JP6491903B2 - 基板洗浄装置および方法 - Google Patents

基板洗浄装置および方法 Download PDF

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JP6491903B2
JP6491903B2 JP2015030489A JP2015030489A JP6491903B2 JP 6491903 B2 JP6491903 B2 JP 6491903B2 JP 2015030489 A JP2015030489 A JP 2015030489A JP 2015030489 A JP2015030489 A JP 2015030489A JP 6491903 B2 JP6491903 B2 JP 6491903B2
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substrate
roller
cleaning
slip
rotating
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JP2016152382A5 (enExample
JP2016152382A (ja
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佳宣 磯野
佳宣 磯野
丸山　徹
徹 丸山
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Ebara Corp
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Ebara Corp
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JP2015030489A 2015-02-19 2015-02-19 基板洗浄装置および方法 Active JP6491903B2 (ja)

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JP2016152382A JP2016152382A (ja) 2016-08-22
JP2016152382A5 JP2016152382A5 (enExample) 2018-02-08
JP6491903B2 true JP6491903B2 (ja) 2019-03-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023119847A1 (ja) * 2021-12-24 2023-06-29 株式会社荏原製作所 基板処理方法および基板処理装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6792512B2 (ja) 2017-05-16 2020-11-25 株式会社荏原製作所 基板洗浄装置および基板処理装置
JP7115403B2 (ja) * 2019-04-11 2022-08-09 株式会社Sumco ウェーハの回転検出方法及びウェーハの回転検出システム
JP7078602B2 (ja) 2019-12-25 2022-05-31 株式会社荏原製作所 洗浄装置、研磨装置、洗浄装置において基板の回転速度を算出する装置および方法
CN114472265B (zh) * 2021-12-31 2022-11-08 华海清科股份有限公司 一种晶圆清洗方法及晶圆清洗装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10289889A (ja) * 1997-04-16 1998-10-27 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11219930A (ja) * 1998-01-30 1999-08-10 Ebara Corp 洗浄装置
JP4620911B2 (ja) * 2001-09-05 2011-01-26 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP2003092278A (ja) * 2001-09-18 2003-03-28 Shibaura Mechatronics Corp 基板の処理装置及び処理方法
US7685667B2 (en) * 2005-06-14 2010-03-30 Taiwan Semiconductor Manufacturing Co., Ltd. Post-CMP cleaning system
JP2008270753A (ja) * 2007-03-09 2008-11-06 Applied Materials Inc クリーニング時における基板の回転のモニタ方法及び装置
JP6125884B2 (ja) * 2013-04-23 2017-05-10 株式会社荏原製作所 基板処理装置及び処理基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023119847A1 (ja) * 2021-12-24 2023-06-29 株式会社荏原製作所 基板処理方法および基板処理装置
JP2023095345A (ja) * 2021-12-24 2023-07-06 株式会社荏原製作所 基板処理方法および基板処理装置

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