KR20210151999A - 나노구조체의 제조 방법 및 나노구조화 물품 - Google Patents

나노구조체의 제조 방법 및 나노구조화 물품 Download PDF

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Publication number
KR20210151999A
KR20210151999A KR1020217039500A KR20217039500A KR20210151999A KR 20210151999 A KR20210151999 A KR 20210151999A KR 1020217039500 A KR1020217039500 A KR 1020217039500A KR 20217039500 A KR20217039500 A KR 20217039500A KR 20210151999 A KR20210151999 A KR 20210151999A
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KR
South Korea
Prior art keywords
substrate
plasma
article
nanostructures
film
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Ceased
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KR1020217039500A
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English (en)
Korean (ko)
Inventor
모세스 엠 데이비드
타-화 유
다니엘 에스 베이츠
제이쉬리 세쓰
마이클 에스 버거
카르스텐 프랑케
세바스챤 에프 제헨트마이어
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
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Publication of KR20210151999A publication Critical patent/KR20210151999A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00031—Regular or irregular arrays of nanoscale structures, e.g. etch mask layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
    • F24S70/00—Details of absorbing elements
    • F24S70/60—Details of absorbing elements characterised by the structure or construction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H01J2237/3341—Reactive etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Laminated Bodies (AREA)
  • Drying Of Semiconductors (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020217039500A 2013-07-26 2014-07-23 나노구조체의 제조 방법 및 나노구조화 물품 Ceased KR20210151999A (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US201361858670P 2013-07-26 2013-07-26
US61/858,670 2013-07-26
US201361867733P 2013-08-20 2013-08-20
US61/867,733 2013-08-20
US201462018761P 2014-06-30 2014-06-30
US62/018,761 2014-06-30
PCT/US2014/047782 WO2015013387A1 (en) 2013-07-26 2014-07-23 Method of making a nanostructure and nanostructured articles
KR1020167004660A KR20160037961A (ko) 2013-07-26 2014-07-23 나노구조체의 제조 방법 및 나노구조화 물품

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167004660A Division KR20160037961A (ko) 2013-07-26 2014-07-23 나노구조체의 제조 방법 및 나노구조화 물품

Publications (1)

Publication Number Publication Date
KR20210151999A true KR20210151999A (ko) 2021-12-14

Family

ID=52393807

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Application Number Title Priority Date Filing Date
KR1020217039500A Ceased KR20210151999A (ko) 2013-07-26 2014-07-23 나노구조체의 제조 방법 및 나노구조화 물품
KR1020167004660A Ceased KR20160037961A (ko) 2013-07-26 2014-07-23 나노구조체의 제조 방법 및 나노구조화 물품

Family Applications After (1)

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KR1020167004660A Ceased KR20160037961A (ko) 2013-07-26 2014-07-23 나노구조체의 제조 방법 및 나노구조화 물품

Country Status (8)

Country Link
US (1) US10119190B2 (enExample)
EP (1) EP3024777B1 (enExample)
JP (1) JP6505693B2 (enExample)
KR (2) KR20210151999A (enExample)
CN (1) CN105431376B (enExample)
BR (1) BR112016001710A2 (enExample)
SG (2) SG11201600606TA (enExample)
WO (1) WO2015013387A1 (enExample)

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EP3373985B1 (en) 2015-11-13 2021-03-17 3M Innovative Properties Company Anti-microbial articles and methods of using same
EP3373984B1 (en) 2015-11-13 2020-12-23 3M Innovative Properties Company Anti-microbial articles and methods of using same
WO2017193369A1 (en) * 2016-05-13 2017-11-16 3M Innovative Properties Company Thermally stable siloxane-based protection film
CN106542494B (zh) * 2016-09-26 2017-12-26 西北工业大学 一种用于制备多层不等高微纳结构的方法
CN106549074A (zh) * 2016-12-08 2017-03-29 上海空间电源研究所 一种用于临近空间环境的薄硅太阳电池组件及其制备方法
WO2018208574A1 (en) * 2017-05-10 2018-11-15 3M Innovative Properties Company Fluoropolymer articles and related methods
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CN114171641B (zh) * 2021-11-30 2024-05-31 北京燕东微电子科技有限公司 氧化钒薄膜的刻蚀方法与半导体器件的制造方法

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Also Published As

Publication number Publication date
SG10201704677QA (en) 2017-07-28
WO2015013387A1 (en) 2015-01-29
JP6505693B2 (ja) 2019-04-24
BR112016001710A2 (pt) 2017-08-01
SG11201600606TA (en) 2016-02-26
KR20160037961A (ko) 2016-04-06
CN105431376B (zh) 2018-08-31
EP3024777A1 (en) 2016-06-01
JP2016532576A (ja) 2016-10-20
US20170067150A1 (en) 2017-03-09
CN105431376A (zh) 2016-03-23
EP3024777B1 (en) 2024-05-15
EP3024777A4 (en) 2017-01-11
US10119190B2 (en) 2018-11-06

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