JP6500170B2 - 基板への接着テープ貼り付け装置及び貼り付け方法 - Google Patents

基板への接着テープ貼り付け装置及び貼り付け方法 Download PDF

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JP6500170B2
JP6500170B2 JP2015061216A JP2015061216A JP6500170B2 JP 6500170 B2 JP6500170 B2 JP 6500170B2 JP 2015061216 A JP2015061216 A JP 2015061216A JP 2015061216 A JP2015061216 A JP 2015061216A JP 6500170 B2 JP6500170 B2 JP 6500170B2
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adhesive tape
substrate
cutting
wafer
tape
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JP2016181613A5 (enExample
JP2016181613A (ja
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隆樹 谷川
隆樹 谷川
耕一 北村
耕一 北村
植田　義明
義明 植田
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Takatori Corp
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  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015061216A 2015-03-24 2015-03-24 基板への接着テープ貼り付け装置及び貼り付け方法 Active JP6500170B2 (ja)

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JP2015061216A JP6500170B2 (ja) 2015-03-24 2015-03-24 基板への接着テープ貼り付け装置及び貼り付け方法

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JP2015061216A JP6500170B2 (ja) 2015-03-24 2015-03-24 基板への接着テープ貼り付け装置及び貼り付け方法

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JP2016181613A JP2016181613A (ja) 2016-10-13
JP2016181613A5 JP2016181613A5 (enExample) 2018-06-14
JP6500170B2 true JP6500170B2 (ja) 2019-04-17

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Publication number Priority date Publication date Assignee Title
EP3598480B1 (en) 2018-07-18 2020-09-23 Infineon Technologies AG Device and method for debonding a structure from a main surface region of a carrier
CN110299549B (zh) * 2019-07-10 2023-06-27 苏州巨一智能装备有限公司 膜电极组件高精度组装装置及其方法
WO2023017700A1 (ja) * 2021-08-11 2023-02-16 東京応化工業株式会社 貼付装置、及び貼付方法

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Publication number Priority date Publication date Assignee Title
JP2732739B2 (ja) * 1992-01-13 1998-03-30 日立造船株式会社 導体箔の製造方法
JP2966409B1 (ja) * 1998-10-08 1999-10-25 グンゼ株式会社 シート材の切断装置
JP3607143B2 (ja) * 1999-11-19 2005-01-05 株式会社タカトリ 半導体ウエハへの保護テープ貼り付け方法及び装置
JP2001269899A (ja) * 2000-03-24 2001-10-02 Gunze Ltd シート材の切断方法及び切断装置
JP4530638B2 (ja) * 2003-10-07 2010-08-25 日東電工株式会社 半導体ウエハへの保護テープ貼付方法及び貼付装置
JP5942121B2 (ja) * 2012-03-06 2016-06-29 群馬県 ロータリーダイカッターシステム

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