JP6528581B2 - ブレーク装置、基板のブレーク方法、および、ブレーク装置の基板載置部用部材 - Google Patents
ブレーク装置、基板のブレーク方法、および、ブレーク装置の基板載置部用部材Info
- Publication number
- JP6528581B2 JP6528581B2 JP2015148437A JP2015148437A JP6528581B2 JP 6528581 B2 JP6528581 B2 JP 6528581B2 JP 2015148437 A JP2015148437 A JP 2015148437A JP 2015148437 A JP2015148437 A JP 2015148437A JP 6528581 B2 JP6528581 B2 JP 6528581B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- elastic body
- main surface
- break
- breaking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/20—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by planing, e.g. channelling by means of planing tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/20—Cutting beds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015148437A JP6528581B2 (ja) | 2015-07-28 | 2015-07-28 | ブレーク装置、基板のブレーク方法、および、ブレーク装置の基板載置部用部材 |
KR1020160087243A KR102511164B1 (ko) | 2015-07-28 | 2016-07-11 | 브레이크장치, 기판의 브레이크방법, 및 브레이크장치의 기판 재치부용 부재 |
CN201610562421.2A CN106393453B (zh) | 2015-07-28 | 2016-07-18 | 切断装置、基板的切断方法及切断装置的基板载置部用构件 |
TW105122685A TWI678344B (zh) | 2015-07-28 | 2016-07-19 | 裂斷裝置、基板之裂斷方法、及裂斷裝置之基板載置部用構件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015148437A JP6528581B2 (ja) | 2015-07-28 | 2015-07-28 | ブレーク装置、基板のブレーク方法、および、ブレーク装置の基板載置部用部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017024375A JP2017024375A (ja) | 2017-02-02 |
JP6528581B2 true JP6528581B2 (ja) | 2019-06-12 |
Family
ID=57946241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015148437A Active JP6528581B2 (ja) | 2015-07-28 | 2015-07-28 | ブレーク装置、基板のブレーク方法、および、ブレーク装置の基板載置部用部材 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6528581B2 (ko) |
KR (1) | KR102511164B1 (ko) |
CN (1) | CN106393453B (ko) |
TW (1) | TWI678344B (ko) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000124537A (ja) * | 1998-10-21 | 2000-04-28 | Sharp Corp | 半導体レーザチップの製造方法とその方法に用いられる製造装置 |
JP4762671B2 (ja) * | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | ダイシングテープ、および半導体ウェハダイシング方法 |
DE102007001133B4 (de) * | 2007-01-05 | 2008-09-04 | Mdi Schott Advanced Processing Gmbh | Verfahren und Vorrichtung zum Brechen von Dünnglasscheiben |
EP2261954B1 (en) * | 2008-04-01 | 2020-01-22 | Shin-Etsu Chemical Co., Ltd. | Method for producing soi substrate |
TWI529790B (zh) * | 2010-07-05 | 2016-04-11 | Mitsuboshi Diamond Ind Co Ltd | Breaking device |
KR101751046B1 (ko) * | 2011-02-01 | 2017-06-26 | 삼성전자 주식회사 | 웨이퍼 다이싱 프레스 및 그의 반도체 웨이퍼 다이싱 시스템 |
JP5824365B2 (ja) * | 2012-01-16 | 2015-11-25 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法 |
JP6039363B2 (ja) | 2012-10-26 | 2016-12-07 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法並びに分断装置 |
JP2015030661A (ja) * | 2013-08-07 | 2015-02-16 | 株式会社レミ | ガラス基板のブレーク方法 |
JP6119551B2 (ja) * | 2013-10-16 | 2017-04-26 | 三星ダイヤモンド工業株式会社 | 弾性支持板、破断装置及び分断方法 |
JP6243699B2 (ja) * | 2013-10-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断装置 |
JP6268917B2 (ja) * | 2013-10-25 | 2018-01-31 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
-
2015
- 2015-07-28 JP JP2015148437A patent/JP6528581B2/ja active Active
-
2016
- 2016-07-11 KR KR1020160087243A patent/KR102511164B1/ko active IP Right Grant
- 2016-07-18 CN CN201610562421.2A patent/CN106393453B/zh active Active
- 2016-07-19 TW TW105122685A patent/TWI678344B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201710197A (zh) | 2017-03-16 |
CN106393453A (zh) | 2017-02-15 |
CN106393453B (zh) | 2019-12-10 |
JP2017024375A (ja) | 2017-02-02 |
KR102511164B1 (ko) | 2023-03-17 |
TWI678344B (zh) | 2019-12-01 |
KR20170013807A (ko) | 2017-02-07 |
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