JP6515841B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP6515841B2
JP6515841B2 JP2016045439A JP2016045439A JP6515841B2 JP 6515841 B2 JP6515841 B2 JP 6515841B2 JP 2016045439 A JP2016045439 A JP 2016045439A JP 2016045439 A JP2016045439 A JP 2016045439A JP 6515841 B2 JP6515841 B2 JP 6515841B2
Authority
JP
Japan
Prior art keywords
electronic component
heat
heat sink
electronic device
conducting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016045439A
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English (en)
Japanese (ja)
Other versions
JP2017162963A (ja
JP2017162963A5 (enExample
Inventor
泰斗 井▲崎▼
泰斗 井▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2016045439A priority Critical patent/JP6515841B2/ja
Priority to PCT/JP2017/009059 priority patent/WO2017154923A1/ja
Publication of JP2017162963A publication Critical patent/JP2017162963A/ja
Publication of JP2017162963A5 publication Critical patent/JP2017162963A5/ja
Application granted granted Critical
Publication of JP6515841B2 publication Critical patent/JP6515841B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2016045439A 2016-03-09 2016-03-09 電子装置 Active JP6515841B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016045439A JP6515841B2 (ja) 2016-03-09 2016-03-09 電子装置
PCT/JP2017/009059 WO2017154923A1 (ja) 2016-03-09 2017-03-07 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016045439A JP6515841B2 (ja) 2016-03-09 2016-03-09 電子装置

Publications (3)

Publication Number Publication Date
JP2017162963A JP2017162963A (ja) 2017-09-14
JP2017162963A5 JP2017162963A5 (enExample) 2018-06-21
JP6515841B2 true JP6515841B2 (ja) 2019-05-22

Family

ID=59790690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016045439A Active JP6515841B2 (ja) 2016-03-09 2016-03-09 電子装置

Country Status (2)

Country Link
JP (1) JP6515841B2 (enExample)
WO (1) WO2017154923A1 (enExample)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004103641A (ja) * 2002-09-05 2004-04-02 Denso Corp 半導体装置
JP2005142328A (ja) * 2003-11-06 2005-06-02 Mitsubishi Electric Corp 熱伝達装置
JP5257229B2 (ja) * 2004-04-14 2013-08-07 株式会社デンソー 半導体装置およびヒートシンク
JP5202573B2 (ja) * 2010-05-10 2013-06-05 三菱電機株式会社 車両用制御装置一体型回転電機
JP5898575B2 (ja) * 2012-06-21 2016-04-06 日立オートモティブシステムズ株式会社 半導体装置
JP6027945B2 (ja) * 2013-06-05 2016-11-16 株式会社デンソー 電子制御装置
JP6316221B2 (ja) * 2015-01-30 2018-04-25 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
WO2017154923A1 (ja) 2017-09-14
JP2017162963A (ja) 2017-09-14

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