JP2019512044A - 堆積装置、真空システム、及び堆積装置を動作させる方法 - Google Patents
堆積装置、真空システム、及び堆積装置を動作させる方法 Download PDFInfo
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- 239000000463 material Substances 0.000 description 17
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- 239000002184 metal Substances 0.000 description 9
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- 239000004917 carbon fiber Substances 0.000 description 1
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- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
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- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
Description
Claims (15)
- 真空堆積プロセスのための堆積装置(100)であって、
真空チャンバ(130)と、
前記真空チャンバ内に配置された移動可能な堆積ソース(110)と、
前記移動可能な堆積ソースのための媒体供給ラインのための供給通路(124)を提供する供給装置(120)と
を備え、
前記供給装置が、軸方向に偏位可能な要素(122)を備える、
堆積装置(100)。 - 前記軸方向に偏位可能な要素(122)が、エキスパンションジョイント、具体的にはベローズ、より具体的にはエッジ溶接ベローズである、請求項1に記載の堆積装置。
- 前記移動可能な堆積ソース(110)が、第1の方向(150)に直線的に移動可能であり、前記軸方向に偏位可能な要素(122)の軸が、前記第1の方向に延在する、請求項1または2に記載の堆積装置。
- 前記供給装置(122)が、前記媒体供給ラインを前記真空チャンバの外部の環境から前記供給通路に沿って前記移動可能な堆積ソース(110)の大気ケーシングへ通すように構成される、請求項1から3のいずれか一項に記載の堆積装置。
- 前記移動可能な堆積ソース(110)から前記供給通路(124)を通って延在する前記媒体供給ライン(140)をさらに備え、前記媒体供給ラインが、冷却チャネル、電気接続部、前記移動可能な堆積ソースに電力を供給するケーブル、前記移動可能な堆積ソースに信号を供給するケーブル、センサ信号を導くためのケーブル、ガスチャネル、および水チャネルのうちの少なくとも1つ以上を含む、請求項1から4のいずれか一項に記載の堆積装置。
- 前記供給装置(120)が、剛性の管要素(210)をさらに備え、前記剛性の管要素の内部空間が、前記供給通路を形成する、請求項1から5のいずれか一項に記載の堆積装置。
- 前記剛性の管要素(210)が、前記真空チャンバ(130)の壁の開口部を通って第1の方向(150)に直線的に延在する、請求項6に記載の堆積装置。
- 前記軸方向に偏位可能な要素の第1の端部が、前記真空チャンバ(130)から突き出ている前記剛性の管要素(210)の一部分に密封接続されており、および/または前記軸方向に偏位可能な要素の第2の端部が、前記真空チャンバの前記壁に密封接続されている、請求項7に記載の堆積装置。
- 前記軸方向に偏位可能な要素(122)が、前記剛性の管要素(210)を囲んでおり、前記剛性の管要素の前記内部空間が、大気環境と流体接続しており、前記剛性の管要素と前記軸方向に偏位可能な要素との間の周方向空間が、前記真空チャンバの主空間と流体接続している、請求項6から8のいずれか一項に記載の堆積装置。
- 前記移動可能な堆積ソース(110)を移動させるための駆動ユニットが、前記供給装置(120)の一部分、具体的には、前記真空チャンバから突き出ている剛性の管要素(210)の一部分に結合されている、請求項1から9のいずれか一項に記載の堆積装置。
- 前記剛性の管要素(210)が、前記真空チャンバの外側に配置された前記駆動ユニットの駆動力を前記移動可能な堆積ソースへ並進移動させる並進移動要素として構成される、請求項10に記載の堆積装置。
- 請求項1から11のいずれか一項に記載の堆積装置(100)と、
前記堆積装置の前記真空チャンバに隣接して配置された第2の真空チャンバと、
を備える真空システムであって、
前記堆積装置の前記供給装置(120)が、前記真空チャンバから出て、前記第2の真空チャンバに隣接する空間まで、少なくとも部分的に延在している、
真空システム。 - 堆積装置を動作させる方法であって、
移動可能な堆積ソース(110)を真空チャンバ内で移動させることと、
供給装置(120)の供給通路(124)を通って延在する媒体供給ライン(140)を介して、前記移動可能な堆積ソースに供給することと、
を含み、
前記供給装置が、軸方向に偏位可能な要素(122)を備える、
方法。 - 前記移動可能な堆積ソースが、第1の方向に直線的に移動するとき、前記軸方向に偏位可能な要素(122)が、前記第1の方向に収縮または伸長する、請求項13に記載の方法。
- 前記移動可能な堆積ソース(110)を移動させることが、前記真空チャンバの外側に配置され、前記供給装置の一部分に結合された、具体的には、前記真空チャンバの外側に突き出ている前記供給装置の剛性の管要素(210)に結合された駆動ユニットによって前記移動可能な堆積ソースを駆動することを含む、請求項13または14に記載の方法。
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PCT/EP2017/056382 WO2018166621A1 (en) | 2017-03-17 | 2017-03-17 | Deposition apparatus, vacuum system, and method of operating a deposition apparatus |
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JP2019512044A true JP2019512044A (ja) | 2019-05-09 |
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JP2018513864A Pending JP2019512044A (ja) | 2017-03-17 | 2017-03-17 | 堆積装置、真空システム、及び堆積装置を動作させる方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20200227637A1 (ja) |
JP (1) | JP2019512044A (ja) |
KR (1) | KR20180126437A (ja) |
CN (1) | CN108966658A (ja) |
TW (1) | TW201835979A (ja) |
WO (1) | WO2018166621A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US5338913A (en) * | 1992-12-28 | 1994-08-16 | Tfi Telemark | Electron beam gun with liquid cooled rotatable crucible |
KR20090130559A (ko) * | 2008-06-16 | 2009-12-24 | 삼성모바일디스플레이주식회사 | 이송 장치 및 이를 구비하는 유기물 증착 장치 |
JP5452178B2 (ja) * | 2009-11-12 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | 真空蒸着装置、真空蒸着方法、および、有機el表示装置の製造方法 |
JP2012214834A (ja) * | 2011-03-31 | 2012-11-08 | Hitachi High-Technologies Corp | 真空蒸着装置および有機el表示装置の製造方法 |
CN102877028A (zh) * | 2011-07-13 | 2013-01-16 | 圆益Ips股份有限公司 | 蒸镀装置 |
JP2014095131A (ja) * | 2012-11-09 | 2014-05-22 | Tokyo Electron Ltd | 成膜装置 |
US20170333806A1 (en) * | 2014-11-04 | 2017-11-23 | General Fusion Inc. | System and method for evaporating a metal |
-
2017
- 2017-03-17 US US15/756,550 patent/US20200227637A1/en not_active Abandoned
- 2017-03-17 JP JP2018513864A patent/JP2019512044A/ja active Pending
- 2017-03-17 CN CN201780005861.0A patent/CN108966658A/zh active Pending
- 2017-03-17 WO PCT/EP2017/056382 patent/WO2018166621A1/en active Application Filing
- 2017-03-17 KR KR1020187009065A patent/KR20180126437A/ko active IP Right Grant
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2018
- 2018-03-16 TW TW107109173A patent/TW201835979A/zh unknown
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Publication number | Publication date |
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CN108966658A (zh) | 2018-12-07 |
US20200227637A1 (en) | 2020-07-16 |
KR20180126437A (ko) | 2018-11-27 |
WO2018166621A1 (en) | 2018-09-20 |
TW201835979A (zh) | 2018-10-01 |
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