JP6488397B2 - 真空堆積のための材料源アレンジメント及びノズル - Google Patents
真空堆積のための材料源アレンジメント及びノズル Download PDFInfo
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- JP6488397B2 JP6488397B2 JP2017542271A JP2017542271A JP6488397B2 JP 6488397 B2 JP6488397 B2 JP 6488397B2 JP 2017542271 A JP2017542271 A JP 2017542271A JP 2017542271 A JP2017542271 A JP 2017542271A JP 6488397 B2 JP6488397 B2 JP 6488397B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45578—Elongated nozzles, tubes with holes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
Claims (14)
- 真空チャンバ(110)内で材料を基板上に堆積するための材料源アレンジメント(100)であって、
分配管(106)であって、前記分配管(106)が前記材料を前記分配管に供給する材料源(102)と流体連通し、前記材料源(102)が蒸発るつぼであり、前記蒸発るつぼ及び前記分配管(106)が共に回転可能であるように装着されている、分配管(106)と、
前記分配管(106)内に供給された前記材料を前記真空チャンバ(110)に導くように構成された少なくとも1つのノズル(712、200)であって、前記ノズル(712、200)を、繰り返し、前記分配管(106)に接続して前記分配管(106)から外すためのねじ山(204)を備えているノズル(712、200)と
を備えている材料源アレンジメント(100)。 - 前記ノズル(712、200)が、外ねじ山を備えており、前記分配管(106)が、前記ノズル(712、200)を繰り返し交換するための内ねじ山を備えている、請求項1に記載の材料源アレンジメント。
- 前記分配管(106)が、1つ又は複数の排出口(107)を備えた線形の蒸気分配シャワーヘッドである、請求項1又は2に記載の材料源アレンジメント。
- 前記分配管(106)が、前記分配管の長さ方向とは異なる方向で、前記分配管(106)内の前記材料を放出するための1つ又は複数の排出口を備えている、請求項1から3のいずれか一項に記載の材料源アレンジメント。
- 1つのノズル(712、200)が、前記分配管(106)の各排出口(107)において設けられる、請求項3又は4に記載の材料源アレンジメント。
- 放出される材料のプルームの種々のコサイン指数をもたらす種々の内径及び種々の設計のうちの少なくとも1つをそれぞれ有する一組のノズルをさらに備えており、各ノズル(712、200)が、前記分配管(106)に交換可能に接続可能であるようにねじ山(204)を有している、請求項1から5のいずれか一項に記載の材料源アレンジメント。
- 前記ノズル(712、200)が、21W/mKよりも大きな熱伝導率値を有するノズル材料を含む材料を含む、請求項1から6のいずれか一項に記載の材料源アレンジメント。
- 前記分配管が、実質的に垂直に延在する、請求項1から7のいずれか一項に記載の材料源アレンジメント。
- 材料を基板(121)上に堆積するための堆積装置であって、
真空チャンバ(110)と、
請求項1から8のいずれか一項に記載の材料源アレンジメント(100)と
を備えている堆積装置。 - 2つ以上の材料源(102)と、
2つ以上の分配管(106)であって、前記2つ以上の分配管のうちの第1の分配管が、前記2つ以上の材料源のうちの第1の材料源と流体連通しており、前記2つ以上の分配管のうちの第2の分配管が、前記2つ以上の材料源のうちの第2の材料源と流体連通している、2つ以上の分配管(106)と
を備えている、請求項9に記載の堆積装置。 - 前記ノズル(712、200)が、外ねじ山を備え、前記分配管(106)が、前記ノズル(712、200)を、繰り返し、前記分配管(106)に接続して前記分配管(106)から外すための内ねじ山を備えており、且つ
前記材料源アレンジメント(100)の前記ノズル(712、200)が、前記真空チャンバ(110)内で、蒸発した材料を基板(121)に向けて方向付けるように配置されている、請求項9又は10に記載の堆積装置。 - 前記ノズル(712、200)が、5mmから15mmの間の外径を有する、請求項9から11のいずれか一項に記載の堆積装置。
- 材料源アレンジメント(100)のための分配管(106)及びノズル(712、200)を設ける方法であって、
真空チャンバ(110)内で基板(121)上に堆積される材料を蒸発させるための材料源(102)を設けることと、
前記材料源(102)と分配管(106)との間の流体連通を可能にするために、前記分配管(106)を前記材料源(102)に接続することであって、前記材料源(102)が蒸発るつぼであり、前記蒸発るつぼ及び前記分配管(106)が共に回転可能であるように装着されている、接続することと、
前記真空チャンバ(110)内で、蒸発した材料を基板(121)に導くための第1のノズル(712、200)を前記分配管(106)に螺合させることと
を含む方法。 - 一組のノズルから第2のノズルを選び、前記第1のノズルを前記第2のノズルと螺合によって交換することをさらに含む、請求項13に記載の方法。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2014/074088 WO2016070941A1 (en) | 2014-11-07 | 2014-11-07 | Material source arrangment and nozzle for vacuum deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017534767A JP2017534767A (ja) | 2017-11-24 |
| JP6488397B2 true JP6488397B2 (ja) | 2019-03-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017542271A Active JP6488397B2 (ja) | 2014-11-07 | 2014-11-07 | 真空堆積のための材料源アレンジメント及びノズル |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20170321318A1 (ja) |
| EP (1) | EP3215650A1 (ja) |
| JP (1) | JP6488397B2 (ja) |
| KR (1) | KR102018865B1 (ja) |
| CN (1) | CN107208252A (ja) |
| WO (1) | WO2016070941A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106637091B (zh) * | 2017-02-24 | 2019-08-30 | 旭科新能源股份有限公司 | 用于薄膜太阳能电池制造的高温蒸发炉 |
| CN108966658A (zh) * | 2017-03-17 | 2018-12-07 | 应用材料公司 | 沉积设备、真空系统、及操作沉积设备的方法 |
| EP3781721A1 (en) * | 2018-04-18 | 2021-02-24 | Applied Materials, Inc. | Evaporation source for deposition of evaporated material on a substrate, deposition apparatus, method for measuring a vapor pressure of evaporated material, and method for determining an evaporation rate of an evaporated material |
| JP7309882B2 (ja) * | 2018-12-21 | 2023-07-18 | アプライド マテリアルズ インコーポレイテッド | 真空チャンバ内で基板をコーティングするための気相堆積装置及び方法 |
| JP2022107982A (ja) * | 2021-01-12 | 2022-07-25 | キヤノントッキ株式会社 | 蒸発源装置、成膜装置、成膜方法及び電子デバイスの製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5904958A (en) * | 1998-03-20 | 1999-05-18 | Rexam Industries Corp. | Adjustable nozzle for evaporation or organic monomers |
| US7194197B1 (en) * | 2000-03-16 | 2007-03-20 | Global Solar Energy, Inc. | Nozzle-based, vapor-phase, plume delivery structure for use in production of thin-film deposition layer |
| WO2003083169A1 (en) * | 2002-04-01 | 2003-10-09 | Ans Inc | Apparatus and method for depositing organic matter of vapor phase |
| JP4545010B2 (ja) | 2005-02-18 | 2010-09-15 | 日立造船株式会社 | 蒸着装置 |
| JP5068458B2 (ja) * | 2006-01-18 | 2012-11-07 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理方法 |
| JP5098708B2 (ja) * | 2008-03-10 | 2012-12-12 | 凸版印刷株式会社 | プラズマ処理用ガス供給管ユニット |
| US20100159132A1 (en) * | 2008-12-18 | 2010-06-24 | Veeco Instruments, Inc. | Linear Deposition Source |
| JP2010159448A (ja) * | 2009-01-07 | 2010-07-22 | Canon Inc | 成膜装置及び成膜方法 |
| KR100977374B1 (ko) * | 2009-08-03 | 2010-08-20 | 텔리오솔라 테크놀로지스 인크 | 대면적 박막형 cigs 태양전지 고속증착 및 양산장비, 그 공정방법 |
| ES2429343T3 (es) * | 2010-12-27 | 2013-11-14 | Riber | Inyector para una fuente de evaporación al vacío |
| PL2524974T3 (pl) * | 2011-05-18 | 2014-09-30 | Riber | Wtryskiwacz dla układu osadzania próżniowego oparów |
| FR2981667B1 (fr) * | 2011-10-21 | 2014-07-04 | Riber | Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide |
| EP2746423B1 (en) * | 2012-12-20 | 2019-12-18 | Applied Materials, Inc. | Deposition arrangement, deposition apparatus and method of operation thereof |
-
2014
- 2014-11-07 KR KR1020177015525A patent/KR102018865B1/ko active Active
- 2014-11-07 JP JP2017542271A patent/JP6488397B2/ja active Active
- 2014-11-07 EP EP14796078.5A patent/EP3215650A1/en not_active Withdrawn
- 2014-11-07 WO PCT/EP2014/074088 patent/WO2016070941A1/en not_active Ceased
- 2014-11-07 CN CN201480083640.1A patent/CN107208252A/zh active Pending
- 2014-11-07 US US15/524,871 patent/US20170321318A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN107208252A (zh) | 2017-09-26 |
| WO2016070941A8 (en) | 2017-06-15 |
| JP2017534767A (ja) | 2017-11-24 |
| EP3215650A1 (en) | 2017-09-13 |
| KR102018865B1 (ko) | 2019-09-05 |
| KR20170083587A (ko) | 2017-07-18 |
| US20170321318A1 (en) | 2017-11-09 |
| WO2016070941A1 (en) | 2016-05-12 |
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