JP6544179B2 - 脆性基板の分断方法 - Google Patents

脆性基板の分断方法 Download PDF

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Publication number
JP6544179B2
JP6544179B2 JP2015188312A JP2015188312A JP6544179B2 JP 6544179 B2 JP6544179 B2 JP 6544179B2 JP 2015188312 A JP2015188312 A JP 2015188312A JP 2015188312 A JP2015188312 A JP 2015188312A JP 6544179 B2 JP6544179 B2 JP 6544179B2
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JP
Japan
Prior art keywords
line
brittle substrate
glass substrate
trench line
load section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015188312A
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English (en)
Japanese (ja)
Other versions
JP2017061398A (ja
Inventor
佑磨 岩坪
佑磨 岩坪
曽山　浩
浩 曽山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2015188312A priority Critical patent/JP6544179B2/ja
Priority to TW105126429A priority patent/TWI610892B/zh
Priority to KR1020160114036A priority patent/KR101851069B1/ko
Priority to CN201610848910.4A priority patent/CN106985293B/zh
Publication of JP2017061398A publication Critical patent/JP2017061398A/ja
Application granted granted Critical
Publication of JP6544179B2 publication Critical patent/JP6544179B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2015188312A 2015-09-25 2015-09-25 脆性基板の分断方法 Expired - Fee Related JP6544179B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015188312A JP6544179B2 (ja) 2015-09-25 2015-09-25 脆性基板の分断方法
TW105126429A TWI610892B (zh) 2015-09-25 2016-08-18 脆性基板之分斷方法
KR1020160114036A KR101851069B1 (ko) 2015-09-25 2016-09-05 취성 기판의 분단 방법
CN201610848910.4A CN106985293B (zh) 2015-09-25 2016-09-23 脆性基板的截断方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015188312A JP6544179B2 (ja) 2015-09-25 2015-09-25 脆性基板の分断方法

Publications (2)

Publication Number Publication Date
JP2017061398A JP2017061398A (ja) 2017-03-30
JP6544179B2 true JP6544179B2 (ja) 2019-07-17

Family

ID=58429141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015188312A Expired - Fee Related JP6544179B2 (ja) 2015-09-25 2015-09-25 脆性基板の分断方法

Country Status (4)

Country Link
JP (1) JP6544179B2 (zh)
KR (1) KR101851069B1 (zh)
CN (1) CN106985293B (zh)
TW (1) TWI610892B (zh)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001293586A (ja) * 2000-04-12 2001-10-23 Takatori Corp ガラスの割断方法
JP3602846B2 (ja) 2001-06-14 2004-12-15 三星ダイヤモンド工業株式会社 有機ｅｌディスプレイ製造装置及び有機ｅｌディスプレイの製造方法
TWI226877B (en) 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
US7851241B2 (en) * 2002-04-01 2010-12-14 Mitsuboshi Diamond Industrial Co., Ltd. Method for severing brittle material substrate and severing apparatus using the method
JP4169565B2 (ja) * 2002-10-11 2008-10-22 三星ダイヤモンド工業株式会社 脆性材料基板のブレーク方法及びその装置並びに加工装置
CN101530951B (zh) * 2008-03-13 2012-03-14 富士迈半导体精密工业（上海）有限公司 激光切割脆性基板的方法及脆性基板
TWI494284B (zh) * 2010-03-19 2015-08-01 Corning Inc 強化玻璃之機械劃割及分離
JP5331078B2 (ja) * 2010-09-28 2013-10-30 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
TWI474981B (zh) * 2011-10-06 2015-03-01 Taiwan Mitsuboshi Diamond Ind Co Ltd 伴隨表面壓縮應力控制，切割一強化玻璃基板之方法
KR101968792B1 (ko) * 2011-11-16 2019-04-12 니폰 덴키 가라스 가부시키가이샤 판유리 할단장치, 판유리 할단방법, 판유리 제작방법 및 판유리 할단시스템
JP2014198658A (ja) * 2013-03-30 2014-10-23 株式会社レミ 高強度ガラス基板のブレーク方法
JP2015030661A (ja) * 2013-08-07 2015-02-16 株式会社レミ ガラス基板のブレーク方法

Also Published As

Publication number Publication date
JP2017061398A (ja) 2017-03-30
TW201711969A (zh) 2017-04-01
CN106985293A (zh) 2017-07-28
KR101851069B1 (ko) 2018-04-20
KR20170037512A (ko) 2017-04-04
TWI610892B (zh) 2018-01-11
CN106985293B (zh) 2018-11-13

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