JP6490771B1 - 位置検出装置、位置検出方法、および、蒸着装置 - Google Patents
位置検出装置、位置検出方法、および、蒸着装置 Download PDFInfo
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- JP6490771B1 JP6490771B1 JP2017186399A JP2017186399A JP6490771B1 JP 6490771 B1 JP6490771 B1 JP 6490771B1 JP 2017186399 A JP2017186399 A JP 2017186399A JP 2017186399 A JP2017186399 A JP 2017186399A JP 6490771 B1 JP6490771 B1 JP 6490771B1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017186399A JP6490771B1 (ja) | 2017-09-27 | 2017-09-27 | 位置検出装置、位置検出方法、および、蒸着装置 |
| TW107117838A TWI665321B (zh) | 2017-09-27 | 2018-05-25 | 位置檢測裝置、位置檢測方法、及蒸鍍裝置 |
| KR1020180071404A KR102125839B1 (ko) | 2017-09-27 | 2018-06-21 | 위치검출장치, 위치검출방법, 및 증착장치 |
| CN201810679701.0A CN109554662B (zh) | 2017-09-27 | 2018-06-27 | 位置检测装置、位置检测方法以及蒸镀装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017186399A JP6490771B1 (ja) | 2017-09-27 | 2017-09-27 | 位置検出装置、位置検出方法、および、蒸着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6490771B1 true JP6490771B1 (ja) | 2019-03-27 |
| JP2019062105A JP2019062105A (ja) | 2019-04-18 |
Family
ID=65864426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017186399A Active JP6490771B1 (ja) | 2017-09-27 | 2017-09-27 | 位置検出装置、位置検出方法、および、蒸着装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6490771B1 (ko) |
| KR (1) | KR102125839B1 (ko) |
| CN (1) | CN109554662B (ko) |
| TW (1) | TWI665321B (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020178033A (ja) * | 2019-04-18 | 2020-10-29 | 株式会社ディスコ | 加工装置及び被加工物の加工方法 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6472859B1 (ja) * | 2017-10-04 | 2019-02-20 | 株式会社アルバック | 位置検出装置、および、蒸着装置 |
| CN113490762A (zh) | 2019-03-15 | 2021-10-08 | 应用材料公司 | 沉积掩模、及制造和使用沉积掩模的方法 |
| US11189516B2 (en) | 2019-05-24 | 2021-11-30 | Applied Materials, Inc. | Method for mask and substrate alignment |
| US11538706B2 (en) | 2019-05-24 | 2022-12-27 | Applied Materials, Inc. | System and method for aligning a mask with a substrate |
| WO2020251696A1 (en) | 2019-06-10 | 2020-12-17 | Applied Materials, Inc. | Processing system for forming layers |
| US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
| KR102220194B1 (ko) * | 2019-08-20 | 2021-02-25 | 주식회사 커미조아 | 보정용 패널, 패널검사용 보정장치 및 패널 검사장치의 보정방법 |
| KR102221447B1 (ko) * | 2019-09-24 | 2021-03-02 | 주식회사 커미조아 | 판재결함 검출방법 및 장치 |
| CN112713102B (zh) * | 2019-10-25 | 2022-07-15 | 苏州阿特斯阳光电力科技有限公司 | 一种图形对位检测方法 |
| CN111554601B (zh) * | 2020-04-27 | 2021-12-28 | 上海果纳半导体技术有限公司 | 晶圆前端传送系统 |
| CN111554591B (zh) * | 2020-04-27 | 2024-03-12 | 上海果纳半导体技术有限公司 | 半导体芯片处理装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11350137A (ja) * | 1998-06-12 | 1999-12-21 | Sumitomo Heavy Ind Ltd | 真空成膜装置における基板支持装置 |
| JP2005172686A (ja) * | 2003-12-12 | 2005-06-30 | Moritex Corp | 両面加工位置計測装置及びその方法 |
| JP4658998B2 (ja) * | 2007-06-04 | 2011-03-23 | 東京エレクトロン株式会社 | シェル |
| JP2010067705A (ja) * | 2008-09-09 | 2010-03-25 | Adwelds:Kk | アライメント方法およびアライメント装置 |
| JP5017628B2 (ja) * | 2008-09-30 | 2012-09-05 | 株式会社ユタカ | 側面検査装置 |
| JP2013001947A (ja) | 2011-06-15 | 2013-01-07 | Ulvac Japan Ltd | アライメント装置 |
| US9362153B2 (en) * | 2014-01-23 | 2016-06-07 | Metal Industries Research&Development Centre | Method for aligning substrates in different spaces and having different sizes |
| JP6590599B2 (ja) * | 2014-11-28 | 2019-10-16 | キヤノン株式会社 | 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 |
-
2017
- 2017-09-27 JP JP2017186399A patent/JP6490771B1/ja active Active
-
2018
- 2018-05-25 TW TW107117838A patent/TWI665321B/zh active
- 2018-06-21 KR KR1020180071404A patent/KR102125839B1/ko active IP Right Grant
- 2018-06-27 CN CN201810679701.0A patent/CN109554662B/zh active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020178033A (ja) * | 2019-04-18 | 2020-10-29 | 株式会社ディスコ | 加工装置及び被加工物の加工方法 |
| JP7325897B2 (ja) | 2019-04-18 | 2023-08-15 | 株式会社ディスコ | 加工装置及び被加工物の加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201915199A (zh) | 2019-04-16 |
| TWI665321B (zh) | 2019-07-11 |
| KR102125839B1 (ko) | 2020-06-23 |
| KR20190036450A (ko) | 2019-04-04 |
| CN109554662B (zh) | 2020-04-17 |
| CN109554662A (zh) | 2019-04-02 |
| JP2019062105A (ja) | 2019-04-18 |
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