JP6476196B2 - メンテナンス案内システム及びメンテナンス案内方法 - Google Patents
メンテナンス案内システム及びメンテナンス案内方法 Download PDFInfo
- Publication number
- JP6476196B2 JP6476196B2 JP2016549868A JP2016549868A JP6476196B2 JP 6476196 B2 JP6476196 B2 JP 6476196B2 JP 2016549868 A JP2016549868 A JP 2016549868A JP 2016549868 A JP2016549868 A JP 2016549868A JP 6476196 B2 JP6476196 B2 JP 6476196B2
- Authority
- JP
- Japan
- Prior art keywords
- maintenance
- variation state
- component
- determination criterion
- determined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012423 maintenance Methods 0.000 title claims description 148
- 238000000034 method Methods 0.000 title claims description 38
- 230000008569 process Effects 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 238000012545 processing Methods 0.000 claims description 9
- 238000001179 sorption measurement Methods 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/0895—Maintenance systems or processes, e.g. indicating need for maintenance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2014/075674 WO2016046967A1 (fr) | 2014-09-26 | 2014-09-26 | Système de notification de maintenance et procédé de notification de maintenance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2016046967A1 JPWO2016046967A1 (ja) | 2017-07-06 |
| JP6476196B2 true JP6476196B2 (ja) | 2019-02-27 |
Family
ID=55580526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016549868A Active JP6476196B2 (ja) | 2014-09-26 | 2014-09-26 | メンテナンス案内システム及びメンテナンス案内方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6476196B2 (fr) |
| WO (1) | WO2016046967A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7008173B2 (ja) * | 2017-07-18 | 2022-01-25 | パナソニックＩｐマネジメント株式会社 | 設備要素保守分析システムおよび設備要素保守分析方法 |
| US11330748B2 (en) | 2017-09-22 | 2022-05-10 | Fuji Corporation | Electronic component mounting method and electronic component mounting machine |
| CN111788882B (zh) * | 2018-02-27 | 2021-11-09 | 松下知识产权经营株式会社 | 管理装置、管理方法以及部件安装系统 |
| JP7245982B2 (ja) * | 2021-12-16 | 2023-03-27 | パナソニックＩｐマネジメント株式会社 | 設備要素保守分析システムおよび設備要素保守分析方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110288A (ja) * | 2001-07-23 | 2003-04-11 | Fuji Mach Mfg Co Ltd | 対回路基板作業システムおよび電子回路製造方法 |
| JP2007194252A (ja) * | 2006-01-17 | 2007-08-02 | Yamaha Motor Co Ltd | 実装システム |
| JP5215746B2 (ja) * | 2008-06-17 | 2013-06-19 | ヤマハ発動機株式会社 | フィーダー診断方法、フィーダー診断システムおよびトルク負荷発生装置 |
| JP5807157B2 (ja) * | 2011-11-01 | 2015-11-10 | パナソニックＩｐマネジメント株式会社 | 電子部品実装装置におけるメンテナンスの要否判定装置およびメンテナンスの要否判定方法 |
-
2014
- 2014-09-26 JP JP2016549868A patent/JP6476196B2/ja active Active
- 2014-09-26 WO PCT/JP2014/075674 patent/WO2016046967A1/fr active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016046967A1 (fr) | 2016-03-31 |
| JPWO2016046967A1 (ja) | 2017-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6476196B2 (ja) | メンテナンス案内システム及びメンテナンス案内方法 | |
| JP6522670B2 (ja) | 装着作業機 | |
| JP6835878B2 (ja) | 生産管理装置 | |
| US9167701B2 (en) | Method of mounting electronic component | |
| JPWO2017085865A1 (ja) | 部品実装機の制御装置 | |
| JP6412125B2 (ja) | 部品装着機 | |
| JP2005101586A (ja) | 電子部品実装機における電子部品の吸着位置補正装置 | |
| JP2009238873A (ja) | 部品実装方法 | |
| JP2013004703A (ja) | 電子部品実装装置 | |
| US10959361B2 (en) | Substrate working machine | |
| JP6139948B2 (ja) | 部品実装装置 | |
| WO2017212566A1 (fr) | Système de montage de composants | |
| JP6734465B2 (ja) | 部品実装機 | |
| JP2011134812A (ja) | 電子部品の装着方法及びその装着装置 | |
| JP4757963B2 (ja) | 電子部品装着装置 | |
| JP5533534B2 (ja) | 部品実装用装置および部品実装用装置における位置決め制御方法 | |
| JP4228868B2 (ja) | 電子部品実装方法 | |
| JP6866250B2 (ja) | 決定装置、決定方法、表面実装機 | |
| JP5096385B2 (ja) | 電子部品装着装置 | |
| JP7269028B2 (ja) | 決定装置 | |
| JP4405848B2 (ja) | 電子部品装着方法及び電子部品装着装置 | |
| JP6760790B2 (ja) | 表面実装機 | |
| JP6695234B2 (ja) | 装着作業機 | |
| JP5970401B2 (ja) | 実装作業装置におけるモータ制御方法及び実装作業装置 | |
| JP2014007303A (ja) | 電子部品装着装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170821 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180711 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180823 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190123 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190204 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6476196 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |