JP6505693B2 - ナノ構造及びナノ構造化物品の作製方法 - Google Patents

ナノ構造及びナノ構造化物品の作製方法 Download PDF

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Publication number
JP6505693B2
JP6505693B2 JP2016529853A JP2016529853A JP6505693B2 JP 6505693 B2 JP6505693 B2 JP 6505693B2 JP 2016529853 A JP2016529853 A JP 2016529853A JP 2016529853 A JP2016529853 A JP 2016529853A JP 6505693 B2 JP6505693 B2 JP 6505693B2
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Prior art keywords
substrate
plasma
film
electrode
etching
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Japanese (ja)
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JP2016532576A5 (enExample
JP2016532576A (ja
Inventor
エム.デイビッド モーゼス
エム.デイビッド モーゼス
ユイ ター−ホワ
ユイ ター−ホワ
エス.ベイツ ダニエル
エス.ベイツ ダニエル
セス ジェイシュリー
セス ジェイシュリー
エス.バーガー マイケル
エス.バーガー マイケル
フランケ カーステン
フランケ カーステン
エフ.ツェントマイアー ゼバスチャン
エフ.ツェントマイアー ゼバスチャン
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00031—Regular or irregular arrays of nanoscale structures, e.g. etch mask layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
    • F24S70/00—Details of absorbing elements
    • F24S70/60—Details of absorbing elements characterised by the structure or construction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H01J2237/3341—Reactive etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Laminated Bodies (AREA)
  • Drying Of Semiconductors (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Chemical Vapour Deposition (AREA)
JP2016529853A 2013-07-26 2014-07-23 ナノ構造及びナノ構造化物品の作製方法 Active JP6505693B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361858670P 2013-07-26 2013-07-26
US61/858,670 2013-07-26
US201361867733P 2013-08-20 2013-08-20
US61/867,733 2013-08-20
US201462018761P 2014-06-30 2014-06-30
US62/018,761 2014-06-30
PCT/US2014/047782 WO2015013387A1 (en) 2013-07-26 2014-07-23 Method of making a nanostructure and nanostructured articles

Publications (3)

Publication Number Publication Date
JP2016532576A JP2016532576A (ja) 2016-10-20
JP2016532576A5 JP2016532576A5 (enExample) 2017-08-17
JP6505693B2 true JP6505693B2 (ja) 2019-04-24

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ID=52393807

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JP2016529853A Active JP6505693B2 (ja) 2013-07-26 2014-07-23 ナノ構造及びナノ構造化物品の作製方法

Country Status (8)

Country Link
US (1) US10119190B2 (enExample)
EP (1) EP3024777B1 (enExample)
JP (1) JP6505693B2 (enExample)
KR (2) KR20210151999A (enExample)
CN (1) CN105431376B (enExample)
BR (1) BR112016001710A2 (enExample)
SG (2) SG11201600606TA (enExample)
WO (1) WO2015013387A1 (enExample)

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JP6925973B2 (ja) 2015-02-27 2021-08-25 スリーエム イノベイティブ プロパティズ カンパニー 両面テープ
CN108136065A (zh) * 2015-06-29 2018-06-08 3M创新有限公司 抗微生物制品及其使用方法
TWI769988B (zh) 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
CN108348632B (zh) * 2015-11-13 2022-04-15 3M创新有限公司 抗微生物制品及其使用方法
CN108430524B (zh) 2015-11-13 2021-07-20 3M创新有限公司 抗微生物制品及其使用方法
EP3455319A4 (en) * 2016-05-13 2019-12-25 3M Innovative Properties Company HEAT-RESISTANT PROTECTIVE FILM BASED ON SILOXANE
CN106542494B (zh) * 2016-09-26 2017-12-26 西北工业大学 一种用于制备多层不等高微纳结构的方法
CN106549074A (zh) * 2016-12-08 2017-03-29 上海空间电源研究所 一种用于临近空间环境的薄硅太阳电池组件及其制备方法
JP2020519496A (ja) * 2017-05-10 2020-07-02 スリーエム イノベイティブ プロパティズ カンパニー フルオロポリマー物品及び関連する方法
EP3732733A1 (en) 2017-12-29 2020-11-04 3M Innovative Properties Company Anti-reflective surface structures
JP7660372B2 (ja) 2018-01-05 2025-04-11 スリーエム イノベイティブ プロパティズ カンパニー 迷光吸収フィルム
US11661536B2 (en) 2018-02-28 2023-05-30 3M Innovative Properties Company Adhesives comprising polymerized units of secondary hexyl (meth)acrylates
US12099222B2 (en) 2018-08-23 2024-09-24 3M Innovative Properties Company Photochromic articles
WO2020044164A1 (en) 2018-08-31 2020-03-05 3M Innovative Properties Company Articles including nanostructured surfaces and interpenetrating layers, and methods of making same
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CN113727827B (zh) * 2019-06-11 2024-12-13 纳卢克斯株式会社 在表面具备微细凹凸结构的塑料元件的制造方法
CN110329985B (zh) * 2019-06-18 2022-02-15 长沙新材料产业研究院有限公司 一种金刚石表面复杂结构及其制备方法
WO2021152479A1 (en) * 2020-01-29 2021-08-05 3M Innovative Properties Company Nanostructured article
WO2021260629A1 (en) 2020-06-25 2021-12-30 3M Innovative Properties Company Polishing pads and systems for and methods of using same
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EP4284176A1 (en) 2021-01-28 2023-12-06 3M Innovative Properties Company Antimicrobial compositions and articles and related methods
CN114171641B (zh) * 2021-11-30 2024-05-31 北京燕东微电子科技有限公司 氧化钒薄膜的刻蚀方法与半导体器件的制造方法
CN116619860B (zh) * 2023-05-11 2026-04-21 合肥工业大学 一种光驱动柔性薄膜及其制备方法与在船只动力系统中的应用

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Also Published As

Publication number Publication date
KR20160037961A (ko) 2016-04-06
KR20210151999A (ko) 2021-12-14
EP3024777A4 (en) 2017-01-11
SG10201704677QA (en) 2017-07-28
WO2015013387A1 (en) 2015-01-29
US10119190B2 (en) 2018-11-06
CN105431376A (zh) 2016-03-23
US20170067150A1 (en) 2017-03-09
SG11201600606TA (en) 2016-02-26
BR112016001710A2 (pt) 2017-08-01
EP3024777B1 (en) 2024-05-15
JP2016532576A (ja) 2016-10-20
CN105431376B (zh) 2018-08-31
EP3024777A1 (en) 2016-06-01

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