項1に記載の製造方法。
- 前記箔(110)は、前記ベース基板(102)上に直接堆積している請求項1に記載の製造方法。
- 前記箔(110)は、前記ベース基板(102)を被覆している請求項1に記載の製造方法。
- 前記グラフェン層(112)に対して前記箔(110)とは反対側の前記グラフェン層(112)上に、表面層をさらに含む請求項1に記載の製造方法。
- 前記表面層が、メッキで形成される、請求項5に記載の製造方法。
- 前記ベース基板(102)は、ベース(106)とバリア(108)とを含み、前記層状構造体(104)は前記バリアの上に堆積している、請求項1に記載の製造方法。
- 前記グラフェン層(112)は、有機化合物前駆体と熱とを用いて、CVDにより前記箔(110)の1つ以上の面に堆積しており、前記箔が前記ベース基板(102)上に適用されるよりも前に、前記グラフェン層は前記箔上に堆積されている、請求項1に記載の製造方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261613650P | 2012-03-21 | 2012-03-21 | |
US61/613,650 | 2012-03-21 | ||
US13/759,806 | 2013-02-05 | ||
US13/759,806 US20130248229A1 (en) | 2012-03-21 | 2013-02-05 | Electrical conductors and methods of manufacturing electrical conductors |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015501695A Division JP2015518235A (ja) | 2012-03-21 | 2013-03-06 | 導電体および導電体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017106123A JP2017106123A (ja) | 2017-06-15 |
JP6545207B2 true JP6545207B2 (ja) | 2019-07-17 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015501695A Pending JP2015518235A (ja) | 2012-03-21 | 2013-03-06 | 導電体および導電体の製造方法 |
JP2017024884A Active JP6545207B2 (ja) | 2012-03-21 | 2017-02-14 | 導電体および導電体の製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015501695A Pending JP2015518235A (ja) | 2012-03-21 | 2013-03-06 | 導電体および導電体の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20130248229A1 (ja) |
JP (2) | JP2015518235A (ja) |
CN (1) | CN104205241B (ja) |
DE (1) | DE112013001603T5 (ja) |
WO (1) | WO2013142050A1 (ja) |
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GB2532913A (en) * | 2014-08-01 | 2016-06-08 | Graphene Lighting Plc | Light emitting structures and devices |
GB2529445A (en) * | 2014-08-20 | 2016-02-24 | Graphene Lighting Plc | Method of making graphene LED bulb |
CN105984179A (zh) * | 2015-03-06 | 2016-10-05 | 兰州空间技术物理研究所 | 一种热沉材料及其制备方法 |
ES2570466B1 (es) * | 2015-07-31 | 2017-03-02 | Javier MORALES GÓMEZ | Circuito eléctrico basado en láminas de grafito |
CN105127197B (zh) * | 2015-08-31 | 2017-01-25 | 东北大学 | 一种多层金属/石墨烯复合极薄带的制备方法 |
US9768483B2 (en) * | 2015-09-24 | 2017-09-19 | Piotr Nawrocki | Signal cable and its application |
US10501845B2 (en) | 2015-11-20 | 2019-12-10 | Fourté International, Sdn. Bhd | Thin metal coating methods for high conductivity graphane-metal composites and methods of manufacture |
US10190211B2 (en) * | 2015-11-20 | 2019-01-29 | Fourté International, Sdn. Bhd | High conductivity graphane-metal and graphene-metal composite and methods of manufacture |
US9945027B2 (en) | 2015-11-20 | 2018-04-17 | Fourté International, Sdn. Bhd. | High conductivity graphene-metal composite and methods of manufacture |
US10590529B2 (en) | 2015-11-20 | 2020-03-17 | Fourté International, Sdn. Bhd | Metal foams and methods of manufacture |
US10544504B2 (en) * | 2015-11-20 | 2020-01-28 | Fourte' International, Sdn. Bhd. | Thin metal coating methods for high conductivity graphene and stanene metal composites and methods of manufacture |
US11047745B2 (en) * | 2015-12-11 | 2021-06-29 | The Boeing Company | Lightweight fire detection systems and methods |
US11854715B2 (en) | 2016-09-27 | 2023-12-26 | Ohio University | Ultraconductive metal composite forms and the synthesis thereof |
CN107180666B (zh) * | 2017-05-19 | 2018-11-13 | 长沙汉河电缆有限公司 | 一种专用于提升电缆导电性的石墨烯导电粉末及制备方法 |
CN107459033A (zh) * | 2017-07-11 | 2017-12-12 | 江苏星特亮科技有限公司 | 一种用于制备石墨烯薄膜的方法 |
CN107217240A (zh) * | 2017-07-11 | 2017-09-29 | 江苏星特亮科技有限公司 | 一种石墨烯薄膜的制备方法 |
WO2020176928A1 (en) * | 2019-03-01 | 2020-09-10 | Monash University | Graphene coating |
US11843153B2 (en) | 2019-03-12 | 2023-12-12 | Te Connectivity Solutions Gmbh | Use of enhanced performance ultraconductive copper materials in cylindrical configurations and methods of forming ultraconductive copper materials |
CN111696700A (zh) * | 2019-03-12 | 2020-09-22 | 泰连服务有限公司 | 具有期望的机械特性和电气特性组合的金属结构 |
EP3723122B1 (en) | 2019-04-10 | 2023-02-15 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier comprising a double layer structure |
JP7299127B2 (ja) | 2019-10-02 | 2023-06-27 | 矢崎総業株式会社 | 端子、並びにこれを用いた端子付き電線、及び電気接続部材 |
CN111403105B (zh) * | 2019-12-30 | 2021-10-19 | 浙江百川导体技术股份有限公司 | 一种铜包钢合金线的制备方法 |
IT202000012319A1 (it) * | 2020-05-26 | 2021-11-26 | Domenico Barbieri | Fili, trefoli, corde rigide e corde flessibili ad elevate prestazioni elettriche, fisico-chimiche ed ambientali ai fini della conduzione elettrica, ed un metodo per la loro preparazione. |
US12004308B2 (en) | 2021-05-18 | 2024-06-04 | Mellanox Technologies, Ltd. | Process for laminating graphene-coated printed circuit boards |
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TWI768966B (zh) * | 2021-06-15 | 2022-06-21 | 許國誠 | 石墨複合層疊散熱結構及其製造方法 |
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-
2013
- 2013-02-05 US US13/759,806 patent/US20130248229A1/en active Granted
- 2013-03-06 DE DE112013001603.6T patent/DE112013001603T5/de not_active Ceased
- 2013-03-06 JP JP2015501695A patent/JP2015518235A/ja active Pending
- 2013-03-06 WO PCT/US2013/029292 patent/WO2013142050A1/en active Application Filing
- 2013-03-06 CN CN201380015775.XA patent/CN104205241B/zh active Active
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2017
- 2017-02-14 JP JP2017024884A patent/JP6545207B2/ja active Active
Also Published As
Publication number | Publication date |
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CN104205241B (zh) | 2017-11-14 |
JP2015518235A (ja) | 2015-06-25 |
US20130248229A1 (en) | 2013-09-26 |
WO2013142050A1 (en) | 2013-09-26 |
JP2017106123A (ja) | 2017-06-15 |
CN104205241A (zh) | 2014-12-10 |
DE112013001603T5 (de) | 2014-12-11 |
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