JP6533828B2 - 熱増粘性樹脂水溶液 - Google Patents
熱増粘性樹脂水溶液 Download PDFInfo
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- JP6533828B2 JP6533828B2 JP2017533707A JP2017533707A JP6533828B2 JP 6533828 B2 JP6533828 B2 JP 6533828B2 JP 2017533707 A JP2017533707 A JP 2017533707A JP 2017533707 A JP2017533707 A JP 2017533707A JP 6533828 B2 JP6533828 B2 JP 6533828B2
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- Prior art keywords
- resin
- heat
- thickening
- aqueous solution
- temperature
- Prior art date
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- 125000003700 epoxy group Chemical group 0.000 description 1
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- 239000000194 fatty acid Substances 0.000 description 1
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- 239000002828 fuel tank Substances 0.000 description 1
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- 238000001879 gelation Methods 0.000 description 1
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- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229920001477 hydrophilic polymer Polymers 0.000 description 1
- 229920001600 hydrophobic polymer Polymers 0.000 description 1
- 239000003701 inert diluent Substances 0.000 description 1
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- 229940102223 injectable solution Drugs 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JILXUIANNUALRZ-UHFFFAOYSA-N n',n'-diethylbutane-1,4-diamine Chemical compound CCN(CC)CCCCN JILXUIANNUALRZ-UHFFFAOYSA-N 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- GCOWZPRIMFGIDQ-UHFFFAOYSA-N n',n'-dimethylbutane-1,4-diamine Chemical compound CN(C)CCCCN GCOWZPRIMFGIDQ-UHFFFAOYSA-N 0.000 description 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical class C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- LSMAIBOZUPTNBR-UHFFFAOYSA-N phosphanium;iodide Chemical compound [PH4+].[I-] LSMAIBOZUPTNBR-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- CCIYPTIBRAUPLQ-UHFFFAOYSA-M tetrabutylphosphanium;iodide Chemical compound [I-].CCCC[P+](CCCC)(CCCC)CCCC CCIYPTIBRAUPLQ-UHFFFAOYSA-M 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- DDFYFBUWEBINLX-UHFFFAOYSA-M tetramethylammonium bromide Chemical compound [Br-].C[N+](C)(C)C DDFYFBUWEBINLX-UHFFFAOYSA-M 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 239000011850 water-based material Substances 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
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Description
疎水性基及び親水性基を含む樹脂は、エポキシ樹脂、フェノール−ホルムアルデヒド樹脂、ポリウレタン樹脂、アクリル樹脂、ポリエステル樹脂、アクリル−ウレタン樹脂、メラミン樹脂、メラミン−ホルムアルデヒド樹脂、アミノ樹脂、及びこれらの組合せのいずれかから選択され得る。
%NV範囲:25〜50質量%;
密度:1.008〜1.056(g/ml);
質量/ガロン:8.4〜8.8;
酸のミリ当量/gNV:0.31〜0.80;
塩基のミリ当量/gNV:0.64〜0.80;及び
分子量(数平均)(Mn):7,500〜150,000ダルトン
である。
熱増粘性樹脂溶液は、コーティングの形成に関連しない多くの用途に適切であり得る。興味深いのは、熱増粘特性を利用するために、温度変化に曝されることを含む用途である。いくつかの例は、人体に接触する製品、並びに、油田事業及びバッテリーなどにおける、使用中の温度の変動に遭遇する製品を含む。
様々な実施形態が下に列挙される。下に列挙される実施形態は、本発明の範囲に従って、全ての態様及び他の実施形態と組み合わせられ得ることが理解されるであろう。
以下の例は、雰囲気圧力で製造され試験された。
エポキシ前駆体ポリマーが、次のように製造された。ビスフェノールA(Bis A)のジグリシジルエーテルを908.6グラム、及びBis Aの285グラムを、窒素(N2)ブランケットの下で、反応容器で混合し、125℃に加熱し、触媒のトリフェニルホスフィンを0.5グラム、反応容器に加えた。反応物は、190〜200℃に発熱した。材料を177℃に冷却し、その温度に1時間保った。プレポリマーの当量は475〜540であった。材料を150℃に冷却し、100グラムのイソブタノール、及び308グラムのトルエンをゆっくりと加えた。
679.1グラムのポリエーテルアミンを、窒素(N2)ブランケットの下で、反応容器に入れ、90℃に加熱し、321グラムの例1のプレポリマーを加えた。混合物を、115〜120℃に加熱し、真空ストリッピングを行い、溶媒を捕集し、120℃で3〜4時間保った。混合物をゲル化点未満に保ち、混合物は、約1.36:1のアミン:エポキシの当量比であった。得られた樹脂を、酢酸及び水の溶液に移し、樹脂溶液を生成した。架橋剤は存在しなかった。
イソシアネート前駆体ポリマーは、次のように製造される。2官能性イソシアネート(例えば、イソホロンジイソシアネート(IPDI)、2−イソシアナトプロピルシクロヘキシルイソシアネート、4−メチルシクロヘキサン−1,3−ジイソシアネート(H−TDI)、及び/若しくは、1,3−ビス(イソシアナトメチル)シクロヘキサン)、並びに/又は、別のジイソシアネート(例えば、4,4’−ジフェニルメタンジイソシアネート(MDI))を、窒素(N2)ブランケットの下で、反応容器において、(複数の)イソシアネート過剰で、芳香族ジオール(例えば、ビスフェノールA、又は1,6−ヘキサンジオール)と混合し、50〜100℃に加熱し、反応容器にスズ又はビスマス触媒を加える。反応物は発熱する。材料を冷却し、イソシアネートと反応しない有機溶媒(例えば、トルエン)を、ゆっくりと加える。得られるプレポリマーはイソシアネート官能性である。
ポリエーテルアミンを、窒素(N2)ブランケットの下で、反応容器に入れ、90℃に加熱し、例3のプレポリマーを、ポリエーテルアミンが過剰であるような量で加える。次いで、成分を約50℃に加熱し、真空ストリッピングを行い、溶媒を捕集し、90〜100℃に3〜4時間保つ。混合物はゲル化点未満に保つ。得られる樹脂を、酢酸及び水の溶液に移して、樹脂溶液を生成する。
アニオンポリマーを含む樹脂溶液が、次のように製造される。
ポリエーテルアミンと、ビスフェノールAのジグリシジルエーテル前駆体及びBis Aを含むエポキシ前駆体ポリマーとから生成される樹脂を利用する例2の樹脂溶液が、30%のNV濃度及び70%中和に調節されて、例6.1を生成した。表1に示されるように、例6.1に比べて異なる分子量の疎水性及び親水性単位を用い、例2において記載されたようにして、さらなる樹脂もまた製造された。例6.2では、エポキシ前駆体ポリマーが、単なるビスフェノールのジグリシジルエーテルにより置き換えられた。図5は、例6.1及び6.2についての粘度対温度の対数プロットを示す。図5において、より親水性のポリマーを生じる、より短い(より低分子量の)疎水性単位の使用(例6.2)により、熱増粘挙動が達成された温度領域が、より長い(より高分子量の)疎水性単位に比べて、拡大されている又は広げられていることが示されている。30%のNVで、例6.1で極大粘度が現れる熱増粘温度は約60〜65℃であった。例6.2では、試験件下に、極大粘度には達しなかったが、極大粘度は、>90℃で現れると予想される。例6.3では、例6.1のポリエーテルアミンが、より高分子量のポリエーテルアミンに置き換えられた。図6は、52%の総中和(TN)並びに20%及び25%の不揮発分(NV)含有量での例6.3についての粘度対温度の対数プロットを示す。20%のNVでは、極大粘度が現れた熱増粘温度は、約80℃であった。25%のNVでは、極大粘度が現れた熱増粘温度は、約55〜60℃であった。さらに、より高分子量のポリエーテルアミンを有する例6.3の25%の不揮発分(NV)含有量で、様々なレベルに中和し、図7は、100%を超える中和を含めた、様々な総中和(TN)での粘度対温度の対数プロットを示す。熱増粘温度は、50%TNでは約55〜60℃であり、70%TNでは約65℃であり、110%TNでは約70℃であった。
例2に似た樹脂系が、次の変更をして製造された:1/2(当量によって)の例1の疎水性プレポリマーを、反応容器に入れた。親水性エポキシ樹脂を、例1のプレポリマーと等しい当量で加えた。すなわち、エポキシプレポリマーは、疎水性及び親水性含有量に関して等モルであった(また、その疎水性と親水性MWの比は1であった)。アミン:エポキシの当量比は、1.36:1に保たれた。例2で使用された方法に従って、樹脂溶液が生成された。得られた粘度対温度の対数プロットを図8に示す。熱増粘温度は、約50℃であり、粘度曲線は、1未満の疎水性と親水性MW比で製造された樹脂系に比べて、平らになっていた。
比較例
この比較例では、例6.1のポリエーテルアミンが、より低分子量のポリエーテルアミンに置き換えられた。これにより、疎水性単位のおおよその数平均分子量(Mn)は、1000であり、親水性単位のMnは、400であった。疎水性と親水性Mn比は2.5であった。より短い(より低分子量の)親水性単位の使用により、より疎水性のポリマーを生じ、熱増粘挙動を生じなかった。
Claims (12)
- エポキシ樹脂、フェノール−ホルムアルデヒド樹脂、ポリウレタン樹脂、ポリエステル樹脂、アクリル−ウレタン樹脂、メラミン樹脂、メラミン−ホルムアルデヒド樹脂、アミノ樹脂、及びこれらの組合せから選択される、疎水性基及び親水性基を含む樹脂、並びに
水を含み、
任意に、塩生成成分を含み、
架橋剤を実質的に含まず、
雰囲気圧力で、20℃から<100℃の温度領域において、少なくとも100倍の絶対粘度(dynamic viscosity)増加を示す、
非コーティング用途のための熱増粘性樹脂水溶液であって、
樹脂が、(A)芳香族ポリオール及びエポキシ官能性材料を含むエポキシプレポリマーと(B)ジ−又はポリアミンとの反応生成物である、熱増粘性樹脂水溶液。 - エポキシ官能性材料が、多価アルコールのジ−又はポリグリシジルエーテルを含み、ジ−又はポリアミンがポリオキシアルキレンアミンを含む、請求項1に記載の熱増粘性樹脂水溶液。
- 芳香族ポリオールがビスフェノールA(Bis A)を含み、エポキシ官能性材料がビスフェノールAのジグリシジルエーテル(DGEBA)を含み、ジ−又はポリアミンがポリエーテルアミンを含む、請求項1に記載の熱増粘性樹脂水溶液。
- 塩生成成分が存在し、有機酸、鉱酸及び窒素含有化合物から成る群から選択される、請求項1に記載の熱増粘性樹脂水溶液。
- 0.5〜60質量%の範囲の反応生成物、
40〜99.5質量%の範囲の水、及び
0〜25質量%の範囲の有機揮発分、
を含み、
中和パーセントが40〜110%の範囲にある、
請求項3に記載の熱増粘性樹脂水溶液。 - 請求項1から5のいずれか一項に記載の熱増粘性樹脂水溶液、及び
熱増粘性樹脂水溶液のための担体、
を含む感温性製品。 - 担体が、液体不透過性パウチ又は複数のマイクロカプセルシェルを備え、製品の表面が、生体と接触すると、より支持性になる、請求項6に記載の感温性製品。
- 担体が別の液体を含み、製品が雰囲気温度より高い温度での使用中に増粘する、請求項6に記載の感温性製品。
- エネルギーを吸収するのに効果的であり、それによって、その近傍の物品に対する保護をもたらす、請求項6に記載の感温性製品。
- 工業用流体であり、熱増粘性樹脂水溶液の樹脂がレオロジー制御剤として効果的である、請求項8に記載の感温性製品。
- (A)エポキシ樹脂、フェノール−ホルムアルデヒド樹脂、ポリウレタン樹脂、ポリエステル樹脂、アクリル−ウレタン樹脂、メラミン樹脂、メラミン−ホルムアルデヒド樹脂、アミノ樹脂、及びこれらの組合せから選択される、疎水性基及び親水性基を含む樹脂を生成すること、並びに
(B)架橋剤の実質的な不在下に、樹脂を、水及び任意の塩生成成分に溶かすこと
を含み、
これによって、雰囲気圧力で、20℃から<100℃の温度領域において、少なくとも100倍の動粘度増加(kinematic viscosity)を示す熱増粘性樹脂水溶液を生成する、非コーティング用途のための熱増粘性樹脂水溶液を製造する方法であって、
樹脂が、(A)芳香族ポリオール及びエポキシ官能性材料を含むエポキシプレポリマーと(B)ジ−又はポリアミンとの反応生成物であり、芳香族ポリオールがビスフェノールA(Bis A)を含み、エポキシ官能性材料がビスフェノールAのジグリシジルエーテル(DGEBA)を含み、ジ−又はポリアミンがポリエーテルアミンを含む、方法。 - 非コーティング用途のための感温性製品を提供する方法であって、
請求項1から5のいずれか一項に記載の熱増粘性樹脂水溶液を得ること、
熱増粘性樹脂水溶液を担体に組み入れること、及び
雰囲気圧力で、40〜<100℃への温度変化で、構造が変化する、感温性製品を形成すること
を含む、方法。
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US62/050,290 | 2014-09-15 | ||
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US62/205,074 | 2015-08-14 | ||
PCT/US2015/049306 WO2016044045A1 (en) | 2014-09-15 | 2015-09-10 | Aqueous thermo-thickening resin solutions |
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US6417292B1 (en) | 2000-04-07 | 2002-07-09 | Ppg Industries Ohio, Inc. | Electrodepositable coating compositions including ungelled reaction products of epoxy functional polyesters and amines coated substrates and methods of electrocoating using the same |
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US10538664B2 (en) | 2020-01-21 |
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