JP6789221B2 - Ic試験システム - Google Patents
Ic試験システム Download PDFInfo
- Publication number
- JP6789221B2 JP6789221B2 JP2017537106A JP2017537106A JP6789221B2 JP 6789221 B2 JP6789221 B2 JP 6789221B2 JP 2017537106 A JP2017537106 A JP 2017537106A JP 2017537106 A JP2017537106 A JP 2017537106A JP 6789221 B2 JP6789221 B2 JP 6789221B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- test
- socket
- head
- displacement meter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
- G01R31/287—Procedures; Software aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
10 基台
11 マスターゲージ
2 テストヘッド
3 ソケット
3a 載置面
4 ICハンドラ
5 シフトプレート
5a 搬入領域
5b 搬出領域
6、106 ロボットアーム
61、61a、61b、161 コンタクトヘッド
62、162 吸着ノズル
7 変位測定ユニット
71、71a〜71e、171、171a、171b 非接触変位計
72 支持ロッド
73 上下シリンダ
74 上下プレート
8 制御ユニット
81 記憶部
82 判定部
83 通知部
d、d2 測定距離
d0 基準距離
D ICデバイス
δ 差分
t 閾値
Claims (7)
- ICデバイスを試験するテストヘッドの両側に配置された一対のシフトプレートから前記テストヘッドに前記ICデバイスを搬送するロボットアームを備えるIC試験システムであって、
前記テストヘッドには、前記ICデバイスが載置される載置面を備えたソケットが設けられており、
前記ロボットアームは、前記ICデバイスを搬送する際、前記ICデバイスを把持し、試験の際、前記テストヘッドに前記ICデバイスを押圧するコンタクトヘッドと、前記コンタクトヘッドの移動と連携して移動する非接触変位計と、を備えており、
前記コンタクトヘッドは第1と第2のコンタクトヘッドを有し、該第1と第2のコンタクトヘッドは前記一対のシフトプレートの横並びの方向に間隔をおいて配置されており、
前記非接触変位計は、前記載置面に対し垂直方向の距離を測定するよう前記ロボットアームにおいて、前記一対のシフトプレートの横並びの方向に前記第1と第2のコンタクトヘッドと共に移動するように前記第1と第2のコンタクトヘッドの間に設置されている、IC試験システム。 - 前記非接触変位計は、前記非接触変位計から前記ソケットの前記載置面までの距離を測定するよう前記ロボットアームに設置されている、請求項1に記載のIC試験システム。
- 前記非接触変位計は、前記ロボットアームが前記ICデバイスを搬送している間に、前記非接触変位計から前記ソケットの前記載置面までの距離を測定する、請求項2に記載のIC試験システム。
- 前記コンタクトヘッドは、前記ICデバイスを把持する把持部を備え、
前記非接触変位計は、前記コンタクトヘッドにおいて前記把持部の上方に設置され、前記非接触変位計から前記把持部までの距離を測定する、請求項1に記載のIC試験システム。 - 前記非接触変位計によって測定された距離に基づいて、前記載置面に2つ以上の前記ICデバイスが重ねて載置される可能性があるかどうかを判定する判定部をさらに備える、請求項1に記載のIC試験システム。
- 前記非接触変位計がレーザビームを発射するレーザ変位計である、請求項1に記載のIC試験システム。
- 前記非接触変位計は、前記一対のシフトプレートの横並びの方向に延びる共通のガイド上を移動する前記第1と第2のコンタクトヘッドと共に移動する、請求項1に記載のIC試験システム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/074755 WO2017037844A1 (ja) | 2015-08-31 | 2015-08-31 | Ic試験システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017037844A1 JPWO2017037844A1 (ja) | 2018-06-14 |
JP6789221B2 true JP6789221B2 (ja) | 2020-11-25 |
Family
ID=58188789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017537106A Active JP6789221B2 (ja) | 2015-08-31 | 2015-08-31 | Ic試験システム |
Country Status (7)
Country | Link |
---|---|
US (1) | US10527669B2 (ja) |
EP (1) | EP3346280B8 (ja) |
JP (1) | JP6789221B2 (ja) |
KR (1) | KR20180035856A (ja) |
CN (1) | CN108450015B (ja) |
SG (1) | SG11201801519PA (ja) |
WO (1) | WO2017037844A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106950490B (zh) * | 2017-05-05 | 2019-05-10 | 福州派利德电子科技有限公司 | 下压式ic芯片检测机构 |
TWI676031B (zh) * | 2018-09-06 | 2019-11-01 | 致茂電子股份有限公司 | 滑移式電子元件測試裝置 |
KR20200121188A (ko) * | 2019-04-15 | 2020-10-23 | 주식회사 아테코 | 핸드 티칭 기능이 구비된 전자부품 테스트 핸들러 및 이를 이용한 핸드 티칭 방법 |
JP7362507B2 (ja) | 2020-02-25 | 2023-10-17 | 株式会社Nsテクノロジーズ | 電子部品搬送装置、電子部品検査装置およびポケット位置検出方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0658986A (ja) | 1992-08-07 | 1994-03-04 | Fujitsu Miyagi Electron:Kk | 半導体試験装置 |
JPH0974128A (ja) * | 1995-09-05 | 1997-03-18 | Hitachi Electron Eng Co Ltd | Icパッケージの真空吸着ハンド |
JPH1068759A (ja) * | 1996-05-31 | 1998-03-10 | Advantest Corp | 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法 |
KR100351052B1 (ko) * | 2000-03-30 | 2002-09-05 | 삼성전자 주식회사 | 패키지 가이더가 있는 반도체 패키지 가공용 로더 및 그사용방법 |
JP4327335B2 (ja) * | 2000-06-23 | 2009-09-09 | 株式会社アドバンテスト | コンタクトアームおよびこれを用いた電子部品試験装置 |
JP2003344483A (ja) * | 2002-05-31 | 2003-12-03 | Fujitsu Ltd | ハンドリング装置およびこれを使用した試験装置 |
CN1319215C (zh) * | 2003-07-18 | 2007-05-30 | 威盛电子股份有限公司 | 电子元件测试插置座的移动限位件 |
KR100861006B1 (ko) * | 2007-02-28 | 2008-09-30 | (주)테크윙 | 테스트핸들러용 테스트트레이 이송장치 |
JP2008243861A (ja) * | 2007-03-23 | 2008-10-09 | Tokyo Electron Ltd | 検査装置及び検査方法 |
KR100857603B1 (ko) * | 2007-03-29 | 2008-09-09 | 삼성전자주식회사 | 전자부품 검사 시스템 및 그 제어방법 |
TWI342950B (en) * | 2007-08-17 | 2011-06-01 | Hon Tech Inc | Testing means for use in loading fixture of elements |
JP2009145153A (ja) | 2007-12-13 | 2009-07-02 | Yamaha Motor Co Ltd | 電子部品試験装置および電子部品試験方法 |
CN101567327B (zh) * | 2008-04-23 | 2010-09-08 | 中茂电子(深圳)有限公司 | 裸晶测试机台用缓冲分类装置及该机台 |
US8542029B1 (en) * | 2009-02-10 | 2013-09-24 | Xilinx, Inc. | Methods and apparatus for testing of integrated circuits |
JP5436460B2 (ja) | 2009-02-12 | 2014-03-05 | 三菱電機株式会社 | 産業用ロボットシステム |
CN201820770U (zh) * | 2010-06-08 | 2011-05-04 | 致茂电子(苏州)有限公司 | 一种用于太阳能硅芯片检测机台的缓冲输送检测装置 |
JP5212520B2 (ja) * | 2011-06-23 | 2013-06-19 | セイコーエプソン株式会社 | 電子部品ハンドラ及びハンドラ |
JP2013053991A (ja) | 2011-09-06 | 2013-03-21 | Seiko Epson Corp | ハンドラー及び部品検査装置 |
CN203546850U (zh) * | 2013-09-25 | 2014-04-16 | 李飞宇 | 一种进水阀、排水阀失效和马桶堵塞的自动保护装置 |
MY190245A (en) * | 2013-12-03 | 2022-04-08 | Happyjapan Inc | Ic handler |
TWI494576B (zh) | 2013-12-03 | 2015-08-01 | Tohoku Seiki Ind Co Ltd | IC processor |
-
2015
- 2015-08-31 WO PCT/JP2015/074755 patent/WO2017037844A1/ja active Application Filing
- 2015-08-31 CN CN201580082746.4A patent/CN108450015B/zh active Active
- 2015-08-31 SG SG11201801519PA patent/SG11201801519PA/en unknown
- 2015-08-31 KR KR1020187005783A patent/KR20180035856A/ko not_active Application Discontinuation
- 2015-08-31 JP JP2017537106A patent/JP6789221B2/ja active Active
- 2015-08-31 US US15/756,435 patent/US10527669B2/en active Active
- 2015-08-31 EP EP15902966.9A patent/EP3346280B8/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3346280B8 (en) | 2021-12-29 |
EP3346280B1 (en) | 2021-08-18 |
SG11201801519PA (en) | 2018-03-28 |
EP3346280A1 (en) | 2018-07-11 |
WO2017037844A1 (ja) | 2017-03-09 |
JPWO2017037844A1 (ja) | 2018-06-14 |
EP3346280A4 (en) | 2019-05-08 |
CN108450015B (zh) | 2021-07-02 |
US20180267097A1 (en) | 2018-09-20 |
KR20180035856A (ko) | 2018-04-06 |
CN108450015A (zh) | 2018-08-24 |
US10527669B2 (en) | 2020-01-07 |
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