JP6478920B2 - Icハンドラ - Google Patents
Icハンドラ Download PDFInfo
- Publication number
- JP6478920B2 JP6478920B2 JP2015551317A JP2015551317A JP6478920B2 JP 6478920 B2 JP6478920 B2 JP 6478920B2 JP 2015551317 A JP2015551317 A JP 2015551317A JP 2015551317 A JP2015551317 A JP 2015551317A JP 6478920 B2 JP6478920 B2 JP 6478920B2
- Authority
- JP
- Japan
- Prior art keywords
- socket
- displacement meter
- contact displacement
- handler
- shift plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012360 testing method Methods 0.000 claims description 63
- 238000006073 displacement reaction Methods 0.000 claims description 59
- 238000005259 measurement Methods 0.000 claims description 50
- 238000003860 storage Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 description 26
- 230000032258 transport Effects 0.000 description 6
- 230000002159 abnormal effect Effects 0.000 description 5
- 238000007599 discharging Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Description
10 基台
2 テストヘッド
3 ソケット
3a 載置面
4 ICハンドラ
5 シフトプレート
5a 搬入領域
5b 搬出領域
5c ガイド部材
6 ロボットアーム
61 コンタクトヘッド
62 吸着ノズル
7 変位測定ユニット
71 非接触変位計
72 支持ロッド
73 リンク部材
731 第1延在部
732 第2延在部
74 エアシリンダ
741 シリンダチューブ
742 ピストンロッド
743 作動部材
75 第1継手ピン
76 第2継手ピン
8 制御ユニット
81 記憶部
82 判定部
83 通知部
d 測定距離
d0 基準距離
D ICデバイス
δ 差分
t 閾値
Claims (4)
- ICデバイスが載置される載置面を有するソケットを備えたテストヘッドに前記ICデバイスを搬送するICハンドラであって、
複数のICデバイスを支持して移動するシフトプレートと、
前記シフトプレートに支持されたICデバイスを把持して前記ソケットに装填するロボットアームと、
前記シフトプレートに装着される測定ユニットとを備え、
前記測定ユニットは、
非接触変位計と、
前記非接触変位計を、ICデバイスの装填を実行する前記ロボットアームと干渉しない格納位置と、前記載置面に垂直な方向において前記ソケットから離間する測定位置との間で移動させる移動装置とを備え、
前記非接触変位計は、前記測定位置で前記載置面に向かってビームを発射することによって前記非接触変位計からビーム進行方向に存在する対象物までの距離を測定し、
複数の前記ソケットが第1の方向に沿って前記テストヘッドに配列されており、
前記非接触変位計は、複数の前記ソケットにおける各々の前記載置面に向かってビームを順次発射するように前記第1の方向と平行に移動可能である、ICハンドラ。 - 前記シフトプレートは、前記第1の方向と平行に移動し、
前記非接触変位計は、前記シフトプレートと一緒に前記第1の方向と平行に移動する、請求項1に記載のICハンドラ。 - 前記非接触変位計によって測定された距離に基づいて、前記載置面に2つ以上の前記ICデバイスが重ねて載置される可能性があるかどうかを判定する判定部をさらに備える、請求項1又は2に記載のICハンドラ。
- 前記非接触変位計がレーザビームを発射するレーザ変位計である、請求項1〜3のいずれか1項に記載のICハンドラ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/082483 WO2015083238A1 (ja) | 2013-12-03 | 2013-12-03 | Icハンドラ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015083238A1 JPWO2015083238A1 (ja) | 2017-03-16 |
JP6478920B2 true JP6478920B2 (ja) | 2019-03-06 |
Family
ID=53273035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015551317A Expired - Fee Related JP6478920B2 (ja) | 2013-12-03 | 2013-12-03 | Icハンドラ |
Country Status (6)
Country | Link |
---|---|
US (1) | US10222413B2 (ja) |
JP (1) | JP6478920B2 (ja) |
KR (1) | KR102122325B1 (ja) |
CN (1) | CN105940311B (ja) |
MY (1) | MY190245A (ja) |
WO (1) | WO2015083238A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105992955B (zh) * | 2013-12-03 | 2019-06-18 | 株式会社幸福日本 | Ic处理装置 |
US10527669B2 (en) | 2015-08-31 | 2020-01-07 | Happyjapan, Inc. | IC test system |
JP2019027922A (ja) * | 2017-07-31 | 2019-02-21 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
KR20200121188A (ko) * | 2019-04-15 | 2020-10-23 | 주식회사 아테코 | 핸드 티칭 기능이 구비된 전자부품 테스트 핸들러 및 이를 이용한 핸드 티칭 방법 |
TWI701438B (zh) * | 2019-05-06 | 2020-08-11 | 美商第一檢測有限公司 | 檢測設備 |
TWI700499B (zh) * | 2019-07-17 | 2020-08-01 | 美商第一檢測有限公司 | 晶片測試系統 |
TWI745775B (zh) * | 2019-11-01 | 2021-11-11 | 美商第一檢測有限公司 | 晶片測試裝置及晶片測試系統 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05304200A (ja) | 1992-04-27 | 1993-11-16 | Fujitsu Ltd | Ic装填検出機構 |
JPH0658986A (ja) | 1992-08-07 | 1994-03-04 | Fujitsu Miyagi Electron:Kk | 半導体試験装置 |
JP2534835B2 (ja) * | 1994-07-25 | 1996-09-18 | 九州日本電気株式会社 | Icリ―ド形状検査装置 |
JPH0974128A (ja) * | 1995-09-05 | 1997-03-18 | Hitachi Electron Eng Co Ltd | Icパッケージの真空吸着ハンド |
JP3494828B2 (ja) * | 1996-11-18 | 2004-02-09 | 株式会社アドバンテスト | 水平搬送テストハンドラ |
JPH11281708A (ja) * | 1998-03-26 | 1999-10-15 | Ando Electric Co Ltd | デバイス測定機構 |
JP2002196040A (ja) * | 2000-12-25 | 2002-07-10 | Ando Electric Co Ltd | オートハンドラ及びオートハンドラの制御方法 |
DE112005003666T5 (de) * | 2005-08-11 | 2008-07-10 | Advantest Corp. | Prüfvorrichtung für elektronische Bauelemente |
CN101228449A (zh) * | 2005-08-11 | 2008-07-23 | 株式会社爱德万测试 | 电子部件试验装置 |
US8506231B2 (en) * | 2007-03-16 | 2013-08-13 | Tohoku Seiki Industries, Ltd. | Handler having position correcting function and method of loading uninspected device into measuring socket |
JP2009145153A (ja) | 2007-12-13 | 2009-07-02 | Yamaha Motor Co Ltd | 電子部品試験装置および電子部品試験方法 |
US8542029B1 (en) * | 2009-02-10 | 2013-09-24 | Xilinx, Inc. | Methods and apparatus for testing of integrated circuits |
JP2013145134A (ja) * | 2012-01-13 | 2013-07-25 | Advantest Corp | ハンドラ装置および試験装置 |
-
2013
- 2013-12-03 US US15/101,386 patent/US10222413B2/en active Active
- 2013-12-03 WO PCT/JP2013/082483 patent/WO2015083238A1/ja active Application Filing
- 2013-12-03 MY MYPI2016702032A patent/MY190245A/en unknown
- 2013-12-03 KR KR1020167016902A patent/KR102122325B1/ko active IP Right Grant
- 2013-12-03 CN CN201380081368.9A patent/CN105940311B/zh active Active
- 2013-12-03 JP JP2015551317A patent/JP6478920B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR102122325B1 (ko) | 2020-06-12 |
US10222413B2 (en) | 2019-03-05 |
MY190245A (en) | 2022-04-08 |
CN105940311A (zh) | 2016-09-14 |
KR20160093034A (ko) | 2016-08-05 |
US20160356843A1 (en) | 2016-12-08 |
CN105940311B (zh) | 2020-02-21 |
JPWO2015083238A1 (ja) | 2017-03-16 |
WO2015083238A1 (ja) | 2015-06-11 |
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