JP6470186B2 - エポキシ樹脂組成物、その硬化物、および半導体装置 - Google Patents

エポキシ樹脂組成物、その硬化物、および半導体装置 Download PDF

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Publication number
JP6470186B2
JP6470186B2 JP2015561026A JP2015561026A JP6470186B2 JP 6470186 B2 JP6470186 B2 JP 6470186B2 JP 2015561026 A JP2015561026 A JP 2015561026A JP 2015561026 A JP2015561026 A JP 2015561026A JP 6470186 B2 JP6470186 B2 JP 6470186B2
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Japan
Prior art keywords
epoxy resin
resin composition
epoxy
parts
present
Prior art date
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JP2015561026A
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English (en)
Japanese (ja)
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JPWO2015119195A1 (ja
Inventor
政隆 中西
政隆 中西
一真 井上
一真 井上
川野　裕介
裕介 川野
田中　栄一
栄一 田中
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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Publication of JPWO2015119195A1 publication Critical patent/JPWO2015119195A1/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2015561026A 2014-02-07 2015-02-05 エポキシ樹脂組成物、その硬化物、および半導体装置 Active JP6470186B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014021880 2014-02-07
JP2014021880 2014-02-07
PCT/JP2015/053236 WO2015119195A1 (ja) 2014-02-07 2015-02-05 エポキシ樹脂組成物、その硬化物、および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2015119195A1 JPWO2015119195A1 (ja) 2017-03-23
JP6470186B2 true JP6470186B2 (ja) 2019-02-13

Family

ID=53777996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015561026A Active JP6470186B2 (ja) 2014-02-07 2015-02-05 エポキシ樹脂組成物、その硬化物、および半導体装置

Country Status (5)

Country Link
JP (1) JP6470186B2 (ko)
KR (1) KR20160119750A (ko)
CN (1) CN105829386B (ko)
TW (1) TWI651359B (ko)
WO (1) WO2015119195A1 (ko)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2663103B2 (ja) * 1994-02-09 1997-10-15 旭チバ株式会社 ノボラック樹脂のグリシジルエーテルの製造法
US6043333A (en) * 1996-08-23 2000-03-28 Nippon Kayaku Kabushiki Kaisha Modified epoxy resin, epoxy resin composition and cured product thereof
JP5379066B2 (ja) * 2010-04-23 2013-12-25 パナソニック株式会社 半導体封止用エポキシ樹脂組成物
JP6102112B2 (ja) * 2012-07-30 2017-03-29 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置

Also Published As

Publication number Publication date
TW201538613A (zh) 2015-10-16
JPWO2015119195A1 (ja) 2017-03-23
WO2015119195A1 (ja) 2015-08-13
KR20160119750A (ko) 2016-10-14
TWI651359B (zh) 2019-02-21
CN105829386B (zh) 2019-05-03
CN105829386A (zh) 2016-08-03

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