JP6463303B2 - 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 - Google Patents
弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 Download PDFInfo
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- JP6463303B2 JP6463303B2 JP2016134881A JP2016134881A JP6463303B2 JP 6463303 B2 JP6463303 B2 JP 6463303B2 JP 2016134881 A JP2016134881 A JP 2016134881A JP 2016134881 A JP2016134881 A JP 2016134881A JP 6463303 B2 JP6463303 B2 JP 6463303B2
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- 238000001179 sorption measurement Methods 0.000 title claims description 67
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- 238000012544 monitoring process Methods 0.000 description 3
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- 230000000295 complement effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG10202100910UA SG10202100910UA (en) | 2015-08-18 | 2016-07-27 | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control m |
| SG10202002713PA SG10202002713PA (en) | 2015-08-18 | 2016-07-27 | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
| SG10201606197XA SG10201606197XA (en) | 2015-08-18 | 2016-07-27 | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
| TW105124413A TWI724010B (zh) | 2015-08-18 | 2016-08-02 | 基板吸著方法、基板保持裝置、基板研磨裝置、彈性膜、基板保持裝置之基板吸著判定方法及壓力控制方法 |
| TW110108232A TWI785525B (zh) | 2015-08-18 | 2016-08-02 | 基板吸著方法、基板保持裝置、基板研磨裝置、彈性膜、基板保持裝置之基板吸著判定方法及壓力控制方法 |
| KR1020160102483A KR102134726B1 (ko) | 2015-08-18 | 2016-08-11 | 기판 흡착 방법, 기판 보유 지지 장치, 기판 연마 장치, 기판 보유 지지 장치에 있어서의 기판 흡착 판정 방법 및 압력 제어 방법 |
| US15/234,058 US10537975B2 (en) | 2015-08-18 | 2016-08-11 | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
| CN201610688808.2A CN106466806B (zh) | 2015-08-18 | 2016-08-18 | 基板的吸附方法及研磨装置、基板保持装置及其基板吸附判定方法与压力控制方法 |
| CN202010673067.7A CN111775043B (zh) | 2015-08-18 | 2016-08-18 | 基板保持装置及弹性膜 |
| US16/695,637 US11472000B2 (en) | 2015-08-18 | 2019-11-26 | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
| KR1020200084573A KR102178517B1 (ko) | 2015-08-18 | 2020-07-09 | 기판 보유 지지 장치 및 탄성막 |
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| JP2016097291 | 2016-05-13 | ||
| JP2016097291 | 2016-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2018246532A Division JP6633175B2 (ja) | 2016-05-13 | 2018-12-28 | 基板保持装置及び弾性膜 |
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| Publication Number | Publication Date |
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| JP2017205853A JP2017205853A (ja) | 2017-11-24 |
| JP2017205853A5 JP2017205853A5 (enrdf_load_stackoverflow) | 2018-04-26 |
| JP6463303B2 true JP6463303B2 (ja) | 2019-01-30 |
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| JP2016134881A Active JP6463303B2 (ja) | 2015-08-18 | 2016-07-07 | 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 |
| JP2018246532A Active JP6633175B2 (ja) | 2016-05-13 | 2018-12-28 | 基板保持装置及び弾性膜 |
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| JP2018246532A Active JP6633175B2 (ja) | 2016-05-13 | 2018-12-28 | 基板保持装置及び弾性膜 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019072841A (ja) * | 2016-05-13 | 2019-05-16 | 株式会社荏原製作所 | 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 |
| US10537975B2 (en) | 2015-08-18 | 2020-01-21 | Ebara Corporation | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7075814B2 (ja) * | 2018-05-21 | 2022-05-26 | 株式会社荏原製作所 | 基板保持装置、基板研磨装置、弾性部材および基板保持装置の製造方法 |
| JP7117933B2 (ja) * | 2018-08-06 | 2022-08-15 | 株式会社荏原製作所 | 基板保持装置および基板研磨装置 |
| KR102712571B1 (ko) * | 2018-08-06 | 2024-10-04 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 보유 지지 장치 및 기판 연마 장치 |
| US12030156B2 (en) | 2020-06-24 | 2024-07-09 | Applied Materials, Inc. | Polishing carrier head with piezoelectric pressure control |
| KR102735236B1 (ko) * | 2020-06-29 | 2024-11-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 다수의 각도적 가압 가능한 구역들을 갖는 연마 캐리어 헤드 |
| CN116711052A (zh) * | 2021-02-10 | 2023-09-05 | 雅马哈发动机株式会社 | 加工装置 |
| JP7607389B2 (ja) * | 2022-06-02 | 2024-12-27 | ミクロ技研株式会社 | 研磨ヘッド及び研磨処理装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3705670B2 (ja) * | 1997-02-19 | 2005-10-12 | 株式会社荏原製作所 | ポリッシング装置及び方法 |
| JP2000015572A (ja) * | 1998-04-29 | 2000-01-18 | Speedfam Co Ltd | キャリア及び研磨装置 |
| JP2000033558A (ja) * | 1998-07-21 | 2000-02-02 | Speedfam-Ipec Co Ltd | キャリア及び研磨装置 |
| US5961169A (en) * | 1998-07-27 | 1999-10-05 | Strasbaugh | Apparatus for sensing the presence of a wafer |
| JP4097356B2 (ja) * | 1999-05-07 | 2008-06-11 | 東京エレクトロン株式会社 | 平面板チャック台、平面板研磨装置及び平面板研磨方法 |
| JP3816297B2 (ja) * | 2000-04-25 | 2006-08-30 | 株式会社荏原製作所 | 研磨装置 |
| US6857945B1 (en) * | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
| JP2002187060A (ja) * | 2000-10-11 | 2002-07-02 | Ebara Corp | 基板保持装置、ポリッシング装置、及び研磨方法 |
| US6923711B2 (en) * | 2000-10-17 | 2005-08-02 | Speedfam-Ipec Corporation | Multizone carrier with process monitoring system for chemical-mechanical planarization tool |
| US6568991B2 (en) * | 2001-08-28 | 2003-05-27 | Speedfam-Ipec Corporation | Method and apparatus for sensing a wafer in a carrier |
| JP4049579B2 (ja) * | 2001-12-12 | 2008-02-20 | 株式会社荏原製作所 | 基板保持装置及びポリッシング装置 |
| JP4505822B2 (ja) * | 2003-04-24 | 2010-07-21 | 株式会社ニコン | 研磨装置、研磨方法及び研磨装置を用いたデバイス製造方法 |
| JP4718107B2 (ja) * | 2003-05-20 | 2011-07-06 | 株式会社荏原製作所 | 基板保持装置及び研磨装置 |
| JP4108023B2 (ja) * | 2003-09-09 | 2008-06-25 | 株式会社荏原製作所 | 圧力コントロールシステム及び研磨装置 |
| JP2008137103A (ja) * | 2006-11-30 | 2008-06-19 | Ebara Corp | 基板保持装置、基板研磨装置、及び基板研磨方法 |
| JP2009117655A (ja) * | 2007-11-07 | 2009-05-28 | Tokyo Seimitsu Co Ltd | ウェーハ処理装置及びウェーハ処理方法 |
| JP5597033B2 (ja) * | 2010-06-07 | 2014-10-01 | 株式会社荏原製作所 | 研磨装置および方法 |
| JP5964064B2 (ja) * | 2012-01-31 | 2016-08-03 | 株式会社荏原製作所 | 基板保持装置、研磨装置、および研磨方法 |
| JP5875950B2 (ja) * | 2012-06-29 | 2016-03-02 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
| JP5856546B2 (ja) * | 2012-07-11 | 2016-02-09 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| JP5973841B2 (ja) * | 2012-08-22 | 2016-08-23 | 日本特殊陶業株式会社 | 静電チャックのガス制御装置およびガス制御方法 |
| JP6158637B2 (ja) * | 2012-08-28 | 2017-07-05 | 株式会社荏原製作所 | 弾性膜及び基板保持装置 |
| JP6092086B2 (ja) * | 2013-12-02 | 2017-03-08 | 株式会社荏原製作所 | 研磨装置 |
| JP6353418B2 (ja) * | 2015-08-18 | 2018-07-04 | 株式会社荏原製作所 | 基板吸着方法、トップリングおよび基板研磨装置 |
| JP6463303B2 (ja) * | 2016-05-13 | 2019-01-30 | 株式会社荏原製作所 | 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 |
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2016
- 2016-07-07 JP JP2016134881A patent/JP6463303B2/ja active Active
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- 2018-12-28 JP JP2018246532A patent/JP6633175B2/ja active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10537975B2 (en) | 2015-08-18 | 2020-01-21 | Ebara Corporation | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
| US11472000B2 (en) | 2015-08-18 | 2022-10-18 | Ebara Corporation | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
| JP2019072841A (ja) * | 2016-05-13 | 2019-05-16 | 株式会社荏原製作所 | 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 |
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| Publication number | Publication date |
|---|---|
| JP2019072841A (ja) | 2019-05-16 |
| JP6633175B2 (ja) | 2020-01-22 |
| JP2017205853A (ja) | 2017-11-24 |
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